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5962-89839022A

产品描述EE PLD, 20ns, CMOS, CQCC20, 0.350 X 0.350 INCH, CERAMIC, LCC-20
产品类别可编程逻辑器件    可编程逻辑   
文件大小837KB,共27页
制造商AMD(超微)
官网地址http://www.amd.com
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5962-89839022A概述

EE PLD, 20ns, CMOS, CQCC20, 0.350 X 0.350 INCH, CERAMIC, LCC-20

5962-89839022A规格参数

参数名称属性值
零件包装代码QLCC
包装说明QCCN,
针数20
Reach Compliance Codeunknown
ECCN代码3A001.A.2.C
其他特性PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET
最大时钟频率33.3 MHz
JESD-30 代码S-CQCC-N20
JESD-609代码e0
长度8.89 mm
专用输入次数8
I/O 线路数量8
端子数量20
最高工作温度125 °C
最低工作温度-55 °C
组织8 DEDICATED INPUTS, 8 I/O
输出函数MACROCELL
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码QCCN
封装形状SQUARE
封装形式CHIP CARRIER
可编程逻辑类型EE PLD
传播延迟20 ns
认证状态Not Qualified
座面最大高度2.54 mm
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式NO LEAD
端子节距1.27 mm
端子位置QUAD
宽度8.89 mm
Base Number Matches1

5962-89839022A相似产品对比

5962-89839022A 5962-8983902RA 5962-89839032A 5962-8983901RA 5962-8983903RA 5962-89839012A PALCE16V8H-10E5/B2A PALCE16V8H-10E5/BRA PALCE16V8H-15E5/B2A PALCE16V8H-15E5/BRA
描述 EE PLD, 20ns, CMOS, CQCC20, 0.350 X 0.350 INCH, CERAMIC, LCC-20 EE PLD, 20ns, CMOS, CDIP20, 0.250 X 1.166 INCH, CERAMIC, DIP-20 EE PLD, 15ns, CMOS, CQCC20, 0.350 X 0.350 INCH, CERAMIC, LCC-20 EE PLD, 55ns, CMOS, CDIP20, 0.250 X 1.166 INCH, CERAMIC, DIP-20 EE PLD, 15ns, CMOS, CDIP20, 0.250 X 1.166 INCH, CERAMIC, DIP-20 EE PLD, 55ns, CMOS, CQCC20, 0.350 X 0.350 INCH, CERAMIC, LCC-20 EE PLD, 10ns, PAL-Type, CMOS, CQCC20, CERAMIC, LCC-20 EE PLD, 10ns, PAL-Type, CMOS, CDIP20, CERAMIC, DIP-20 EE PLD, 15ns, PAL-Type, CMOS, CQCC20, CERAMIC, LCC-20 EE PLD, 15ns, PAL-Type, CMOS, CDIP20, CERAMIC, DIP-20
零件包装代码 QLCC DIP QLCC DIP DIP QLCC QLCC DIP QLCC DIP
包装说明 QCCN, DIP, QCCN, DIP, DIP, QCCN, QCCN, LCC20,.35SQ DIP, DIP20,.3 QCCN, LCC20,.35SQ DIP, DIP20,.3
针数 20 20 20 20 20 20 20 20 20 20
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN代码 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
其他特性 PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET
最大时钟频率 33.3 MHz 33.3 MHz 41.6 MHz 28.6 MHz 41.6 MHz 28.6 MHz 58.5 MHz 58.5 MHz 41.6 MHz 41.6 MHz
JESD-30 代码 S-CQCC-N20 R-GDIP-T20 S-CQCC-N20 R-GDIP-T20 R-GDIP-T20 S-CQCC-N20 S-CQCC-N20 R-GDIP-T20 S-CQCC-N20 R-GDIP-T20
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
长度 8.89 mm 24.257 mm 8.89 mm 24.257 mm 24.257 mm 8.89 mm 8.89 mm 24.257 mm 8.89 mm 24.257 mm
专用输入次数 8 8 8 8 8 8 8 8 8 8
I/O 线路数量 8 8 8 8 8 8 8 8 8 8
端子数量 20 20 20 20 20 20 20 20 20 20
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
组织 8 DEDICATED INPUTS, 8 I/O 8 DEDICATED INPUTS, 8 I/O 8 DEDICATED INPUTS, 8 I/O 8 DEDICATED INPUTS, 8 I/O 8 DEDICATED INPUTS, 8 I/O 8 DEDICATED INPUTS, 8 I/O 8 DEDICATED INPUTS, 8 I/O 8 DEDICATED INPUTS, 8 I/O 8 DEDICATED INPUTS, 8 I/O 8 DEDICATED INPUTS, 8 I/O
输出函数 MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
封装代码 QCCN DIP QCCN DIP DIP QCCN QCCN DIP QCCN DIP
封装形状 SQUARE RECTANGULAR SQUARE RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR SQUARE RECTANGULAR
封装形式 CHIP CARRIER IN-LINE CHIP CARRIER IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER IN-LINE CHIP CARRIER IN-LINE
可编程逻辑类型 EE PLD EE PLD EE PLD EE PLD EE PLD EE PLD EE PLD EE PLD EE PLD EE PLD
传播延迟 20 ns 20 ns 15 ns 55 ns 15 ns 55 ns 10 ns 10 ns 15 ns 15 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.54 mm 5.08 mm 2.54 mm 5.08 mm 5.08 mm 2.54 mm 2.54 mm 5.08 mm 2.54 mm 5.08 mm
最大供电电压 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES NO YES NO NO YES YES NO YES NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子面层 TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 NO LEAD THROUGH-HOLE NO LEAD THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD THROUGH-HOLE NO LEAD THROUGH-HOLE
端子节距 1.27 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm
端子位置 QUAD DUAL QUAD DUAL DUAL QUAD QUAD DUAL QUAD DUAL
宽度 8.89 mm 7.62 mm 8.89 mm 7.62 mm 7.62 mm 8.89 mm 8.89 mm 7.62 mm 8.89 mm 7.62 mm
Base Number Matches 1 1 1 1 1 1 1 1 1 1

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