IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,LLCC,20PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown |
| 控制类型 | ENABLE LOW |
| JESD-30 代码 | S-XQCC-N20 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.006 A |
| 位数 | 4 |
| 功能数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| MM54HCT240E/883 | MM54HCT240J/883 | MM74HCT244J/A+ | MM54HCT244J | MM54HCT244J/883C | MM54HCT244J/883B | MM54HCT244J/883 | MM74HCT244WM/A+ | MM74HCT244N/A+ | MM74HCT244N/B+ | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,LLCC,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,DIP,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,DIP,20PIN,CERAMIC | HCT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDIP20, CERDIP-20 | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,DIP,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,DIP,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,DIP,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,SOP,20PIN,PLASTIC | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,DIP,20PIN,PLASTIC | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,DIP,20PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | SOP, SOP20,.4 | DIP, DIP20,.3 | DIP, DIP20,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| JESD-30 代码 | S-XQCC-N20 | R-XDIP-T20 | R-XDIP-T20 | R-GDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-PDSO-G20 | R-PDIP-T20 | R-PDIP-T20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC, GLASS-SEALED | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCN | DIP | DIP | DIP | DIP | DIP | DIP | SOP | DIP | DIP |
| 封装等效代码 | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | SOP20,.4 | DIP20,.3 | DIP20,.3 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | NO | NO | NO | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
FPGA/CPLD
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