Synchronous DRAM Module, 32MX72, 0.7ns, CMOS, DIMM-184
参数名称 | 属性值 |
厂商名称 | SAMSUNG(三星) |
零件包装代码 | DIMM |
包装说明 | DIMM, |
针数 | 184 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
访问模式 | FOUR BANK PAGE BURST |
最长访问时间 | 0.7 ns |
其他特性 | AUTO/SELF REFRESH |
JESD-30 代码 | R-XDMA-N184 |
内存密度 | 2415919104 bit |
内存集成电路类型 | SYNCHRONOUS DRAM MODULE |
内存宽度 | 72 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 184 |
字数 | 33554432 words |
字数代码 | 32000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 32MX72 |
封装主体材料 | UNSPECIFIED |
封装代码 | DIMM |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified |
自我刷新 | YES |
最大供电电压 (Vsup) | 2.7 V |
最小供电电压 (Vsup) | 2.3 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | NO LEAD |
端子位置 | DUAL |
Base Number Matches | 1 |
M381L3223CT1-LB3 | M381L3223CT1-LA0 | M381L3223CT1-LB0 | M381L3223CT1-CA0 | M381L3223CT1-CB0 | M381L3223CT1-CB3 | M381L3223CT1-CA2 | M381L3223CT1-LA2 | |
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描述 | Synchronous DRAM Module, 32MX72, 0.7ns, CMOS, DIMM-184 | Synchronous DRAM Module, 32MX72, 0.8ns, CMOS, DIMM-184 | Synchronous DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184 | Synchronous DRAM Module, 32MX72, 0.8ns, CMOS, DIMM-184 | Synchronous DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184 | Synchronous DRAM Module, 32MX72, 0.7ns, CMOS, DIMM-184 | Synchronous DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184 | Synchronous DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184 |
零件包装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
包装说明 | DIMM, | DIMM, | DIMM, | DIMM, DIMM184 | DIMM, DIMM184 | DIMM, DIMM184 | DIMM, DIMM184 | DIMM, |
针数 | 184 | 184 | 184 | 184 | 184 | 184 | 184 | 184 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
最长访问时间 | 0.7 ns | 0.8 ns | 0.75 ns | 0.8 ns | 0.75 ns | 0.7 ns | 0.75 ns | 0.75 ns |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 代码 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 |
内存密度 | 2415919104 bit | 2415919104 bit | 2415919104 bit | 2415919104 bit | 2415919104 bit | 2415919104 bit | 2415919104 bit | 2415919104 bit |
内存集成电路类型 | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
内存宽度 | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 184 | 184 | 184 | 184 | 184 | 184 | 184 | 184 |
字数 | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words |
字数代码 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 32MX72 | 32MX72 | 32MX72 | 32MX72 | 32MX72 | 32MX72 | 32MX72 | 32MX72 |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
自我刷新 | YES | YES | YES | YES | YES | YES | YES | YES |
最大供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | - | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
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