Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CQCC20, LCC-20
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, |
| 针数 | 20 |
| Reach Compliance Code | compliant |
| 其他特性 | BROADSIDE VERSION OF 2374 |
| 系列 | FCT |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e3 |
| 长度 | 8.89 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 5.2 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.54 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| IDT74FCT2574CTLG | IDT74FCT2574ATLG | IDT74FCT534ATPG | IDT74FCT534CTPG | IDT74FCT534TPG | IDT74FCT574DTLG | IDT74FCT574DTEG | IDT74FCT2574TL | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CQCC20, LCC-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CQCC20, LCC-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, Inverted Output, CMOS, PDSO20, TSSOP-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, Inverted Output, CMOS, PDSO20, TSSOP-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, Inverted Output, CMOS, PDSO20, TSSOP-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CQCC20, LCC-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20, CERPACK-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CQCC20, LCC-20 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 不符合 |
| 零件包装代码 | QLCC | QLCC | TSSOP | TSSOP | TSSOP | QLCC | DFP | QLCC |
| 包装说明 | QCCN, | QCCN, | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 | QCCN, | CERPACK-20 | QCCN, |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | compliant | compliant | unknown | unknown | unknown | compliant | compliant | compliant |
| 其他特性 | BROADSIDE VERSION OF 2374 | BROADSIDE VERSION OF 2374 | - | - | - | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 2374 |
| 系列 | FCT | FCT | - | FCT | - | FCT | FCT | FCT |
| JESD-30 代码 | S-CQCC-N20 | S-CQCC-N20 | - | R-PDSO-G20 | - | S-CQCC-N20 | R-GDFP-F20 | S-CQCC-N20 |
| JESD-609代码 | e3 | e3 | - | e3 | - | e3 | e3 | e0 |
| 长度 | 8.89 mm | 8.89 mm | - | 6.5 mm | - | 8.89 mm | - | 8.89 mm |
| 负载电容（CL） | 50 pF | 50 pF | - | 50 pF | - | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | - | 8 | - | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | - | 1 | - | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | - | 2 | - | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | - | 20 | - | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | - | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | TRUE | TRUE | - | INVERTED | - | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - | PLASTIC/EPOXY | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | QCCN | - | TSSOP | - | QCCN | DFP | QCCN |
| 封装形状 | SQUARE | SQUARE | - | RECTANGULAR | - | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | CHIP CARRIER | FLATPACK | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 260 | 260 | - | 260 | - | 260 | 260 | 225 |
| 传播延迟（tpd） | 5.2 ns | 6.5 ns | - | 5.2 ns | - | 4.2 ns | 4.2 ns | 10 ns |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.54 mm | 2.54 mm | - | 1.2 mm | - | 2.54 mm | 2.3368 mm | 2.54 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | - | 5.25 V | - | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | - | 4.75 V | - | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | - | YES | - | YES | YES | YES |
| 技术 | CMOS | CMOS | - | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | MATTE TIN | MATTE TIN | - | Matte Tin (Sn) - annealed | - | MATTE TIN | MATTE TIN | TIN LEAD |
| 端子形式 | NO LEAD | NO LEAD | - | GULL WING | - | NO LEAD | FLAT | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | - | 0.65 mm | - | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | - | DUAL | - | QUAD | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 30 | - | 40 | - | 30 | 30 | 30 |
| 宽度 | 8.89 mm | 8.89 mm | - | 4.4 mm | - | 8.89 mm | 6.9215 mm | 8.89 mm |
| 厂商名称 | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - |
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