Log Or Antilog Amplifier, 2 Func, 1099.65MHz Band Width, BIPolar, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, LCC20,.35SQ |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | LOG OR ANTILOG AMPLIFIER |
| 标称带宽 | 1099.65 MHz |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e4 |
| 长度 | 8.89 mm |
| 功能数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 6 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 2.03 mm |
| 最大供电电流 (Isup) | 110 mA |
| 最大供电电压 (Vsup) | 6.1 V |
| 最小供电电压 (Vsup) | 5.9 V |
| 标称供电电压 (Vsup) | 6 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | INDUSTRIAL |
| 端子面层 | GOLD |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| 5962-9231501M2C | SL2524NA1C | SL2524CHP | SL2524/B/LC | DES9231501/AC/LCAZ | |
|---|---|---|---|---|---|
| 描述 | Log Or Antilog Amplifier, 2 Func, 1099.65MHz Band Width, BIPolar, CQCC20, CERAMIC, LCC-20 | Log Or Antilog Amplifier, BIPolar | Log Or Antilog Amplifier, BIPolar, PQCC20 | Log Or Antilog Amplifier, BIPolar, PQCC20 | Log Or Antilog Amplifier, PQCC20 |
| 零件包装代码 | QLCC | WAFER | QLCC | QLCC | QLCC |
| 包装说明 | QCCN, LCC20,.35SQ | DIE, DIE OR CHIP | QCCJ, LDCC20,.4SQ | QCCN, LCC20,.35SQ | , |
| 针数 | 20 | 22 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | LOG OR ANTILOG AMPLIFIER | LOG OR ANTILOG AMPLIFIER | LOG OR ANTILOG AMPLIFIER | LOG OR ANTILOG AMPLIFIER | LOG OR ANTILOG AMPLIFIER |
| JESD-30 代码 | S-CQCC-N20 | R-XUUC-N22 | S-PQCC-J20 | S-PQCC-N20 | S-PQCC-N20 |
| 端子数量 | 20 | 22 | 20 | 20 | 20 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | UNCASED CHIP | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | YES | YES | YES |
| 端子形式 | NO LEAD | NO LEAD | J BEND | NO LEAD | NO LEAD |
| 端子位置 | QUAD | UPPER | QUAD | QUAD | QUAD |
| JESD-609代码 | e4 | - | e0 | e0 | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -30 °C | -40 °C | - |
| 封装代码 | QCCN | DIE | QCCJ | QCCN | - |
| 封装等效代码 | LCC20,.35SQ | DIE OR CHIP | LDCC20,.4SQ | LCC20,.35SQ | - |
| 电源 | 6 V | 6 V | 6 V | 6 V | - |
| 最大供电电流 (Isup) | 110 mA | 100 mA | 100 mA | 100 mA | - |
| 标称供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | - |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | OTHER | INDUSTRIAL | - |
| 端子面层 | GOLD | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子节距 | 1.27 mm | - | 1.27 mm | 1.27 mm | - |
| Base Number Matches | 1 | 1 | 1 | - | - |
| 厂商名称 | - | Dynex | - | Dynex | Dynex |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
