IC,LOGIC GATE,HEX INVERTER,HC-CMOS,LLCC,20PIN,CERAMIC
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | NXP(恩智浦) |
包装说明 | QCCN, LCC20,.35SQ |
Reach Compliance Code | unknown |
JESD-30 代码 | S-XQCC-N20 |
JESD-609代码 | e0 |
逻辑集成电路类型 | INVERTER |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC |
封装代码 | QCCN |
封装等效代码 | LCC20,.35SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | 2/6 V |
认证状态 | Not Qualified |
施密特触发器 | YES |
筛选级别 | 38535Q/M;38534H;883B |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
Base Number Matches | 1 |
54HC14M/B2AJC | MC74HC14AD-TR | MC74HC14D-TR | MC74VHC14DT | MC74VHC14M | |
---|---|---|---|---|---|
描述 | IC,LOGIC GATE,HEX INVERTER,HC-CMOS,LLCC,20PIN,CERAMIC | IC,LOGIC GATE,HEX INVERTER,HC-CMOS,SOP,14PIN,PLASTIC | IC,LOGIC GATE,HEX INVERTER,HC-CMOS,SOP,14PIN,PLASTIC | IC,LOGIC GATE,HEX INVERTER,AHC/VHC-CMOS,TSSOP,14PIN,PLASTIC | IC,LOGIC GATE,HEX INVERTER,AHC/VHC-CMOS,SOP,14PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
包装说明 | QCCN, LCC20,.35SQ | SOP, SOP14,.25 | SOP, SOP14,.25 | TSSOP, TSSOP14,.25 | SOP, SOP14,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | S-XQCC-N20 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
端子数量 | 20 | 14 | 14 | 14 | 14 |
最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCN | SOP | SOP | TSSOP | SOP |
封装等效代码 | LCC20,.35SQ | SOP14,.25 | SOP14,.25 | TSSOP14,.25 | SOP14,.3 |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
电源 | 2/6 V | 2/6 V | 2/6 V | 2/5.5 V | 2/5.5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
施密特触发器 | YES | YES | YES | YES | YES |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 0.635 mm | 1.27 mm |
端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | - |
负载电容(CL) | - | 50 pF | - | 50 pF | 50 pF |
最大I(ol) | - | 0.004 A | - | 0.008 A | 0.008 A |
Prop。Delay @ Nom-Sup | - | 24 ns | - | 12 ns | 12 ns |
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