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5962-3829409MYA: 产品描述SRAM, 8KX8, 55ns, CMOS, CQCC32, CERAMIC, LCC-32; 产品类别存储存储; 文件大小100KB，共28页; 制造商IDT (Integrated Device Technology)

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5962-3829409MYA概述

SRAM, 8KX8, 55ns, CMOS, CQCC32, CERAMIC, LCC-32

5962-3829409MYA规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	QFJ
包装说明	QCCN, LCC32,.45X.55
针数	32
Reach Compliance Code	compliant
ECCN代码	3A001.A.2.C
最长访问时间	55 ns
I/O 类型	COMMON
JESD-30 代码	R-CQCC-N32
JESD-609代码	e0
长度	13.97 mm
内存密度	65536 bit
内存集成电路类型	OTHER SRAM
内存宽度	8
功能数量	1
端口数量	1
端子数量	32
字数	8192 words
字数代码	8000
工作模式	ASYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-55 °C
组织	8KX8
输出特性	3-STATE
可输出	YES
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	QCCN
封装等效代码	LCC32,.45X.55
封装形状	RECTANGULAR
封装形式	CHIP CARRIER
并行/串行	PARALLEL
峰值回流温度（摄氏度）	225
电源	5 V
认证状态	Not Qualified
筛选级别	MIL-STD-883
座面最大高度	3.048 mm
最大待机电流	0.02 A
最小待机电流	4.5 V
最大压摆率	0.125 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子面层	TIN LEAD
端子形式	NO LEAD
端子节距	1.27 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	30
宽度	11.43 mm
Base Number Matches	1

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IDT

Military Product

Selector Guide

January 1999

Military Overview

Introduction

Since the company’s inception in 1980, IDT has been a dedicated supplier of products for the military market. IDT supplies

communications memories, networking devices, embedded RISC microprocessors, high-speed static random access

memories (SRAMs), specialty memory, and high-performance logic to military contractors.

Qualified Manufacturers List (QML)

MIL-SPECIFICATIONS EVOLVED FROM 1950’s

“Screening quality in” activities were initiated with military electronic procurements in the 1950’s. Qualified Parts List (QPL)

system, administrated by the Defense Electronics Supply Center, DESC, was established to guarantee ICs purchased by

military contractors met strict U.S. Government standards. This process evolved into a system known as JAN (Joint Army-

Navy) as described under standard MIL-M-38510 and MIL-STD-883. The main benefit of MIL-M-38510 at its inception is now

its largest drawback. It attempts to “screen” quality in through a rigid set of tests that manufacturers must complete for each

and every device lot. The tests are rigidly performed regardless of device type, maturity, or manufacturing data showing parts

of qualification process can be dropped without impact on reliability.

SPC & TQM DROVE MILITARY INDUSTRY CHANGE

While the QPL system remained inflexible the semiconductor industry did not. Quality and reliability improvements through

process manufacturing techniques like Statistical Process Control (SPC) allowed semiconductor companies to ensure quality

and reliability in the manufacturing process. This minimized/eliminated test screens previously imposed to screen out defective

products after they have been manufactured.

The government’s support of Total Quality Management (TQM) in the 1980’s was the beginning of a journey that would

lead to more flexible military procurement policies. Applicable to any manufacturing system, TQM performance-based

specifications created a new understanding of quality and reliability assurance.

1994 - PERRY CHANGES MILITARY PROCUREMENT SYSTEM

MIL-PRF-38535/Qualified Manufacturers List (QML) grew out of the 1994 mandate by Secretary of Defense, Dr. William

Perry, to utilize performance standards to purchase components. The aim was to move the defense procurement process

away from a strict, regimented “mil-spec” system towards a system that relied on “best commercial practices”. As part of the

reflection of change DESC was deactivated and its mission realigned as a combined Inventory Control Point (ICP) in

Columbus, Ohio. The ICP is called Defense Supply Center Columbus (DSCC).

QML FOLLOWS BEST COMMERCIAL PRACTICE

QML is a performance-based specification, MIL-PRF-38535. The SMD, JAN, etc. specifications define electrical

performance for a particular device. These devices are built using QML (MIL-PRF-38535) as the process performance

specification. QML allows the elimination of non-valued-added steps via analyzing data gathered from manufacturing and

testing process. When sufficient data proves a particular step is no longer necessary, it is deleted. Reduced screening lowers

cycle times as non-value-added steps are eliminated, reducing the potential introduction of defects from extensive screening

processes.

IDT QML Certification

In June 1998, IDT received Qualified Manufacturers List (QML) certification to produce and supply military products.

The Defense Supply Center, Columbus (DSCC) awarded IDT QML certification based upon IDT superior quality and reliability

standards for product manufacturing and testing. The MIL-PRF-38535 QML specifications allow QML-certified companies to

follow a “best practice” standard for superior quality and reliability in manufacturing and testing. Companies without

certification must comply with older, more stringent criteria – which is redundant, expensive and time-consuming. An IDT

Technical Review Board (TRB) reviews military flows and recommends changes to DSCC. The “C” mark for MIL-STD-883

compliant product has been replaced with a “Q” mark for QML compliant on IDT military products. This change has no effect

on ordering part numbers (IDT Part Numbers, DESC, SMD, drawing, etc.) which remain the same. QML ensures world-class

quality, reduces cycle time and eliminates redundant activities, resulting in higher value and lower costs for our customers.

This will allow IDT to continue offering both existing and new military products to the military market.

STACK Certification

STACK international is an electronic equipment manufacturers’ association that standardizes qualification procedures for

IC’s. IDT was awarded STACK certification to perform self-audit internal quality audits without external audits by STACK. To

receive this award, IDT passed three levels of certification and exceeded STACK standards for quality in IC design,

manufacturing, test and assembly. IDT Oregon, Malaysia, Philippines and California facilities were audited.

5962-3829409MYA相似产品对比

	5962-3829409MYA	5962-3829406MYA	5962-3829410MYA	5962-3829414MYA
描述	SRAM, 8KX8, 55ns, CMOS, CQCC32, CERAMIC, LCC-32	SRAM, 8KX8, 70ns, CMOS, CQCC32, CERAMIC, LCC-32	SRAM, 8KX8, 45ns, CMOS, CQCC32, CERAMIC, LCC-32	SRAM, 8KX8, 25ns, CMOS, CQCC32, CERAMIC, LCC-32
零件包装代码	QFJ	QFJ	QFJ	QFJ
包装说明	QCCN, LCC32,.45X.55	QCCN, LCC32,.45X.55	QCCN, LCC32,.45X.55	CERAMIC, LCC-32
针数	32	32	32	32
Reach Compliance Code	compliant	unknow	unknow	compliant
ECCN代码	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
最长访问时间	55 ns	70 ns	45 ns	25 ns
I/O 类型	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32
JESD-609代码	e0	e0	e0	e0
长度	13.97 mm	13.97 mm	13.97 mm	13.97 mm
内存密度	65536 bit	65536 bi	65536 bi	65536 bit
内存集成电路类型	OTHER SRAM	OTHER SRAM	OTHER SRAM	OTHER SRAM
内存宽度	8	8	8	8
功能数量	1	1	1	1
端口数量	1	1	1	1
端子数量	32	32	32	32
字数	8192 words	8192 words	8192 words	8192 words
字数代码	8000	8000	8000	8000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C
组织	8KX8	8KX8	8KX8	8KX8
输出特性	3-STATE	3-STATE	3-STATE	3-STATE
可输出	YES	YES	YES	YES
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	QCCN	QCCN	QCCN	QCCN
封装等效代码	LCC32,.45X.55	LCC32,.45X.55	LCC32,.45X.55	LCC32,.45X.55
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL
电源	5 V	5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified
筛选级别	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883
座面最大高度	3.048 mm	3.048 mm	3.048 mm	3.048 mm
最大待机电流	0.02 A	0.0003 A	0.0003 A	0.0003 A
最小待机电流	4.5 V	2 V	2 V	2 V
最大压摆率	0.125 mA	0.09 mA	0.105 mA	0.11 mA
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY
端子面层	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
端子形式	NO LEAD	NO LEAD	NO LEAD	NO LEAD
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	QUAD	QUAD	QUAD	QUAD
宽度	11.43 mm	11.43 mm	11.43 mm	11.43 mm
Base Number Matches	1	1	1	1

5962-3829409MYA

5962-3829409MYA概述

5962-3829409MYA规格参数

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