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5962-01-220-9333

产品描述Standard SRAM, 16KX1, 45ns, CMOS, CDIP20
产品类别存储    存储   
文件大小97KB,共9页
制造商IDT (Integrated Device Technology)
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5962-01-220-9333概述

Standard SRAM, 16KX1, 45ns, CMOS, CDIP20

5962-01-220-9333规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
Reach Compliance Codenot_compliant
最长访问时间45 ns
I/O 类型SEPARATE
JESD-30 代码R-XDIP-T20
内存密度16384 bit
内存集成电路类型STANDARD SRAM
内存宽度1
端子数量20
字数16384 words
字数代码16000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织16KX1
输出特性3-STATE
封装主体材料CERAMIC
封装代码DIP
封装等效代码DIP20,.3
封装形状RECTANGULAR
封装形式IN-LINE
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源5 V
认证状态Not Qualified
筛选级别38535Q/M;38534H;883B
最大待机电流0.01 A
最小待机电流4.5 V
最大压摆率0.1 mA
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间6
Base Number Matches1

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CMOS Static RAM
16K (16K x 1-Bit)
IDT6167SA
IDT6167LA
x
Features
High-speed (equal access and cycle time)
– Military: 25/35/45/55/70/85/100ns (max.)
– Commercial: 15/20/25ns (max.)
Low power consumption
Battery backup operation — 2V data retention voltage
(IDT6167LA only)
Available in 20-pin CERDIP and Plastic DIP, and 20-pin SOJ
Produced with advanced CMOS high-performance
technology
CMOS process virtually eliminates alpha particle
soft-error rates
Separate data input and output
Military product compliant to MIL-STD-883, Class B
high reliability CMOS technology.
Access times as fast as 15ns are available. The circuit also offers
a reduced power standby mode. When
CS
goes HIGH, the circuit
will automatically go to, and remain in, a standby mode as long as
CS
remains HIGH. This capability provides significant system-level power
and cooling savings. The low-power (LA) version also offers a battery
backup data retention capability where the circuit typically consumes
only 1µW operating off a 2V battery.
All inputs and the output of the IDT6167 are TTL-compatible and
operate from a single 5V supply, thus simplifying system designs.
The IDT6167 is packaged in a space-saving 20-pin, 300 mil Plastic
DIP or CERDIP and a Plastic 20-pin providing high board-level packing
densities.
Military grade product is manufactured in compliance with the
latest revision of MIL-STD-883, Class B, making it ideally suited to
military temperature applications demanding the highest level of
performance and reliability.
x
x
x
x
x
x
x
Description
The lDT6167 is a 16,384-bit high-speed static RAM organized
as 16K x 1. The part is fabricated using IDT’s high-performance,
Functional Block Diagram
A
0
V
CC
GND
ADDRESS
DECODE
16,384-BIT
MEMORY ARRAY
A
13
D
IN
I/O CONTROL
D
OUT
,
CS
CONTROL
LOGIC
WE
2981 drw 01
FEBRUARY 2001
1
©2000 Integrated Device Technology, Inc.
DSC-2981/08

5962-01-220-9333相似产品对比

5962-01-220-9333 5962-01-210-6436 5962-01-370-9372 5962-01-175-4872 5962-01-172-6892 5962-01-237-5400 5962-01-354-8223
描述 Standard SRAM, 16KX1, 45ns, CMOS, CDIP20 Standard SRAM, 16KX1, 70ns, CMOS, CDIP20 Standard SRAM, 16KX1, 100ns, CMOS, CDIP20 Standard SRAM, 16KX1, 70ns, CMOS, CDIP20 Standard SRAM, 16KX1, 70ns, CMOS, CDIP20 Standard SRAM, 16KX1, 100ns, CMOS, CDIP20 Standard SRAM, 16KX1, 45ns, CMOS, CDIP20
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合
Reach Compliance Code not_compliant _compli not_compliant not_compliant _compli _compli not_compliant
最长访问时间 45 ns 70 ns 100 ns 70 ns 70 ns 100 ns 45 ns
I/O 类型 SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE
JESD-30 代码 R-XDIP-T20 R-XDIP-T20 R-XDIP-T20 R-XDIP-T20 R-XDIP-T20 R-XDIP-T20 R-XDIP-T20
内存密度 16384 bit 16384 bi 16384 bit 16384 bit 16384 bi 16384 bi 16384 bit
内存集成电路类型 STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
内存宽度 1 1 1 1 1 1 1
端子数量 20 20 20 20 20 20 20
字数 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words
字数代码 16000 16000 16000 16000 16000 16000 16000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
组织 16KX1 16KX1 16KX1 16KX1 16KX1 16KX1 16KX1
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
封装代码 DIP DIP DIP DIP DIP DIP DIP
封装等效代码 DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 260 260 260 260 260
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
筛选级别 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子形式 THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
端子节距 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 6 6 6 6 6 6 6
厂商名称 IDT (Integrated Device Technology) - - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) -
最大待机电流 0.01 A 0.01 A - 0.01 A 0.01 A - 0.01 A
最小待机电流 4.5 V 4.5 V - 4.5 V 4.5 V 2 V 4.5 V
最大压摆率 0.1 mA 0.1 mA - 0.1 mA 0.1 mA - 0.1 mA
Base Number Matches 1 1 1 1 - - -

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