16-BIT, 20.5MHz, OTHER DSP, CDIP40, CERAMIC, DIP-40
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP40,.6 |
| 针数 | 40 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.2.C |
| 地址总线宽度 | 12 |
| 桶式移位器 | YES |
| 位大小 | 16 |
| 边界扫描 | NO |
| 最大时钟频率 | 20.5 MHz |
| 外部数据总线宽度 | 16 |
| 格式 | FIXED POINT |
| 集成缓存 | NO |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | R-CDIP-T40 |
| 低功率模式 | NO |
| DMA 通道数量 | |
| 外部中断装置数量 | 1 |
| 串行 I/O 数 | |
| 端子数量 | 40 |
| 计时器数量 | |
| 片上数据RAM宽度 | 16 |
| 片上程序ROM宽度 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP40,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM(字数) | 144 |
| ROM可编程性 | MROM |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm |
| 最大压摆率 | 65 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| 5962-8763301QA | 5962-8763306QA | 5962-8763308XA | 5962-8763306XA | 46-4373-620 | 5962-8763307XA | 5962-8763301XA | |
|---|---|---|---|---|---|---|---|
| 描述 | 16-BIT, 20.5MHz, OTHER DSP, CDIP40, CERAMIC, DIP-40 | 16-BIT, 20.5MHz, OTHER DSP, CDIP40, CERAMIC, DIP-40 | 16-BIT, 25.6MHz, OTHER DSP, PQCC44 | 16-BIT, 20.5MHz, OTHER DSP, PQCC44 | EDGE CONNECTOR,PCB MNT,RECEPT,40 CONTACTS,0.156 PITCH,COMPLIANT FIT TERMINAL | 16-BIT, 20.5MHz, OTHER DSP, PQCC44 | 16-BIT, 20.5MHz, OTHER DSP, PQCC44 |
| Reach Compliance Code | not_compliant | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | EAR99 | 3A001.A.2.C | 3A001.A.2.C |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 120 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 3.9624 mm | 1.27 mm | 1.27 mm |
| 包装说明 | DIP, DIP40,.6 | DIP, | QCCJ, | - | - | QCCJ, | QCCJ, |
| 地址总线宽度 | 12 | 12 | 12 | 12 | - | 12 | 12 |
| 桶式移位器 | YES | YES | YES | YES | - | YES | YES |
| 边界扫描 | NO | NO | NO | NO | - | NO | NO |
| 最大时钟频率 | 20.5 MHz | 20.5 MHz | 25.6 MHz | 20.5 MHz | - | 20.5 MHz | 20.5 MHz |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 | - | 16 | 16 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | - | FIXED POINT | FIXED POINT |
| 集成缓存 | NO | NO | NO | NO | - | NO | NO |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | - | MULTIPLE | MULTIPLE |
| JESD-30 代码 | R-CDIP-T40 | R-CDIP-T40 | S-PQCC-J44 | S-PQCC-J44 | - | S-PQCC-J44 | S-PQCC-J44 |
| 低功率模式 | NO | NO | NO | NO | - | NO | NO |
| 外部中断装置数量 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 端子数量 | 40 | 40 | 44 | 44 | - | 44 | 44 |
| 片上数据RAM宽度 | 16 | 16 | 16 | 16 | - | 16 | 16 |
| 片上程序ROM宽度 | 16 | 16 | 16 | 16 | - | 16 | 16 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | QCCJ | QCCJ | - | QCCJ | QCCJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | - | SQUARE | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | - | CHIP CARRIER | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| RAM(字数) | 144 | 256 | 256 | 256 | - | 256 | 144 |
| ROM可编程性 | MROM | UVPROM | MROM | UVPROM | - | MROM | MROM |
| 座面最大高度 | 5.08 mm | 5.08 mm | 4.5 mm | 4.5 mm | - | 4.5 mm | 4.5 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | - | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | - | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | - | J BEND | J BEND |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | - | QUAD | QUAD |
| 宽度 | 15.24 mm | 15.24 mm | 16.585 mm | 16.585 mm | - | 16.585 mm | 16.585 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | - | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 | 1 | 1 | 1 | - | 1 | - |
| JESD-609代码 | - | e0 | e0 | e0 | - | e0 | e0 |
| 端子面层 | - | TIN LEAD | TIN LEAD | TIN LEAD | - | TIN LEAD | TIN LEAD |
| 长度 | - | - | 16.585 mm | 16.585 mm | - | 16.585 mm | 16.585 mm |
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