HD74LS30
8-input Positive NAND Gate
REJ03D0404–0200
Rev.2.00
Feb.18.2005
Features
•
Ordering Information
Part Name
HD74LS30P
HD74LS30FPEL
HD74LS30RPEL
Package Type
DILP-14 pin
SOP-14 pin (JEITA)
SOP-14 pin (JEDEC)
Package Code
(Previous Code)
PRDP0014AB-B
(DP-14AV)
PRSP0014DF-B
(FP-14DAV)
PRSP0014DE-A
(FP-14DNV)
Package
Abbreviation
P
FP
RP
Taping Abbreviation
(Quantity)
—
EL (2,000 pcs/reel)
EL (2,500 pcs/reel)
Note: Please consult the sales office for the above package availability.
Pin Arrangement
A
B
C
D
E
F
GND
1
2
3
4
5
6
7
14
13
12
11
10
9
8
V
CC
NC
H
G
NC
NC
Y
(Top view)
Rev.2.00, Feb.18.2005, page 1 of 5
HD74LS30
Circuit Schematic
V
CC
17k
Inputs
A
B
C
D
E
F
G
H
GND
1.5k
3k
4.5k
Output
Y
8k
75
Absolute Maximum Ratings
Item
Supply voltage
Input voltage
Power dissipation
Storage temperature
Symbol
V
CC
V
IN
P
T
Tstg
Ratings
7
7
400
–65 to +150
Unit
V
V
mW
°C
Note: Voltage value, unless otherwise noted, are with respect to network ground terminal.
Recommended Operating Conditions
Item
Supply voltage
Output current
Operating temperature
Symbol
V
CC
I
OH
I
OL
Topr
Min
4.75
—
—
–20
Typ
5.00
—
—
25
Max
5.25
–400
8
75
Unit
V
µA
mA
°C
Rev.2.00, Feb.18.2005, page 2 of 5
HD74LS30
Electrical Characteristics
(Ta = –20 to +75 °C)
Item
Input voltage
Symbol
V
IH
V
IL
V
OH
V
OL
I
IH
I
IL
I
I
Short-circuit output
current
Supply current
I
OS
I
CCH
I
CCL
min.
2.0
—
2.7
—
—
—
—
—
–20
—
—
—
typ.*
—
—
—
—
—
—
—
—
—
0.35
0.6
—
max.
—
0.8
—
0.5
0.4
20
–0.4
0.1
–100
0.5
1.1
–1.5
Unit
V
V
V
V
µA
mA
mA
mA
mA
mA
V
Condition
Output voltage
Input current
V
CC
= 4.75 V, V
IL
= 0.8 V, I
OH
= –400
µA
I
OL
= 8 mA
V
CC
= 4.75 V, V
IH
= 2 V
I
OL
= 4 mA
V
CC
= 5.25 V, V
I
= 2.7 V
V
CC
= 5.25 V, V
I
= 0.4 V
V
CC
= 5.25 V, V
I
= 7 V
V
CC
= 5.25 V
V
CC
= 5.25 V
V
CC
= 5.25 V
V
CC
= 4.75 V, I
IN
= –18 mA
Input clamp voltage
V
IK
Note: * V
CC
= 5 V, Ta = 25
°
C
Switching Characteristics
(V
CC
= 5 V, Ta = 25°C)
Item
Propagation delay time
Symbol
t
PLH
t
PHL
min.
—
—
typ.
8
13
max.
15
20
Unit
ns
ns
Condition
C
L
= 15 pF, R
L
= 2 kΩ
Note: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D0005-
0100)".
Rev.2.00, Feb.18.2005, page 3 of 5
HD74LS30
Package Dimensions
JEITA Package Code
P-DIP14-6.3x19.2-2.54
RENESAS Code
PRDP0014AB-B
Previous Code
DP-14AV
MASS[Typ.]
0.97g
D
14
8
1
b
3
7
Z
E
Reference
Symbol
Dimension in Millimeters
Min
Nom
7.62
19.2
6.3
20.32
7.4
5.06
0.51
0.40
0.48
1.30
0.19
0°
2.29
2.54
0.25
0.31
15°
2.79
2.39
2.54
0.56
Max
A
A
1
e
1
D
E
L
A
A
1
b
p
e
b
p
θ
e
1
c
b
3
c
θ
e
Z
( Ni/Pd/Au plating )
L
JEITA Package Code
P-SOP14-5.5x10.06-1.27
RENESAS Code
PRSP0014DF-B
Previous Code
FP-14DAV
MASS[Typ.]
0.23g
*1
D
8
F
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
14
b
p
H
E
E
Index mark
*2
c
Reference
Symbol
Dimension in Millimeters
Min
Nom
10.06
5.50
Max
10.5
Terminal cross section
( Ni/Pd/Au plating )
1
Z
e
*3
D
E
A
2
A
1
0.00
7
b
p
x
M
L
1
0.10
0.20
2.20
A
b
p
b
1
c
c
1
0.34
0.40
0.46
0.15
0.20
0.25
A
θ
H
E
0°
7.50
7.80
1.27
8°
8.00
θ
A
1
y
L
e
x
y
0.12
0.15
1.42
0.50
1
Detail F
Z
L
L
0.70
1.15
0.90
Rev.2.00, Feb.18.2005, page 4 of 5
HD74LS30
JEITA Package Code
P-SOP14-3.95x8.65-1.27
RENESAS Code
PRSP0014DE-A
Previous Code
FP-14DNV
MASS[Typ.]
0.13g
*1
D
8
F
14
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
b
p
*2
Index mark
H
E
E
c
Reference
Symbol
Dimension in Millimeters
Min
Nom
8.65
3.95
Max
9.05
Terminal cross section
( Ni/Pd/Au plating )
1
Z
e
*3
D
E
A
2
7
b
p
x
M
L
1
A
1
A
b
p
b
1
c
c
1
0.10
0.14
0.25
1.75
0.34
0.40
0.46
0.15
0.20
0.25
A
θ
H
E
0°
5.80
6.10
1.27
8°
6.20
θ
A
1
L
e
x
y
0.25
0.15
0.635
0.40
1
y
Detail F
Z
L
L
0.60
1.08
1.27
Rev.2.00, Feb.18.2005, page 5 of 5
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