Pipeline Register, 8-Bit, CMOS, CDIP24, CERAMIC, DIP-24
| 参数名称 | 属性值 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 其他特性 | SELECTABLE DELAY LENGTH FROM 3 TO 18 STAGES; |
| 边界扫描 | NO |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | R-GDIP-T24 |
| JESD-609代码 | e0 |
| 低功率模式 | NO |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出数据总线宽度 | 8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, PIPELINE REGISTER |
| Base Number Matches | 1 |
| 5962-9679305MLX | 5962-9679304M3X | 5962-9679306MLX | 5962-9679304MLX | 5962-9679304M3C | 5962-9679306M3C | 5962-9679305M3X | 5962-9679305M3C | 5962-9679306M3X | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Pipeline Register, 8-Bit, CMOS, CDIP24, CERAMIC, DIP-24 | Pipeline Register, 8-Bit, CMOS, CQCC28, CERAMIC, LCC-28 | Pipeline Register, 8-Bit, CMOS, CDIP24, CERAMIC, DIP-24 | Pipeline Register, 8-Bit, CMOS, CDIP24, CERAMIC, DIP-24 | Pipeline Register, 8-Bit, CMOS, CQCC28, CERAMIC, LCC-28 | Pipeline Register, 8-Bit, CMOS, CQCC28, CERAMIC, LCC-28 | Pipeline Register, 8-Bit, CMOS, CQCC28, CERAMIC, LCC-28 | Pipeline Register, 8-Bit, CMOS, CQCC28, CERAMIC, LCC-28 | Pipeline Register, 8-Bit, CMOS, CQCC28, CERAMIC, LCC-28 |
| 零件包装代码 | DIP | QLCC | DIP | DIP | QLCC | QLCC | QLCC | QLCC | QLCC |
| 包装说明 | DIP, | QCCN, | DIP, | DIP, | QCCN, | QCCN, | QCCN, | QCCN, | QCCN, |
| 针数 | 24 | 28 | 24 | 24 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 其他特性 | SELECTABLE DELAY LENGTH FROM 3 TO 18 STAGES; | SELECTABLE DELAY LENGTH FROM 3 TO 18 STAGES; | SELECTABLE DELAY LENGTH FROM 3 TO 18 STAGES; | SELECTABLE DELAY LENGTH FROM 3 TO 18 STAGES; | SELECTABLE DELAY LENGTH FROM 3 TO 18 STAGES; | SELECTABLE DELAY LENGTH FROM 3 TO 18 STAGES; | SELECTABLE DELAY LENGTH FROM 3 TO 18 STAGES; | SELECTABLE DELAY LENGTH FROM 3 TO 18 STAGES; | SELECTABLE DELAY LENGTH FROM 3 TO 18 STAGES; |
| 边界扫描 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-GDIP-T24 | S-CQCC-N28 | R-GDIP-T24 | R-GDIP-T24 | S-CQCC-N28 | S-CQCC-N28 | S-CQCC-N28 | S-CQCC-N28 | S-CQCC-N28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e4 | e4 | e0 | e4 | e0 |
| 低功率模式 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 端子数量 | 24 | 28 | 24 | 24 | 28 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | QCCN | DIP | DIP | QCCN | QCCN | QCCN | QCCN | QCCN |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | Gold (Au) | Gold (Au) | TIN LEAD | Gold (Au) | TIN LEAD |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | QUAD | QUAD | QUAD | QUAD | QUAD |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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