CDIP-24, Tube
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | CDIP |
| 包装说明 | 0.300 INCH, CERDIP-24 |
| 针数 | 24 |
| 制造商包装代码 | SD24 |
| Reach Compliance Code | not_compliant |
| 其他特性 | IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V |
| 系列 | FCT |
| JESD-30 代码 | R-GDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 32.004 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.032 A |
| 湿度敏感等级 | 1 |
| 位数 | 10 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 7.5 ns |
| 传播延迟（tpd） | 10.5 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8857502LA | 5962-8857502KA | 5962-8857501LA | 5962-88575013A | 5962-8857501KA | 5962-88575023A | |
|---|---|---|---|---|---|---|
| 描述 | CDIP-24, Tube | CPACK-24, Tube | CDIP-24, Tube | LCC-28, Tube | Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CDFP24, CERPACK-24 | LCC-28, Tube |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | CDIP | CPACK | CDIP | LCC | DFP | LCC |
| 包装说明 | 0.300 INCH, CERDIP-24 | CERPACK-24 | DIP, DIP24,.3 | LCC-28 | CERPACK-24 | LCC-28 |
| 针数 | 24 | 24 | 24 | 28 | 24 | 28 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 其他特性 | IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V | IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V | IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V | IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V | IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V | IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V |
| 系列 | FCT | FCT | FCT | FCT | FCT | FCT |
| JESD-30 代码 | R-GDIP-T24 | R-GDFP-F24 | R-GDIP-T24 | S-CQCC-N28 | R-GDFP-F24 | S-CQCC-N28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 32.004 mm | 15.748 mm | 32.004 mm | 11.4554 mm | 15.748 mm | 11.4554 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A |
| 位数 | 10 | 10 | 10 | 10 | 10 | 10 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 24 | 24 | 24 | 28 | 24 | 28 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DFP | DIP | QCCN | DFP | QCCN |
| 封装等效代码 | DIP24,.3 | FL24,.4 | DIP24,.3 | LCC28,.45SQ | FL24,.4 | LCC28,.45SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | FLATPACK | IN-LINE | CHIP CARRIER | FLATPACK | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 240 | 260 | 240 | 260 | NOT SPECIFIED | 260 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 7.5 ns | 7.5 ns | 10 ns | 10 ns | 10 ns | 7.5 ns |
| 传播延迟（tpd） | 10.5 ns | 10.5 ns | 13 ns | 13 ns | 13 ns | 10.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm | 2.286 mm | 5.08 mm | 2.54 mm | 2.286 mm | 2.54 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | FLAT | THROUGH-HOLE | NO LEAD | FLAT | NO LEAD |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 9.144 mm | 7.62 mm | 11.4554 mm | 9.144 mm | 11.4554 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | - | Integrated Device Technology |
| 制造商包装代码 | SD24 | CP24 | SD24 | LC28 | - | LC28 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | - | 1 |
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