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AM2917ADMB

产品描述TTL/H/L SERIES, 4-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, CDIP20, HERMETIC SEALED, CERDIP-20
产品类别逻辑    逻辑   
文件大小872KB,共9页
制造商Rochester Electronics
官网地址https://www.rocelec.com/
下载文档 详细参数 选型对比 全文预览

AM2917ADMB概述

TTL/H/L SERIES, 4-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, CDIP20, HERMETIC SEALED, CERDIP-20

AM2917ADMB规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Rochester Electronics
零件包装代码DIP
包装说明DIP,
针数20
Reach Compliance Codeunknown
其他特性BUS O/PS & RECEIVER O/PS ARE AVAILABLE; SELECTABLE MULTIPLEXER INPUTS
系列TTL/H/L
JESD-30 代码R-CDIP-T20
JESD-609代码e0
长度24.4602 mm
逻辑集成电路类型REGISTERED BUS TRANSCEIVER
湿度敏感等级NOT SPECIFIED
位数4
功能数量1
端口数量3
端子数量20
最高工作温度125 °C
最低工作温度-55 °C
输出特性3-STATE
输出极性INVERTED
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DIP
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)NOT SPECIFIED
传播延迟(tpd)36 ns
认证状态COMMERCIAL
座面最大高度5.08 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术TTL
温度等级MILITARY
端子面层TIN LEAD
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度7.62 mm
Base Number Matches1

AM2917ADMB相似产品对比

AM2917ADMB AM2917ADM AM2917APC AM2917ADC AM2917ADCB AM2917AFMB AM2917AFM AM2917AXC AM2917AXM
描述 TTL/H/L SERIES, 4-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, CDIP20, HERMETIC SEALED, CERDIP-20 TTL/H/L SERIES, 4-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, CDIP20, HERMETIC SEALED, CERDIP-20 TTL/H/L SERIES, 4-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, PDIP20, PLASTIC, DIP-20 TTL/H/L SERIES, 4-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, CDIP20, HERMETIC SEALED, CERDIP-20 TTL/H/L SERIES, 4-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, CDIP20, HERMETIC SEALED, CERDIP-20 TTL/H/L SERIES, 4-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, CDFP20, FP-20 TTL/H/L SERIES, 4-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, CDFP20, FP-20 TTL/H/L SERIES, 4-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, UUC20, 0.074 X 0.130 INCH, DIE-20 TTL/H/L SERIES, 4-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, UUC20, 0.074 X 0.130 INCH, DIE-20
厂商名称 Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
零件包装代码 DIP DIP DIP DIP DIP DFP DFP DIE DIE
包装说明 DIP, DIP, DIP, DIP, DIP, DFP, DFP, DIE, DIE,
针数 20 20 20 20 20 20 20 20 20
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
其他特性 BUS O/PS & RECEIVER O/PS ARE AVAILABLE; SELECTABLE MULTIPLEXER INPUTS BUS O/PS & RECEIVER O/PS ARE AVAILABLE; SELECTABLE MULTIPLEXER INPUTS BUS O/PS & RECEIVER O/PS ARE AVAILABLE; SELECTABLE MULTIPLEXER INPUTS BUS O/PS & RECEIVER O/PS ARE AVAILABLE; SELECTABLE MULTIPLEXER INPUTS BUS O/PS & RECEIVER O/PS ARE AVAILABLE; SELECTABLE MULTIPLEXER INPUTS BUS O/PS & RECEIVER O/PS ARE AVAILABLE; SELECTABLE MULTIPLEXER INPUTS BUS O/PS & RECEIVER O/PS ARE AVAILABLE; SELECTABLE MULTIPLEXER INPUTS BUS O/PS & RECEIVER O/PS ARE AVAILABLE; SELECTABLE MULTIPLEXER INPUTS BUS O/PS & RECEIVER O/PS ARE AVAILABLE; SELECTABLE MULTIPLEXER INPUTS
系列 TTL/H/L TTL/H/L TTL/H/L TTL/H/L TTL/H/L TTL/H/L TTL/H/L TTL/H/L TTL/H/L
JESD-30 代码 R-CDIP-T20 R-CDIP-T20 R-PDIP-T20 R-CDIP-T20 R-CDIP-T20 R-CDFP-F20 R-CDFP-F20 R-XUUC-N20 R-XUUC-N20
逻辑集成电路类型 REGISTERED BUS TRANSCEIVER REGISTERED BUS TRANSCEIVER REGISTERED BUS TRANSCEIVER REGISTERED BUS TRANSCEIVER REGISTERED BUS TRANSCEIVER REGISTERED BUS TRANSCEIVER REGISTERED BUS TRANSCEIVER REGISTERED BUS TRANSCEIVER REGISTERED BUS TRANSCEIVER
位数 4 4 4 4 4 4 4 4 4
功能数量 1 1 1 1 1 1 1 1 1
端口数量 3 3 3 3 3 3 3 3 3
端子数量 20 20 20 20 20 20 20 20 20
最高工作温度 125 °C 125 °C 70 °C 70 °C 70 °C 125 °C 125 °C 70 °C 125 °C
最低工作温度 -55 °C -55 °C - - - -55 °C -55 °C - -55 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED UNSPECIFIED
封装代码 DIP DIP DIP DIP DIP DFP DFP DIE DIE
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE FLATPACK FLATPACK UNCASED CHIP UNCASED CHIP
传播延迟(tpd) 36 ns 36 ns 32 ns 32 ns 32 ns 36 ns 36 ns 32 ns 36 ns
认证状态 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
最大供电电压 (Vsup) 5.5 V 5.5 V 5.25 V 5.25 V 5.25 V 5.5 V 5.5 V 5.25 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.75 V 4.75 V 4.75 V 4.5 V 4.5 V 4.75 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO NO NO NO YES YES YES YES
技术 TTL TTL TTL TTL TTL TTL TTL TTL TTL
温度等级 MILITARY MILITARY COMMERCIAL COMMERCIAL COMMERCIAL MILITARY MILITARY COMMERCIAL MILITARY
端子形式 THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE FLAT FLAT NO LEAD NO LEAD
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL UPPER UPPER
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 - -
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 - -
长度 24.4602 mm 24.4602 mm 26.289 mm 24.4602 mm 24.4602 mm 12.827 mm 12.827 mm - -
湿度敏感等级 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - -
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - -
座面最大高度 5.08 mm 5.08 mm 5.08 mm 5.08 mm 5.08 mm 2.159 mm 2.159 mm - -
端子面层 TIN LEAD NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED TIN LEAD TIN LEAD TIN LEAD - NOT SPECIFIED
端子节距 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm - -
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - -
宽度 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 6.731 mm 6.731 mm - -
Base Number Matches 1 1 1 1 1 - - - -

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