125 kHz Passive RFID Device with Sensor Input
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | WAFER |
| 包装说明 | DIE, |
| 针数 | 6 |
| Reach Compliance Code | compli |
| JESD-30 代码 | R-XUUC-N6 |
| JESD-609代码 | e3 |
| 功能数量 | 1 |
| 端子数量 | 6 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装形状 | RECTANGULAR |
| 封装形式 | UNCASED CHIP |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 标称供电电压 | 2 V |
| 表面贴装 | YES |
| 电信集成电路类型 | TELECOM CIRCUIT |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| Base Number Matches | 1 |
| MCRF202-I/W | MCRF202 | MCRF202-I/S | MCRF202-I/P | MCRF202-I/SB | MCRF202-I/SN | MCRF202-I/WF | MCRF202-I/WQ99 | MCRF202-I/WB | MCRF202-I/WFB | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 125 kHz Passive RFID Device with Sensor Input | 125 kHz Passive RFID Device with Sensor Input | 125 kHz Passive RFID Device with Sensor Input | 125 kHz Passive RFID Device with Sensor Input | 125 kHz Passive RFID Device with Sensor Input | 125 kHz Passive RFID Device with Sensor Input | 125 kHz Passive RFID Device with Sensor Input | 125 kHz Passive RFID Device with Sensor Input | 125 kHz Passive RFID Device with Sensor Input | 125 kHz Passive RFID Device with Sensor Input |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - | - |
| 零件包装代码 | WAFER | - | WAFER | DIP | DIE | SOIC | WAFER | WAFER | WAFER | WAFER |
| 包装说明 | DIE, | - | DIE, | 0.300 INCH, PLASTIC, MS-001, DIP-8 | DIE, | SOP, SOP8,.25 | DIE, | DIE, | DIE, | DIE, |
| 针数 | 6 | - | 6 | 8 | 6 | 8 | 6 | 6 | 6 | 5 |
| Reach Compliance Code | compli | - | compli | unknow | compli | compli | compli | compli | unknow | unknow |
| JESD-30 代码 | R-XUUC-N6 | - | R-XUUC-N6 | R-PDIP-T8 | R-XUUC-N6 | R-PDSO-G8 | R-XUUC-N6 | R-XUUC-N6 | R-XUUC-N6 | R-XUUC-N5 |
| JESD-609代码 | e3 | - | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 6 | - | 6 | 8 | 6 | 8 | 6 | 6 | 6 | 5 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | - | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DIE | - | DIE | DIP | DIE | SOP | DIE | DIE | DIE | DIE |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | UNCASED CHIP | - | UNCASED CHIP | IN-LINE | UNCASED CHIP | SMALL OUTLINE | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 260 | 260 | 260 | 260 | 260 | - | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 2 V | - | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | - | - |
| 表面贴装 | YES | - | YES | NO | YES | YES | YES | YES | YES | YES |
| 电信集成电路类型 | TELECOM CIRCUIT | - | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | MATTE TIN | - | MATTE TIN | Matte Tin (Sn) | MATTE TIN | Matte Tin (Sn) | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN |
| 端子形式 | NO LEAD | - | NO LEAD | THROUGH-HOLE | NO LEAD | GULL WING | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | UPPER | - | UPPER | DUAL | UPPER | DUAL | UPPER | UPPER | UPPER | UPPER |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 40 | - | - |
| Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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