Freescale Semiconductor
Advance Information
Document Number: MPC755ECS03AD
Rev. 0.1, 02/2006
MPC755 RISC Microprocessor
Hardware Specifications Addendum
for the XPC755xxxnnnLE Series
This document describes part-number-specific changes to
recommended operating conditions and revised electrical
specifications, as applicable, from those described in the
general
MPC755 RISC Microprocessor Hardware
Specifications
(MPC755EC). The MPC755 and MPC745 are
reduced instruction set computing (RISC) microprocessors
that implement the PowerPC™ instruction set architecture.
The devices described in this specification are no longer in
production and this document is provided for reference only.
For recommended upgrades or replacement devices, contact
your Freescale sales office.
Specifications provided in this document supersede those in
the
MPC755 RISC Microprocessor Hardware
Specifications,
Rev. 6 or later, for the part numbers listed in
Table A
only. Specifications not addressed herein are
unchanged.
Note that headings and table numbers in this document are
not consecutively numbered. They are intended to
correspond to the heading or table affected in the general
hardware specification.
Freescale Part Numbers Affected:
XPC755BRX400LE
XPC755BPX400LE
XPC755CRX450LE
This document contains information on a new product. Specifications and information herein
are subject to change without notice.
© Freescale Semiconductor, Inc., 2003, 2006. All rights reserved.
Part numbers addressed in this document are listed in
Table A.
For more detailed ordering information, see
Section 10, “Ordering Information.”
Table A. Part Numbers Addressed by This Data Sheet
Operating Conditions
Freescale
Part Number
CPU
Frequency
(MHz)
400
T
J
(°C)
0 to 105
Significant Differences from
Hardware Specification
V
DD
2.0 V ±100 mV
XPC755BRX400LE
XPC755BPX400LE
XPC755CRX450LE
Modified power specifications. These devices
are no longer in production.
450
Note:
The X prefix in a Freescale PowerPC part number designates a “Pilot Production Prototype” as defined by
Freescale SOP 3-13. These are from a limited production volume of prototypes manufactured, tested, and Q.A.
inspected on a qualified technology to simulate normal production. These parts have only preliminary reliability and
characterization data. Before pilot production prototypes may be shipped, written authorization from the customer must
be on file in the applicable sales office acknowledging the qualification status and the fact that product changes may
still occur while shipping pilot production prototypes.
4.1
DC Electrical Characteristics
Table 3. Recommended Operating Conditions
1
Recommended Value
Characteristic
Symbol
400 MHz, 450 MHz
Min
Max
2.10
2.10
2.10
V
V
V
2
2
2
Unit
Notes
Core supply voltage
PLL supply voltage
L2 DLL supply voltage
V
DD
AV
DD
L2AV
DD
1.90
1.90
1.90
Notes:
1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not
guaranteed.
2. 2.0 V nominal.
MPC755 RISC Microprocessor Hardware Specifications Addendum for the XPC755xxxnnnLE Series, Rev. 0.1
2
Freescale Semiconductor
Table 7. Power Consumption for MPC755
Processor (CPU) Frequency
Unit
400 MHz
Full-Power Mode
Typical
Maximum
Doze Mode
Maximum
Nap Mode
Maximum
Sleep Mode
Maximum
470
Sleep Mode (PLL and DLL Disabled)
Maximum
430
430
mW
1, 2
470
mW
1, 2, 4
1.0
1.0
W
1, 2, 4
2.3
2.8
W
1, 2, 4
4.0
6.0
4.6
8.0
W
W
1, 3, 4
1, 2
450 MHz
Notes
Notes:
1. These values apply for all valid processor bus and L2 bus ratios. The values do not include I/O supply power (OV
DD
and
L2OV
DD
) or PLL/DLL supply power (AV
DD
and L2AV
DD
). OV
DD
and L2OV
DD
power is system dependent, but is typically
<10% of V
DD
power. Worst case power consumption for AV
DD
= 15 mW and L2AV
DD
= 15 mW.
2. Maximum power is measured at nominal V
DD
(see
Table 3)
while running an entirely cache-resident, contrived sequence of
instructions which keep the execution units maximally busy.
3. Typical power is an average value measured at the nominal recommended V
DD
(see
Table 3)
and 65°C in a system while
running a typical code sequence.
4. Not 100% tested. Characterized and periodically sampled.
4.2.1
Clock AC Specifications
Table 8. Clock AC Timing Specifications
At recommended operating conditions (see
Table 3)
Maximum Processor Core Frequency
Characteristic
Symbol
400 MHz
Min
Processor frequency
VCO frequency
f
core
f
VCO
200
400
Max
400
800
450 MHz
Min
200
400
Max
450
900
MHz
MHz
1
1
Unit
Notes
Note:
1.
Caution:
The SYSCLK frequency and PLL_CFG[0:3] settings must be chosen such that the resulting SYSCLK (bus)
frequency, CPU (core) frequency, and PLL (VCO) frequency do not exceed their respective maximum or minimum operating
frequencies. Refer to the PLL_CFG[0:3] signal description in Section 1.8.1, “PLL Configuration
,”
for valid PLL_CFG[0:3]
settings.
MPC755 RISC Microprocessor Hardware Specifications Addendum for the XPC755xxxnnnLE Series, Rev. 0.1
Freescale Semiconductor
3
Ordering Information
10
10.1
Ordering Information
Part Numbers Addressed by This Specification
Table 20. Part Numbering Nomenclature
Table 20
provides the ordering information for the MPC755 parts described in this specification.
XPC
Product
Code
XPC
1
755
Part
Identifier
755
x
Process
Descriptor
B = HiP4DP
xx
Package
RX = CBGA
PX = PBGA
nnn
Processor
Frequency
400
x
Application Modifier
L: 2.0 V ±100 mV
0° to 105°C
x
Revision Level
E: 2.8; PVR = 0008 3203
755
C = HiP4DP
RX = CBGA
450
Notes:
1. The X prefix in a Freescale part number designates a “Pilot Production Prototype” as defined by Freescale SOP 3-13. These
are from a limited production volume of prototypes manufactured, tested, and Q.A. inspected on a qualified technology to
simulate normal production. These parts have only preliminary reliability and characterization data. Before pilot production
prototypes may be shipped, written authorization from the customer must be on file in the applicable sales office
acknowledging the qualification status and the fact that product changes may still occur while shipping pilot production
prototypes.
MPC755 RISC Microprocessor Hardware Specifications Addendum for the XPC755xxxnnnLE Series, Rev. 0.1
4
Freescale Semiconductor
Ordering Information
10.3
Part Marking
Parts are marked as the example shown in
Figure 29.
MPC755B
RX400LE
MMMMMM
ATWLYYWWA
755
BGA
Notes
:
MMMMMM is the 6-digit mask number.
ATWLYYWWA is the traceability code.
CCCCC is the country of assembly. This space is left blank if parts are
assembled in the United States.
Figure 29. Part Marking for BGA Device
MPC755 RISC Microprocessor Hardware Specifications Addendum for the XPC755xxxnnnLE Series, Rev. 0.1
Freescale Semiconductor
5
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