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MAX176BMLP/883B

产品描述ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial Access, CMOS, CQCC20, CERAMIC, LCC-20
产品类别模拟混合信号IC    转换器   
文件大小29KB,共4页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
下载文档 详细参数 选型对比 全文预览

MAX176BMLP/883B概述

ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial Access, CMOS, CQCC20, CERAMIC, LCC-20

MAX176BMLP/883B规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Maxim(美信半导体)
零件包装代码QLCC
包装说明QCCN, LCC20,.35SQ
针数20
Reach Compliance Codenot_compliant
ECCN代码3A001.A.2.C
最大模拟输入电压5 V
最小模拟输入电压-5 V
转换器类型ADC, SUCCESSIVE APPROXIMATION
JESD-30 代码S-CQCC-N20
JESD-609代码e4
长度8.89 mm
湿度敏感等级1
标称负供电电压-15 V
模拟输入通道数量1
位数12
功能数量1
端子数量20
最高工作温度125 °C
最低工作温度-55 °C
输出位码BINARY
输出格式SERIAL
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码QCCN
封装等效代码LCC20,.35SQ
封装形状SQUARE
封装形式CHIP CARRIER
峰值回流温度(摄氏度)245
电源5,-12/-15 V
认证状态Not Qualified
采样速率0.25 MHz
采样并保持/跟踪并保持TRACK
筛选级别MIL-STD-883 Class B
座面最大高度2.54 mm
标称供电电压5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层GOLD OVER NICKEL
端子形式NO LEAD
端子节距1.27 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度8.89 mm
Base Number Matches1

文档预览

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SCOPE:
Serial-Output, 250 ksps 12-Bit ADC with Track/Hold and Reference
Generic Number
MAX176AM(x)/883B
MAX176BM(x)/883B
Device Type
01
02
Case Outline(s).
The case outlines shall be designated in Mil-Std-1835 and as follows:
Outline Letter
Mil-Std-1835
JA
GDIP1-T8 or CDIP2-T8
LP
CQCC1-N20
Case Outline
Package Code
8 LEAD CERDIP
J08
20-Pin LCC
L20
Absolute Maximum Ratings
V
DD
to GND ................................................................................................... -0.3V to +7V
V
SS
to GND .................................................................................................. +0.3V to -17V
AIN to GND ...............................................................................................................
±15V
Digital Input Voltage to GND .......................................................... -0.3V to (V
DD
+0.3V)
Digital Output Voltage to GND ....................................................... -0.3V to (V
DD
+0.3V)
Lead Temperature (soldering, 10 seconds) ................................................................. +300°C
Storage Temperature .................................................................................... -65°C to +160°C
Continuous Power Dissipation .............................................................................. T
A
=+70°C
8 pin CERDIP(derate 8.0mW/°C above +70°C) ......................................................... 640mW
20 pin LCC(derate 9.1mW/°C above +70°C) ............................................................. 727mW
Junction Temperature T
J
......................................................................................…. +150°C
Thermal Resistance, Junction to Case,
ΘJC
8 pin CERDIP..................................................................................................….. 55°C/W
20 pin LCC ......................................................................................................…. 20°C/W
Thermal Resistance, Junction to Ambient,
ΘJA:
8 pin CERDIP.................................................................................................…. 125°C/W
20 pin LCC .....................................................................................................…. 110°C/W
Recommended Operating Conditions
Ambient Operating Range (T
A
) .........................................................……. -55°C to
+125°C
Supply Voltage (V
CC
)........................................................................…….. +4.75V to +5.25V
Supply Voltage (V
EE
).........................................................................……. -11.4V to -15.75V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
----------------------------
Electrical Characteristics of MAX176/883B
19-0293
Page 2 of
Rev. B
6

MAX176BMLP/883B相似产品对比

MAX176BMLP/883B MAX176BMJA/883B
描述 ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial Access, CMOS, CQCC20, CERAMIC, LCC-20 ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial Access, CMOS, CDIP8, CERDIP-8
是否无铅 含铅 含铅
是否Rohs认证 不符合 不符合
厂商名称 Maxim(美信半导体) Maxim(美信半导体)
零件包装代码 QLCC DIP
包装说明 QCCN, LCC20,.35SQ CERDIP-8
针数 20 8
Reach Compliance Code not_compliant not_compliant
ECCN代码 3A001.A.2.C 3A001.A.2.C
最大模拟输入电压 5 V 5 V
最小模拟输入电压 -5 V -5 V
转换器类型 ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION
JESD-30 代码 S-CQCC-N20 R-GDIP-T8
JESD-609代码 e4 e0
长度 8.89 mm 10.29 mm
湿度敏感等级 1 1
标称负供电电压 -15 V -15 V
模拟输入通道数量 1 1
位数 12 12
功能数量 1 1
端子数量 20 8
最高工作温度 125 °C 125 °C
最低工作温度 -55 °C -55 °C
输出位码 BINARY BINARY
输出格式 SERIAL SERIAL
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
封装代码 QCCN DIP
封装等效代码 LCC20,.35SQ DIP8,.3
封装形状 SQUARE RECTANGULAR
封装形式 CHIP CARRIER IN-LINE
峰值回流温度(摄氏度) 245 245
电源 5,-12/-15 V 5,-12/-15 V
认证状态 Not Qualified Not Qualified
采样速率 0.25 MHz 0.25 MHz
采样并保持/跟踪并保持 TRACK TRACK
筛选级别 MIL-STD-883 Class B MIL-STD-883 Class B
座面最大高度 2.54 mm 5.08 mm
标称供电电压 5 V 5 V
表面贴装 YES NO
技术 CMOS CMOS
温度等级 MILITARY MILITARY
端子面层 GOLD OVER NICKEL TIN LEAD
端子形式 NO LEAD THROUGH-HOLE
端子节距 1.27 mm 2.54 mm
端子位置 QUAD DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
宽度 8.89 mm 7.62 mm
Base Number Matches 1 1
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