Error Detection And Correction Circuit, 49C Series, 32-Bit, CMOS, CPGA68, CAVITY-UP, CERAMIC, PGA-68
| 参数名称 | 属性值 |
| 零件包装代码 | PGA |
| 包装说明 | PGA, |
| 针数 | 68 |
| Reach Compliance Code | unknown |
| 其他特性 | BUILT IN DIAGNOSTICS; BYTE CONTROL |
| 系列 | 49C |
| JESD-30 代码 | S-CPGA-P68 |
| JESD-609代码 | e0 |
| 长度 | 29.464 mm |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | ERROR DETECTION AND CORRECTION CIRCUIT |
| 位数 | 32 |
| 功能数量 | 1 |
| 端子数量 | 68 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 传播延迟(tpd) | 33 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.207 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | PIN/PEG |
| 端子节距 | 2.54 mm |
| 端子位置 | PERPENDICULAR |
| 宽度 | 29.464 mm |
| Base Number Matches | 1 |
| 5962-8853302UA | 5962-8853301UA | 5962-8853306UA | |
|---|---|---|---|
| 描述 | Error Detection And Correction Circuit, 49C Series, 32-Bit, CMOS, CPGA68, CAVITY-UP, CERAMIC, PGA-68 | Error Detection And Correction Circuit, 49C Series, 32-Bit, CMOS, CPGA68, CAVITY-UP, CERAMIC, PGA-68 | Error Detection And Correction Circuit, 49C Series, 32-Bit, CMOS, CPGA68, CAVITY-UP, CERAMIC, PGA-68 |
| 零件包装代码 | PGA | PGA | PGA |
| 包装说明 | PGA, | PGA, | PGA, |
| 针数 | 68 | 68 | 68 |
| Reach Compliance Code | unknown | unknown | unknown |
| 其他特性 | BUILT IN DIAGNOSTICS; BYTE CONTROL | BUILT IN DIAGNOSTICS; BYTE CONTROL | BUILT IN DIAGNOSTICS; BYTE CONTROL |
| 系列 | 49C | 49C | 49C |
| JESD-30 代码 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 |
| JESD-609代码 | e0 | e0 | e0 |
| 长度 | 29.464 mm | 29.464 mm | 29.464 mm |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | ERROR DETECTION AND CORRECTION CIRCUIT | ERROR DETECTION AND CORRECTION CIRCUIT | ERROR DETECTION AND CORRECTION CIRCUIT |
| 位数 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 68 | 68 | 68 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA | PGA | PGA |
| 封装形状 | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 传播延迟(tpd) | 33 ns | 39 ns | 29 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.207 mm | 5.207 mm | 5.207 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
| 宽度 | 29.464 mm | 29.464 mm | 29.464 mm |
| Base Number Matches | 1 | 1 | 1 |
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