CD74HC366M在线购买

供应商	器件名称	价格	最低购买	库存
	CD74HC366M	-	-	点击查看	点击购买

CD74HC366M概述

IC,BUFFER/DRIVER,SINGLE,6-BIT,HC-CMOS,SOP,16PIN,PLASTIC

CD74HC366M规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Renesas(瑞萨电子)
Reach Compliance Code	not_compliant
控制类型	ENABLE LOW
JESD-30 代码	R-PDSO-G16
JESD-609代码	e0
负载电容（CL）	50 pF
逻辑集成电路类型	BUS DRIVER
最大I（ol）	0.006 A
位数	6
功能数量	1
端子数量	16
最高工作温度	125 °C
最低工作温度	-55 °C
输出特性	3-STATE
输出极性	INVERTED
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP16,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
电源	2/6 V
Prop。Delay @ Nom-Sup	33 ns
认证状态	Not Qualified
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子面层	Tin/Lead (Sn/Pb)
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
Base Number Matches	1

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CD74HC366M相似产品对比

	CD74HC366M	CD54HC365F	CD74HC365H	CD54HC365H	CD74HC365M96	CD54HC366H	CD54HCT365H	CD54HCT365F	CD74HCT365M96	CD74HCT366E
描述	IC,BUFFER/DRIVER,SINGLE,6-BIT,HC-CMOS,SOP,16PIN,PLASTIC	IC,BUFFER/DRIVER,SINGLE,6-BIT,HC-CMOS,DIP,16PIN,CERAMIC	IC,BUFFER/DRIVER,SINGLE,6-BIT,HC-CMOS,DIE	CD54HC365H	IC,BUFFER/DRIVER,SINGLE,6-BIT,HC-CMOS,SOP,16PIN,PLASTIC	IC,BUFFER/DRIVER,SINGLE,6-BIT,HC-CMOS,DIE	CD54HCT365H	IC,BUFFER/DRIVER,SINGLE,6-BIT,HCT-CMOS,DIP,16PIN,CERAMIC	IC,BUFFER/DRIVER,SINGLE,6-BIT,HCT-CMOS,SOP,16PIN,PLASTIC	IC,BUFFER/DRIVER,SINGLE,6-BIT,HCT-CMOS,DIP,16PIN,PLASTIC
Reach Compliance Code	not_compliant	not_compliant	compliant	unknown	not_compliant	unknown	unknown	not_compliant	not_compliant	not_compliant
控制类型	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW
负载电容（CL）	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
逻辑集成电路类型	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
最大I（ol）	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A
位数	6	6	6	6	6	6	6	6	6	6
功能数量	1	1	1	1	1	1	1	1	1	1
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
输出极性	INVERTED	TRUE	TRUE	TRUE	TRUE	INVERTED	TRUE	TRUE	TRUE	INVERTED
封装等效代码	SOP16,.25	DIP16,.3	DIE OR CHIP	DIE OR CHIP	SOP16,.25	DIE OR CHIP	DIE OR CHIP	DIP16,.3	SOP16,.25	DIP16,.3
电源	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	5 V	5 V	5 V	5 V
Prop。Delay @ Nom-Sup	33 ns	32 ns	32 ns	32 ns	32 ns	33 ns	38 ns	38 ns	32 ns	33 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
是否Rohs认证	不符合	不符合	-	-	不符合	-	-	不符合	不符合	不符合
厂商名称	Renesas(瑞萨电子)	Renesas(瑞萨电子)	-	-	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)
JESD-30 代码	R-PDSO-G16	R-XDIP-T16	-	-	R-PDSO-G16	-	-	R-XDIP-T16	R-PDSO-G16	R-PDIP-T16
JESD-609代码	e0	e0	-	-	e0	-	-	e0	e0	e0
端子数量	16	16	-	-	16	-	-	16	16	16
封装主体材料	PLASTIC/EPOXY	CERAMIC	-	-	PLASTIC/EPOXY	-	-	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	DIP	-	-	SOP	-	-	DIP	SOP	DIP
封装形状	RECTANGULAR	RECTANGULAR	-	-	RECTANGULAR	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	IN-LINE	-	-	SMALL OUTLINE	-	-	IN-LINE	SMALL OUTLINE	IN-LINE
表面贴装	YES	NO	-	-	YES	-	-	NO	YES	NO
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	GULL WING	THROUGH-HOLE	-	-	GULL WING	-	-	THROUGH-HOLE	GULL WING	THROUGH-HOLE
端子节距	1.27 mm	2.54 mm	-	-	1.27 mm	-	-	2.54 mm	1.27 mm	2.54 mm
端子位置	DUAL	DUAL	-	-	DUAL	-	-	DUAL	DUAL	DUAL
包装说明	-	-	, DIE OR CHIP	, DIE OR CHIP	SOP, SOP16,.25	, DIE OR CHIP	, DIE OR CHIP	DIP, DIP16,.3	SOP, SOP16,.25	DIP, DIP16,.3

CD74HC366M

CD74HC366M在线购买

CD74HC366M概述

CD74HC366M规格参数

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CD74HC366M相似产品对比

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