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CAT25040YE-GT3D

产品描述IC,SERIAL EEPROM,512X8,CMOS,TSSOP,8PIN,PLASTIC
产品类别存储    存储   
文件大小178KB,共16页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
标准
下载文档 详细参数 选型对比 全文预览

CAT25040YE-GT3D概述

IC,SERIAL EEPROM,512X8,CMOS,TSSOP,8PIN,PLASTIC

CAT25040YE-GT3D规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称ON Semiconductor(安森美)
包装说明TSSOP-8
Reach Compliance Codecompliant
其他特性IT ALSO OPERATES AT 5MHZ AT 1.8MIN
最大时钟频率 (fCLK)10 MHz
数据保留时间-最小值100
耐久性1000000 Write/Erase Cycles
JESD-30 代码R-PDSO-G8
JESD-609代码e3
长度4.4 mm
内存密度4096 bit
内存集成电路类型EEPROM
内存宽度8
湿度敏感等级1
功能数量1
端子数量8
字数512 words
字数代码512
工作模式SYNCHRONOUS
最高工作温度125 °C
最低工作温度-40 °C
组织512X8
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP8,.19
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行SERIAL
峰值回流温度(摄氏度)225
电源2/5 V
认证状态Not Qualified
座面最大高度1.2 mm
串行总线类型SPI
最大待机电流0.000002 A
最大压摆率0.002 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)2.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度3 mm
最长写入周期时间 (tWC)5 ms
写保护HARDWARE/SOFTWARE
Base Number Matches1

文档预览

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CAT25010, CAT25020,
CAT25040
1-Kb, 2-Kb and 4-Kb SPI
Serial CMOS EEPROM
Description
The CAT25010/20/40 are 1−Kb/2−Kb/4−Kb Serial CMOS
EEPROM devices internally organized as 128x8/256x8/512x8 bits.
They feature a 16−byte page write buffer and support the Serial
Peripheral Interface (SPI) protocol. The device is enabled through a
Chip Select (CS) input. In addition, the required bus signals are a clock
input (SCK), data input (SI) and data output (SO) lines. The HOLD
input may be used to pause any serial communication with the
CAT25010/20/40 device. These devices feature software and
hardware write protection, including partial as well as full array
protection.
Features
http://onsemi.com
SOIC−8
V SUFFIX
CASE 751BD
MSOP−8
Z SUFFIX
CASE 846AD
TDFN−8
VP2 SUFFIX
CASE 511AK
10 MHz SPI Compatible
1.8 V to 5.5 V Supply Voltage Range
SPI Modes (0,0) & (1,1)
16−byte Page Write Buffer
Self−timed Write Cycle
Hardware and Software Protection
Block Write Protection
Protect 1/4, 1/2 or Entire EEPROM Array
Low Power CMOS Technology
1,000,000 Program/Erase Cycles
100 Year Data Retention
Industrial and Extended Temperature Range
8−lead PDIP, SOIC, TSSOP and 8−pad TDFN Packages
These Devices are Pb−Free, Halogen Free/BFR Free, and RoHS
Compliant
V
CC
PDIP−8
L SUFFIX
CASE 646AA
TSSOP−8
Y SUFFIX
CASE 948AL
PIN CONFIGURATION
CS
SO
WP
V
SS
1
V
CC
HOLD
SCK
SI
PDIP (L), SOIC (V), MSOP (Z)
TSSOP (Y), TDFN (VP2)
PIN FUNCTION
Pin Name
CS
SO
WP
Function
Chip Select
Serial Data Output
Write Protect
Ground
Serial Data Input
Serial Clock
Hold Transmission Input
Power Supply
SI
CS
WP
HOLD
SCK
V
SS
CAT25010
CAT25020
CAT25040
SO
V
SS
SI
SCK
HOLD
V
CC
Figure 1. Functional Symbol
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 15 of this data sheet.
©
Semiconductor Components Industries, LLC, 2009
August, 2009
Rev. 20
1
Publication Order Number:
CAT25010/D

CAT25040YE-GT3D相似产品对比

CAT25040YE-GT3D CAT25040VP2EGT3D CAT25040YI-GT3D CAT25040LE-GD
描述 IC,SERIAL EEPROM,512X8,CMOS,TSSOP,8PIN,PLASTIC IC,SERIAL EEPROM,512X8,CMOS,LLCC,8PIN,PLASTIC IC,SERIAL EEPROM,512X8,CMOS,TSSOP,8PIN,PLASTIC IC,SERIAL EEPROM,512X8,CMOS,DIP,8PIN,PLASTIC
是否无铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合
厂商名称 ON Semiconductor(安森美) ON Semiconductor(安森美) ON Semiconductor(安森美) ON Semiconductor(安森美)
包装说明 TSSOP-8 HVSON, SOLCC8,.11,20 TSSOP, TSSOP8,.19 DIP-8
Reach Compliance Code compliant compliant compliant compliant
最大时钟频率 (fCLK) 10 MHz 10 MHz 10 MHz 10 MHz
数据保留时间-最小值 100 100 100 100
耐久性 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
JESD-30 代码 R-PDSO-G8 R-PDSO-N8 R-PDSO-G8 R-PDIP-T8
JESD-609代码 e3 e3 e4 e3
长度 4.4 mm 3 mm 4.4 mm 9.27 mm
内存密度 4096 bit 4096 bit 4096 bit 4096 bit
内存集成电路类型 EEPROM EEPROM EEPROM EEPROM
内存宽度 8 8 8 8
湿度敏感等级 1 1 1 1
功能数量 1 1 1 1
端子数量 8 8 8 8
字数 512 words 512 words 512 words 512 words
字数代码 512 512 512 512
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 125 °C 125 °C 85 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C
组织 512X8 512X8 512X8 512X8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP HVSON TSSOP DIP
封装等效代码 TSSOP8,.19 SOLCC8,.11,20 TSSOP8,.19 DIP8,.3
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
并行/串行 SERIAL SERIAL SERIAL SERIAL
峰值回流温度(摄氏度) 225 225 260 225
电源 2/5 V 2/5 V 2/5 V 2/5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 0.8 mm 1.2 mm 5.33 mm
串行总线类型 SPI SPI SPI SPI
最大待机电流 0.000002 A 0.000002 A 0.000002 A 0.000002 A
最大压摆率 0.002 mA 0.002 mA 0.002 mA 0.002 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V
表面贴装 YES YES YES NO
技术 CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE INDUSTRIAL AUTOMOTIVE
端子面层 Matte Tin (Sn) Matte Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn)
端子形式 GULL WING NO LEAD GULL WING THROUGH-HOLE
端子节距 0.65 mm 0.5 mm 0.65 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 3 mm 2 mm 3 mm 7.62 mm
最长写入周期时间 (tWC) 5 ms 5 ms 5 ms 5 ms
写保护 HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 1 1 1
其他特性 IT ALSO OPERATES AT 5MHZ AT 1.8MIN IT ALSO OPERATES AT 5MHZ AT 1.8MIN - IT ALSO OPERATES AT 5MHZ AT 1.8MIN

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