Qualification Test
Report
501-325
01Mar10 Rev A
All Paragraphs Revised
AMP-LATCH* and IDC Header Connectors, .100 X .100 Inch
Grid
1.
1.1.
INTRODUCTION
Purpose
Testing was performed on AMP-LATCH* and IDC Header Connectors to determine their conformance
to the requirements of Product Specification 108-40018, Revision E.
1.2.
Scope
This report covers the electrical, mechanical, and environmental performance of AMP-LATCH* and IDC
Header Connectors. Testing was performed at the Harrisburg Electrical Components Test Laboratory
between 14Sep95 and 03Nov95, additional testing was performed on low profile headers between
28Jan10 and 23Feb10. The test file numbers for this testing are CTL5227-074-019 and EA20100084T
respectively. This documentation is on file at and available from the Harrisburg Electrical Components
Test Laboratory.
1.3.
Conclusion
Specimens listed in paragraph 1.4. conformed to the electrical, mechanical, and environmental
performance requirements of Product Specification 108-40018, Revision E.
1.4.
Test Specimens
Test specimens were representative of normal production lots. A Certificate of Conformance (C of C)
was issued stating that all specimens in the test package were produced, inspected, and accepted as
conforming to product drawing requirements, and were manufactured using the same core
manufacturing processes and technologies as production parts. Specimens identified with the following
part numbers were used for test:
Test Group Quantity Part Number
1,3
2,3
3
1,3
5 each
5 each
5 each
5 each
5
5
5 each
Description
1-103308-0 Low profile header assembly
1-102153-0 Universal header assembly
1-103310-0 Low profile header assembly
1-102159-0 Universal header assembly
104338-9
Low profile, high temperature header assembly
1-111008-0 Universal header for vapor-phase applications
5103308-1 Low profile, vertical header assembly
Figure 1
1.5.
Environmental Conditions
Unless otherwise stated, the following environmental conditions prevailed during testing:
!
!
Temperature: 15 to 35°C
Relative Humidity: 25 to 75%
©2010 Tyco Electronics Corporation
Harrisburg, PA
All International Rights Reserved
* Trademark
| Indicates change
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LOC B
501-325
1.6.
Test Sequence
Test Group (a)
Test or Examination
Examination of product
Insulation resistance
Withstanding voltage
Solderability
Component resistance to wave soldering
Contact retention
Thermal shock
Humidity/temperature cycling
NOTE
(a)
(b)
2
4
4
5
2
1
1,3,5
2
1,3
3
1,8
2,6
3,7
Test Sequence (b)
See paragraph 1.4.
Numbers indicate sequence in which tests are performed.
Figure 2
2.
2.1.
SUMMARY OF TESTING
Examination of Product
Specimens were visually examined and no evidence of physical damage detrimental to product
performance was observed.
2.2.
Insulation Resistance
All insulation resistance measurements were greater than 5000 megohms initially, and greater than
1000 megohms after testing.
2.3.
Withstanding Voltage
No dielectric breakdown or flashover occurred.
2.4.
Solderability
All contact leads had a minimum of 95% solder coverage.
2.5.
Component Resistance to Wave Soldering
No specimen exhibited any visual evidence of blistering, warpage, or significant discoloration. Slight
discoloration was observed around the contacts as viewed from the bottom of the connectors using a
microscope. No discoloration or other anomalies were observed when viewing the connectors from the
inside.
2.6.
Contact Retention
No physical damage occurred to either the contacts or the housing as a result applying an axial load to
the contacts for 6 seconds.
Rev A
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501-325
2.7.
Thermal Shock
No evidence of physical damage was visible as a result of thermal shock testing.
2.8.
Humidity/temperature Cycling
No evidence of physical damage was visible as a result of humidity/temperature cycling.
3.
3.1.
TEST METHODS
Examination of Product
Specimens were visually examined for evidence of physical damage detrimental to product
performance.
3.2.
Insulation Resistance
Insulation resistance was measured between adjacent contacts of unmated specimens. A test voltage
of 500 volts DC was applied for 2 minutes before the resistance was measured.
3.3.
Withstanding Voltage
A test potential of 1000 volts AC was applied between adjacent contacts of unmated specimens. This
potential was applied for 1 minute and then returned to zero.
3.4.
Solderability
Contact solder tails were immersed in a non-activated rosin flux for 5 to 10 seconds, allowed to drain for
10 to 60 seconds and then held over molten Sn60/Pb40 solder maintained at 245°C without contact for
2 seconds. The contact solder tails were then immersed in the molten solder at a maximum rate of 1
inch per second, held in the molten solder for 3 to 5 seconds and then withdrawn at a maximum rate of
1 inch per second. Specimens were cleaned using isopropyl alcohol and then visually examined for
solder coverage.
3.5.
Component Resistance to Wave Soldering
Specimens were placed on .061 inch thick printed circuit board and the solderable areas of the
specimens immersed in non-activated rosin flux type ROL0 maintained at room temperature for 5 to 10
seconds, removed from the flux, and allowed to drain for 5 to 20 seconds. The specimens were
attached to a dipping machine and immersed at a rate of approximately 1 inch per second into a
Sn60/Pb40 solder bath maintained at 240 ± 5°C to a point where the component body was 1 to 2 mm
above the solder surface, held in the solder bath for 10 seconds, and then removed at a rate of
approximately 1 inch per second. Specimens were cleaned for 5 minutes using isopropyl alcohol and
then given a visual examination under 30X magnification.
Rev A
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501-325
3.6.
Contact Retention
An axial load of 2 pounds was applied to each individual contact and held for 6 seconds (see Figure 3).
Figure 3
3.7.
Thermal Shock
Unmated specimens were subjected to 5 cycles between -65 and 105°C with 30 minute dwells at each
temperature extreme. Transition between extremes was less than 1 minute.
3.8.
Humidity/temperature Cycling
Unmated specimens were exposed to 10 humidity/temperature cycles. Each cycle lasted 24 hours and
consisted of cycling the temperature between 25 and 65°C twice while maintaining high humidity (see
Figure 4).
Figure 4
Rev A
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