Q-TECH
CORPORATION
Ultra
3
Space OCXO
Ultra Miniature, Ultra Rugged, Ultra Stable
QT4200 Series - 5.0Vdc, 12Vdc or 15Vdc Space Qualified OCXO
Small size High Stability Oven Controlled Crystal Oscillator
(OCXO) is a high reliability signal generator that provides Sine
wave or HCMOS output. The OCXO is designed to be used in
Aerospace applications.
Description
It is designed to withstand radiation level up to 100kRad (*)
(total dose), high shock and vibration. The OCXO has very low
phase noise. Low G-Sensitivity SC-Cut Crystal utilized in the
design guarantees 1PPB/G or better. The reliable construction
of this design qualifies it for stringent environmental
applications.
(*) Please contact factory for higher level of radiation
hardness.
Features
•
•
•
•
•
•
•
•
Ordering Information
Q T 4
2
0
7
• Made in the USA
QT 42 0 7S NM - 6 0. 0 0 0M H z
(Sample part number)
Supply voltages 5.0Vdc to 15Vdc
Wide temperature range (-40ºC to +75ºC)
SC-Cut crystal
Low phase noise and jitter
Choice of output power and load
Radiation Hardened
Custom design available tailored to meet customer’s needs
Ruggedized to withstand ultra high shock and vibration.
Applications
Supply Voltage:
5 = +5.0V
6 = +12.0V
7 = +15.0V
Logic:
C = HCMOS
S = Sine Wave
Outpuy Power:
0 = +0 dBm
1 = +1 dBm
2 = +2 dBm
3 = +3 dBm
4 = +4 dBm
5 = +5 dBm
6 = +6 dBm
7 = +7 dBm
8 = +8 dBm
9 = +9 dBm
S N M - 60.000MHz
Output Frequency
Screening Option:
Blank = EM
M = Per MIL-PRF-55310, Level S
G
H
L
N
Frequency vs. Temperature Code:
= ± 100PPB at -20ºC to +70ºC
= ± 10PPB at -20ºC to +70ºC
= ± 200PPB at -40ºC to +75ºC
= ± 20PPB at -40ºC to +75ºC
• Control and measurement
• Signal processing
• Designed to meet today’s requirements for Space Grade
applications
For Non-Standard requirements, contact Q-Tech Corporation at
Sales@Q-Tech.com
Packaging Options
• Standard ESD packaging
Other Options Available For An Additional Charge
• Phase Noise test (Static and under vibration)
• Jitter test
Specifications subject to change without prior notice.
QPDS-0106 Rev.-, November 2014
Q-TECH Corporation - 10150 W. Jefferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-t ec h.com
1 of 6
Q-TECH
CORPORATION
Ultra
3
Space OCXO
Ultra Miniature, Ultra Rugged, Ultra Stable
QT4200 Series - 5.0Vdc, 12Vdc or 15Vdc Space Qualified OCXO
Package Outline -
Dimensions are in inches
1.00
2X 0.04
2.00
PART MARKING
RF OUT
0.50
2X 0.25
0.75
0.38
A
Mounting surface
B
4X 4-40 UNC-2B
0.16
+12 V
GND
0.28 3
0.48 3
Ø 0.005 M A B C
1.700
0.45
C
0.150
0.150
0.700
• Package Material: Kovar
• Weight: 100g typical
• Package Finish: 50 micro Inches Gold over nickel plate
• MSSS Connector: Body / Pin Material; KOV
AR, MIL-I-23011 ASTM-F15
Dimensions
Body / Pin Finish; Gold Plate, MIL-G-45204, Type 3, Grade A,
40-80 Microinches over Type 1, Grade C, CLASS 1
Insulators; Glass, Corning #7070 or Equivalent
• Power Connectors: Gold Plated per MIL-G-45204C, Class 00
Package Information
Q-TECH Corporation - 10150 W. Jefferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-t ec h.com
QPDS-0106 Rev.-, November 2014
2 of 6
Q-TECH
CORPORATION
Ultra
3
Space OCXO
Ultra Miniature, Ultra Rugged, Ultra Stable
QT4200 Series - 5.0Vdc, 12Vdc or 15Vdc Space Qualified OCXO
Electrical Characteristics
Output Frequency Range (Fo)
Supply Voltage (Vdd)
Initial Tolerance
Temperature Range
Frequency Stability vs. Temperature
Frequency Stability vs. V
oltage V
ariation
Frequency Stability vs. Load V
ariation
Warm-up Power max.
Steady State Power max.
Warm-up Time
Output Waveform
Output Power (See note 1)
Output Power Stability (See note 2)
Duty Cycle
Output Load
Harmonics
Spurious (See note 3)
Aging
G-Sensitivity max.
Parameters
Conditions
±5.0%
@+25ºC
Over Temperature Range
±5.0% Load Variation
@-40ºC
@+25ºC
@+25ºC to ±100PPB (2 hours ref.)
Over Temperature Range
Over Temperature Range
Over Temperature Range
Over Temperature Range
Per Day
15 years
10Hz
100Hz
1kHz
10kHz
100kHz
1MHz — 125MHz
+5Vdc, +12Vdc or +15Vdc
±0.2ppm
See Option Codes
See Option Codes
±10PPB
±20PPB
4.8W
2.7W
Sine Wave
See Option Codes
±1dBm
50Ω
-35dBc
-90dBc
10 min.
HCMOS
50%±5.0%
10kΩ//15pF
Requirements
Phase Noise for 80MHz OCXO (typ.)
1PPB
1.5PPM
1PPB/G
-95dBc/Hz
-125dBc/Hz
-148dBc/Hz
-160dBc/Hz
-160dBc/Hz
Other Design and Test Options
• Phase Noise and Jitter built to specification
including static and vibration.
• Low supply current
• QCI tests
• Tight frequency stability versus temperature,
supply voltage, and load variations
• Low spurious (see note 3)
• Low frequency aging, Allan Variance
• High-shock resistant
Notes:
1. The output level is determined by the supply
voltage, load, and package size.
2. Typical amplitude stability over temperature is
±10% or less.
3. Typical spurious level is better than -100dBc over
the spectrum of 100kHz to 1GHz.
QPDS-0106 Rev.-, November 2014
Q-TECH Corporation - 10150 W. Jefferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-t ec h.com
3 of 6
Q-TECH
CORPORATION
Ultra
3
Space OCXO
Ultra Miniature, Ultra Rugged, Ultra Stable
QT4200 Series - 5.0Vdc, 12Vdc or 15Vdc Space Qualified OCXO
Environmental Specifications
Q-Tech Standard Screening similar to (MIL-PRF-55310) is available. Q-Tech can also customize screening and test procedures to meet
your specific requirements. The packages are designed and processed to exceed the following test conditions:
Environmental Test
Initial Accuracy at Reference Temperature
Frequency Warm-up
Initial Frequency-Temperature Accuracy
Frequency-Voltage Tolerance
Frequency-Load Tolerance
Phase Noise Steady-State
Phase Noise Random Vibration
Output Power (Sinusoidal Waveform)
Output Logic Voltage Levels (Square wave )
Rise Time and Fall Time (Square wave )
Duty Cycle (Square wave )
Harmonic and Sub-harmonic Distortion
Spurious Response
Oven Input Current-Power
Temperature Cycling
Constant Acceleration
Seal Fine Leak
Burn-in
Aging
Random Vibration
Shock, Non Operating
Thermal Shock, Non Operating
Ambient Pressure
Resistance to Solder Heat
Terminal Strength
Resistance to Solvents
Solderability
ESD Classification
Non-destructive Bond Pull
Test Conditions
MIL-PRF-55310, Type 4, Class 3
MIL-PRF-55310, Type 4, Class 3
MIL-PRF-55310 (4.8.10.1)
MIL-PRF-55310
MIL-PRF-55310
MIL-PRF-55310
MIL-PRF-55310
MIL-PRF-55310
MIL-PRF-55310
MIL-PRF-55310
MIL-PRF-55310
MIL-PRF-55310
MIL-PRF-55310
MIL-PRF-55310, Type 4, Class 3
MIL-STD-883, Method 1010, Cond. B
MIL-STD-883, Method 2001, Cond. A, Y1
MIL-STD-883, Method 1014, Cond. A & C
240 hours, At highest operating temperature with load
30 days, MIL-PRF-55310, Type 4, Class 3
MIL-STD-883, Method 2026
MIL-STD-883, Method 2002
MIL-STD-202, Method 107, Cond. B
MIL-STD-202, 105, Cond. G, 5 minutes dwell time minimum
MIL-STD-202, Method 210, Cond. C
MIL-STD-202, Method 211, Cond. C
MIL-STD-202, Method 215
MIL-STD-202, Method 208
MIL-STD-883, Method 3015, Class 1HBM 0 to 1,999V
MIL-STD-883, Method 2023
Please contact Q-Tech for higher shock requirements
QPDS-0106 Rev.-, November 2014
Q-TECH Corporation - 10150 W. Jefferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-t ec h.com
4 of 6
Q-TECH
CORPORATION
Ultra
3
Space OCXO
Ultra Miniature, Ultra Rugged, Ultra Stable
QT4200 Series - 5.0Vdc, 12Vdc or 15Vdc Space Qualified OCXO
Design and Construction
The design and construction of the crystal oscillator shall be as specified herein. As a minimum, the oscillators shall meet the design and
construction requirements of MIL-PRF-55310.
Element De-rating
All active and passive elements shall be derated in accordance with the applicable hybrid microcircuit element requirements of
MIL-STD-975. Elements shall not operate in excess of de-rated values.
Worst Case Circuit Analysis
Worst case analysis shall be based on:
a. Maximum rated value
b. The worst case design value
c. Derating factor for each element
d. Temperature variation
e. Radiation
MTBF
Mean Time between Failure analysis shall be done based on MIL-HDBK-217
Element Evaluation
All piece parts shall be derived from lots that meet the element evaluation requirements of MIL-PRF-38534, Class K except for
the following exceptions:
Active Elements
a) Visual inspection of silicon on sapphire microcircuits. Semicircular crack(s) or multiple adjacent cracks, not in the active
area, starting and terminating at the edge of the die are acceptable. Attached (chip in place) sapphire is nonconductive
material and shall not be considered as foreign material and will be considered as nonconductive material for all
inspection criteria.
b) Subgroup 4, Scanning Electron Microscope (SEM) inspection. The manufacturer may allow the die distributor, at his
option, select two (2) dice from a waffle pack (containing a maximum quantity of 100 die), visually inspect for the worst
case metallization of the 2 dice, and take SEM photographs of the worst case.
c) Subgroup 5 radiation tests. Subgroup 5 radiation tests are not required unless otherwise specified in the detail
specification.
Package Elements
a) Salt spray. Salt spray testing is not required.
Crystal Mounting
The crystal element shall be four-point mounted in such a manner as to assure adequate crystal performance when the oscillator
is subjected to the environmental conditions specified herein.
Quartz Crystal Material
Unless otherwise specified by the detail specification, the quartz Crystal material shall be swept synthetic, grade 2.2 or better.
QPDS-0106 Rev.-, November 2014
Q-TECH Corporation - 10150 W. Jefferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-t ec h.com
5 of 6
Microchip MCU
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