ACTS245T
Data Sheet
July 1999
File Number
4611.1
Radiation Hardened Octal Non-Inverting
Bidirectional Bus Transceiver
Intersil’s Satellite Applications
(SAF) devices are fully
tested and guaranteed to 100kRAD Total Dose. These QML
Class T devices are processed to a standard flow intended
to meet the cost and shorter lead-time needs of large
volume satellite manufacturers, while maintaining a high
level of reliability.
The Intersil ACTS245T is a Radiation Hardened Octal Non-
Inverting Bidirectional Bus Transceiver intended for two-way
asynchronous communication between data busses.
Flow
TM
Features
• QML Class T, Per MIL-PRF-38535
• Radiation Performance
- Gamma Dose (γ) 1 x 10
5
RAD(Si)
- Latch-Up Free Under Any Conditions
- Single Event Upset (SEU) Immunity: <1 x 10
-10
Errors/Bit/Day (Typ)
- SEU LET Threshold . . . . . . . . . . . . .>100 MEV-cm
2
/mg
• 1.25 Micron Radiation Hardened SOS CMOS
• Significant Power Reduction Compared to ALSTTL Logic
• DC Operating Voltage Range . . . . . . . . . . . . 4.5V to 5.5V
• Input Logic Levels
- V
IL
= 0.8V Max
- V
IH
= V
CC/2
Min
• Fast Propagation Delay . . . . . . . . 18ns (Max), 12ns (Typ)
Specifications
Specifications for Rad Hard QML devices are controlled by
the Defense Supply Center in Columbus (DSCC). The SMD
numbers listed below must be used when ordering.
Detailed Electrical Specifications for the ACTS245T are
contained in SMD 5962-96719.
A “hot-link” is provided from
our website for downloading.
www.intersil.com/spacedefense/newsafclasst.asp
Intersil’s Quality Management Plan (QM Plan), listing all
Class T screening operations, is also available on our
website.
www.intersil.com/quality/manuals.asp
Pinouts
ACTS245T (SBDIP), CDIP2-T20
TOP VIEW
DIR
A0
A1
A2
1
2
3
4
5
6
7
8
9
20 V
CC
19 OE
18 B0
17 B1
16 B2
15 B3
14 B4
13 B5
12 B6
11 B7
Ordering Information
ORDERING
NUMBER
5962R9671901TRC
5962R9671901TXC
PART
NUMBER
ACTS245DTR
ACTS245KTR
TEMP.
RANGE
(
o
C)
-55 to 125
-55 to 125
A3
A4
A5
A6
A7
GND 10
NOTE:
Minimum order quantity for -T is 150 units through
distribution, or 450 units direct.
ACTS245T (FLATPACK), CDFP4-F20
TOP VIEW
DIR
A0
A1
A2
A3
A4
A5
A6
A7
GND
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
V
CC
OE
B0
B1
B2
B3
B4
B5
B6
B7
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
www.intersil.com or 407-727-9207
|
Copyright
©
Intersil Corporation 1999
ACTS245T
Die Characteristics
DIE DIMENSIONS:
(2440µm x 2970µm x 533µm
±51µm)
96 x 117 x 21mils
±2mil
METALLIZATION:
Type: Al Si Cu
Thickness: 10.0k
Å
±2k
Å
SUBSTRATE POTENTIAL:
Unbiased (Silicon on Sapphire)
Bond Pad #20 (V
CC
) First
Bond Pad #20 (V
CC
) Uses Two Bond Wires
Bond Pad #10 (GND) Uses Two Bond Wires
BACKSIDE FINISH:
Sapphire
PASSIVATION:
Type: Silox (S
i
O
2
)
Thickness: 8.0k
Å
±1.0k
Å
WORST CASE CURRENT DENSITY:
< 2.0e5 A/cm
2
TRANSISTOR COUNT:
420
PROCESS:
CMOS SOS
Metallization Mask Layout
ACTS245T
A0
(2)
DIR
(1)
VCC
(20)
VCC
(20)
OE
(19)
A1 (3)
(18) B0
A2 (4)
(17) B1
A3 (5)
(16) B2
A4 (6)
(15) B3
A5 (7)
(14) B4
A6 (8)
(13) B5
(9)
A7
(10)
GND
(10)
GND
(11)
B7
(12)
B6
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
3
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