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1206J0500563MXBE03

产品描述Feed Through Capacitor, 2 Function(s), 50V, EIA STD PACKAGE SIZE 1206
产品类别模拟混合信号IC    过滤器   
文件大小413KB,共2页
制造商Knowles
官网地址http://www.knowles.com
标准
下载文档 详细参数 全文预览

1206J0500563MXBE03概述

Feed Through Capacitor, 2 Function(s), 50V, EIA STD PACKAGE SIZE 1206

1206J0500563MXBE03规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Knowles
包装说明EIA STD PACKAGE SIZE 1206
Reach Compliance Codecompliant
其他特性NICKEL BARRIER TERMINATION
电容56000 µF
滤波器类型FEED THROUGH CAPACITOR
高度1.1 mm
最小绝缘电阻10000 MΩ
JESD-609代码e3
长度3.2 mm
制造商序列号X2Y
安装类型SURFACE MOUNT
功能数量2
最高工作温度125 °C
最低工作温度-55 °C
包装方法BULK
物理尺寸L3.2XB1.6XH1.1 (mm)/L0.126XB0.063XH0.043 (inch)
额定电压50 V
端子面层Matte Tin (Sn) - with Nickel (Ni) barrier
宽度1.6 mm
Base Number Matches1

文档预览

下载PDF文档
sales@syfer.co.uk
www.syfer.com
Surface mount EMI filters
X2Y Integrated Passive Components
X2Y
The Syfer X2Y Integrated Passive Component is a 3
terminal EMI chip device.
When used in balanced line applications, the
revolutionary design provides simultaneous line-to-
line and line-to-ground filtering, using a single ceramic
chip. In this way, differential and common mode
filtering are provided in one device.
For unbalanced applications, it provides ultra low ESL
(equivalent series inductance). Capable of replacing 2
or more conventional devices, it is ideal for balanced
and unbalanced lines, twisted pairs and dc motors, in
automotive, audio, sensor and other applications.
Available in sizes from 0603 to 2220, these filters can
prove invaluable in meeting stringent EMC demands.
Manufactured in the UK by Syfer Technology Limited under licence from X2Y attenuators LLC.
+44 1603 723310
+44 1603 723301
Dielectric
X7R or C0G/NP0
Typical capacitance matching
Better than 5%
Temperature rating
-55°C to 125°C
Insulation resistance
100Gohms or 1000s (whichever is the less)
Syfer Technology Limited
Electrical configuration
Multiple capacitance
Capacitance measurement
At 1000hr point
Dielectric withstand voltage
<200V 2.5 times rated Volts for 5 secs
500V 1.5 times rated Volts for 5 secs
Charging current limited to 50mA Max.
Type
Chip size
Rated
voltage
16Vdc
25Vdc
50Vdc
100Vdc
200Vdc
500Vdc
Dielectric
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
150pF
15nF
120pF
12nF
10pF - 100pF
150pF - 10nF
-
-
-
-
-
-
-
-
560pF - 820pF
56nF - 68nF
390pF - 470pF
18nF - 47nF
10pF - 330pF
470pF - 15nF
-
-
-
-
0603
L
W
1.6±0.2
(0.063±0.008)
0.8±0.2
(0.03±0.008)
0.5±0.15
(0.02±0.006)
0.4±0.15
(0.016±0.006)
0.25±0.15
(0.010±0.006)
E03
0603
0805
1206
1410
1812
2220
Minimum and maximum capacitance values
-
-
1.8nF - 3.3nF
-
1.2nF - 1.5nF
56nF - 220nF
22pF - 1.0nF
1.5nF - 47nF
22pF - 1.0nF
820pF - 33nF
-
-
0805
2.0±0.3
(0.08±0.012)
1.25±0.2
(0.05±0.008)
1.0±0.15
(0.04±0.006)
0.5±0.25
(0.02±0.01)
0.3±0.15
(0.012±0.006)
-
-
6.8nF - 8.2nF
470nF
4.7nF - 5.6nF
180nF - 400nF
100pF - 3.9nF
4.7nF - 150nF
100pF - 3.3nF
1.2nF - 120nF
-
-
1206
3.2±0.3
(0.126±0.012)
1.60±0.2
(0.063±0.008)
1.1±0.2
(0.043±0.008)
0.95±0.3
(0.037±0.012)
0.5±0.25
(0.02±0.01)
-
-
12nF - 15nF
820nF
8.2nF - 10nF
390nF - 680nF
820pF - 6.8nF
8.2nF - 330nF
820pF - 5.6nF
2.7nF - 180nF
820pF - 3.9nF
2.7nF - 100nF
1410
3.6±0.3
(0.14±0.012)
2.5±0.3
(0.1±0.012)
2.0 max.
(0.08 max.)
1.20±0.3
(0.047±0.012)
0.5±0.25
(0.02±0.01)
-
-
22nF - 33nF
1.2µF
18nF
560nF - 1.0µF
1.0nF - 15nF
10nF - 470nF
1.0nF - 15nF
4.7nF - 470nF
1.0nF - 10nF
4.7nF - 180nF
2220
5.7±0.4
(0.22±0.016)
5.0±0.4
(0.2±0.016)
2.5 max.
(0.1 max.)
2.25±0.4
(0.09±0.016)
0.75±0.25
(0.03±0.01)
Notes: 1) For some lower capacitance parts, higher voltage
rated parts may be supplied.
1812
4.5±0.35
(0.18±0.014)
3.2±0.3
(0.126±0.012)
2.1 max.
(0.08 max.)
1.4±0.35
(0.06±0.014)
0.75±0.25
(0.03±0.01)
L
T
B1
T
W
B2
B2
B1
Notes: 1) All dimensions mm (inches).
2) Pad widths less than chip width gives improved mechanical performance.
3) The solder stencil should place 4 discrete solder pads. The un-printed distance between
ground pads is shown as dim E.
4) Insulating the earth track underneath the filters is acceptable and can help avoid
displacement of filter during soldering
but can result in residue entrapment under the chip.
Recommended solder lands
D
B
E
A
0603
A
B
C
D
0.6 (0.024)
0.6 (0.024)
0.4 (0.016)
0.2 (0.008)
0.4 (0.016)
0805
0.95 (0.037)
0.9 (0.035)
0.3 (0.012)
0.4 (0.016)
0.75 (0.030)
1206
1.2 (0.047)
0.9 (0.035)
0.6 (0.024)
0.8 (0.031 )
1.0 (0.039)
1410
2.05 (0.08)
1.0 (0.040)
0.7 (0.028)
0.9 (0.035)
1.85 (0.071)
1812
2.65 (0.104)
1.4 (0.055)
0.8 (0.031)
1.4 (0.055)
2.05 (0.080)
2220
4.15 (0.163)
1.4 (0.055)
1.2 (0.047)
1.8 (0.071)
3.95 (0.156)
C
E
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