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DSPIC33FJ256GP506AE/MR

产品描述16-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQCC64, 9 X 9 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, QFN-64
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小3MB,共362页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
标准
下载文档 详细参数 全文预览

DSPIC33FJ256GP506AE/MR概述

16-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQCC64, 9 X 9 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, QFN-64

DSPIC33FJ256GP506AE/MR规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Microchip(微芯科技)
零件包装代码QFN
包装说明HVQCCN, LCC64,.35SQ,20
针数64
Reach Compliance Codecompliant
ECCN代码3A991.A.2
具有ADCYES
地址总线宽度
位大小16
最大时钟频率40 MHz
DAC 通道NO
DMA 通道YES
外部数据总线宽度
格式FIXED POINT
JESD-30 代码S-PQCC-N64
JESD-609代码e3
长度9 mm
湿度敏感等级1
I/O 线路数量53
端子数量64
最高工作温度125 °C
最低工作温度-40 °C
PWM 通道YES
封装主体材料PLASTIC/EPOXY
封装代码HVQCCN
封装等效代码LCC64,.35SQ,20
封装形状SQUARE
封装形式CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度)260
电源3.3 V
认证状态Not Qualified
RAM(字数)8192
ROM可编程性FLASH
座面最大高度1 mm
速度40 MHz
最大压摆率90 mA
最大供电电压3.6 V
最小供电电压3 V
标称供电电压3.3 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层Matte Tin (Sn)
端子形式NO LEAD
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间40
宽度9 mm
uPs/uCs/外围集成电路类型MICROCONTROLLER
Base Number Matches1

文档预览

下载PDF文档
dsPIC33FJXXXGPX06A/X08A/X10A
16-bit Digital Signal Controllers (up to 256 KB Flash and
30 KB SRAM) with Advanced Analog
Operating Conditions
• 3.0V to 3.6V, -40ºC to +150ºC, DC to 20 MIPS
• 3.0V to 3.6V, -40ºC to +125ºC, DC to 40 MIPS
Timers/Output Compare/Input Capture
• Up to nine 16-bit timers/counters. Can pair up to
make four 32-bit timers.
• Eight Output Compare modules configurable as
timers/counters
• Eight Input Capture modules
Core: 16-bit dsPIC33F CPU
Code-efficient (C and Assembly) architecture
Two 40-bit wide accumulators
Single-cycle (MAC/MPY) with dual data fetch
Single-cycle mixed-sign MUL plus hardware
divide
Communication Interfaces
• Two UART modules (10 Mbps)
- With support for LIN 2.0 protocols and IrDA
®
• Two 4-wire SPI modules (15 Mbps)
• Up to two I
2
C™ modules (up to 1 Mbaud) with
SMBus support
• Up to two Enhanced CAN (ECAN) modules
(1 Mbaud) with 2.0B support
• Data Converter Interface (DCI) module with I
2
S
codec support
Clock Management
±2% internal oscillator
Programmable PLLs and oscillator clock sources
Fail-Safe Clock Monitor (FSCM)
Independent Watchdog Timer (WDT)
Fast wake-up and start-up
Power Management
• Low-power management modes (Sleep, Idle,
Doze)
• Integrated Power-on Reset and Brown-out Reset
• 2.1 mA/MHz dynamic current (typical)
• 50
μA
I
PD
current (typical)
Input/Output
• Sink/Source up to 10 mA (pin specific) for stan-
dard V
OH
/V
OL
, up to 16 mA (pin specific) for
non-standard V
OH1
• 5V-tolerant pins
• Selectable open drain, pull-ups, and pull-downs
• Up to 5 mA overvoltage clamp current
• External interrupts on all I/O pins
Advanced Analog Features
• Two ADC modules:
- Configurable as 10-bit, 1.1 Msps with four
S&H or 12-bit, 500 ksps with one S&H
- 18 analog inputs on 64-pin devices and up to
32 analog inputs on 100-pin devices
• Flexible and independent ADC trigger sources
Qualification and Class B Support
• AEC-Q100 REVG (Grade 1 -40ºC to +125ºC)
• AEC-Q100 REVG (Grade 0 -40ºC to +150ºC)
• Class B Safety Library, IEC 60730
Debugger Development Support
In-circuit and in-application programming
Two program and two complex data breakpoints
IEEE 1149.2-compatible (JTAG) boundary scan
Trace and run-time watch
Packages
Type
QFN
TQFP
64
0.50
53
10x10x1
TQFP
80
0.50
69
12x12x1
TQFP
100
0.40
85
14x14x1
Pin Count
64
Contact Lead/Pitch
0.50
I/O Pins
53
Dimensions
9x9x0.9
Note:
All dimensions are in millimeters (mm) unless specified.
2009-2012 Microchip Technology Inc.
DS70593D-page 1

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