4000/14000/40000 SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, CDFP24, CERAMIC, FP-24
| 参数名称 | 属性值 |
| 零件包装代码 | DFP |
| 包装说明 | DFP, FL24,.4 |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 其他特性 | ADDRESS LATCHES |
| 系列 | 4000/14000/40000 |
| 输入调节 | LATCHED |
| JESD-30 代码 | R-CDFP-F24 |
| JESD-609代码 | e4 |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER |
| 最大I(ol) | 0.00064 A |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP |
| 封装等效代码 | FL24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 电源 | 5/15 V |
| Prop。Delay @ Nom-Sup | 1310 ns |
| 传播延迟(tpd) | 1310 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class V |
| 座面最大高度 | 2.92 mm |
| 最大供电电压 (Vsup) | 18 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 总剂量 | 100k Rad(Si) V |
| 宽度 | 9.905 mm |
| Base Number Matches | 1 |

| 5962R9668101VXC | 5962R9668101VJC | 5962R9668101V9A | |
|---|---|---|---|
| 描述 | 4000/14000/40000 SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, CDFP24, CERAMIC, FP-24 | 4000/14000/40000 SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, CDIP24 | 4000/14000/40000 SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, UUC24, DIE-24 |
| 零件包装代码 | DFP | DIP | DIE |
| 包装说明 | DFP, FL24,.4 | DIP, DIP24,.6 | DIE, DIE OR CHIP |
| 针数 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 |
| 系列 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
| 输入调节 | LATCHED | LATCHED | LATCHED |
| JESD-30 代码 | R-CDFP-F24 | R-CDIP-T24 | R-XUUC-N24 |
| JESD-609代码 | e4 | e4 | e0 |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 输出极性 | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
| 封装代码 | DFP | DIP | DIE |
| 封装等效代码 | FL24,.4 | DIP24,.6 | DIE OR CHIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | UNCASED CHIP |
| 电源 | 5/15 V | 5/15 V | 5/15 V |
| Prop。Delay @ Nom-Sup | 1310 ns | 1310 ns | 1310 ns |
| 传播延迟(tpd) | 1310 ns | 1310 ns | 1310 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V |
| 最大供电电压 (Vsup) | 18 V | 18 V | 18 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子面层 | GOLD | GOLD | TIN LEAD |
| 端子形式 | FLAT | THROUGH-HOLE | NO LEAD |
| 端子位置 | DUAL | DUAL | UPPER |
| 总剂量 | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V |
| Base Number Matches | 1 | 1 | 1 |
| 其他特性 | ADDRESS LATCHES | ADDRESS LATCHES | - |
| 最大I(ol) | 0.00064 A | 0.00064 A | - |
| 座面最大高度 | 2.92 mm | 5.72 mm | - |
| 端子节距 | 1.27 mm | 2.54 mm | - |
| 宽度 | 9.905 mm | 15.24 mm | - |
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