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70T653MS12BCG8

产品描述Dual-Port SRAM, 512KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256
产品类别存储    存储   
文件大小706KB,共24页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

70T653MS12BCG8概述

Dual-Port SRAM, 512KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256

70T653MS12BCG8规格参数

参数名称属性值
厂商名称IDT (Integrated Device Technology)
包装说明LBGA,
Reach Compliance Codecompliant
最长访问时间12 ns
JESD-30 代码S-PBGA-B256
长度17 mm
内存密度18874368 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度36
功能数量1
端子数量256
字数524288 words
字数代码512000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织512KX36
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装形状SQUARE
封装形式GRID ARRAY, LOW PROFILE
并行/串行PARALLEL
座面最大高度1.5 mm
最大供电电压 (Vsup)2.6 V
最小供电电压 (Vsup)2.4 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子形式BALL
端子节距1 mm
端子位置BOTTOM
宽度17 mm
Base Number Matches1

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下载PDF文档
HIGH-SPEED 2.5V
512K x 36
ASYNCHRONOUS DUAL-PORT
STATIC RAM
WITH 3.3V 0R 2.5V INTERFACE
IDT70T653M
Features
True Dual-Port memory cells which allow simultaneous
access of the same memory location
High-speed access
– Commercial: 10/12/15ns (max.)
– Industrial: 12ns (max.)
RapidWrite Mode simplifies high-speed consecutive write
cycles
Dual chip enables allow for depth expansion without
external logic
IDT70T653M easily expands data bus width to 72 bits or
more using the Busy Input when cascading more than one
device
Busy input for port contention management
Interrupt Flags
Full on-chip hardware support of semaphore signaling
between ports
Fully asynchronous operation from either port
Separate byte controls for multiplexed bus and bus
matching compatibility
Sleep Mode Inputs on both ports
Single 2.5V (±100mV) power supply for core
LVTTL-compatible, selectable 3.3V (±150mV)/2.5V (±100mV)
power supply for I/Os and control signals on each port
Includes JTAG functionality
Available in a 256-ball Ball Grid Array
Industrial temperature range (–40°C to +85°C) is available
for selected speeds
Green parts available, see ordering information
Functional Block Diagram
BE
3L
BE
2L
BE
1L
BE
0L
BE
3R
BE
2R
BE
1R
BE
0R
R/
W
L
CE
0L
CE
1L
BBBB
EEEE
0123
LLLL
BBBB
EEEE
3210
RRRR
R/
W
R
CE
0R
CE
1R
OE
L
Dout0-8_L
Dout0-8_R
Dout9-17_L
Dout9-17_R
Dout18-26_L Dout18-26_R
Dout27-35_L Dout27-35_R
OE
R
512K x 36
MEMORY
ARRAY
I/O
0L-
I/O
35L
Di n_L
Di n_R
I/O
0R -
I/O
35R
A
18L
A
0L
Address
Decoder
ADDR_L
ADDR_R
Address
Decoder
A
18R
A
0R
CE
0L
CE
1L
OE
L
R/W
L
BUSY
L
SEM
L
INT
L(1)
ZZ
L(2)
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
CE
0R
CE
1R
OE
R
R/W
R
TDI
TDO
JTAG
TCK
TMS
TRST
BUSY
R
SEM
R
INT
R(1)
ZZ
CONTROL
LOGIC
ZZ
R(2)
NOTES:
1.
INT
is non-tri-state totem-pole outputs (push-pull).
2. The sleep mode pin shuts off all dynamic inputs, except JTAG inputs, when asserted. OPTx,
INTx
and the sleep mode
pins themselves (ZZx) are not affected during sleep mode.
5679 drw 01
JUNE 2015
DSC-5679/6
1
©2015 Integrated Device Technology, Inc.

70T653MS12BCG8相似产品对比

70T653MS12BCG8 70T653MS12BCGI8 70T653MS10BCG8 70T653MS15BCG8
描述 Dual-Port SRAM, 512KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 Dual-Port SRAM, 512KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 Dual-Port SRAM, 512KX36, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 Dual-Port SRAM, 512KX36, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
包装说明 LBGA, LBGA, LBGA, LBGA,
Reach Compliance Code compliant compliant compliant compliant
最长访问时间 12 ns 12 ns 10 ns 15 ns
JESD-30 代码 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
长度 17 mm 17 mm 17 mm 17 mm
内存密度 18874368 bit 18874368 bit 18874368 bit 18874368 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 36 36 36 36
功能数量 1 1 1 1
端子数量 256 256 256 256
字数 524288 words 524288 words 524288 words 524288 words
字数代码 512000 512000 512000 512000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 85 °C 70 °C 70 °C
组织 512KX36 512KX36 512KX36 512KX36
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LBGA LBGA LBGA LBGA
封装形状 SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
座面最大高度 1.5 mm 1.5 mm 1.5 mm 1.5 mm
最大供电电压 (Vsup) 2.6 V 2.6 V 2.6 V 2.6 V
最小供电电压 (Vsup) 2.4 V 2.4 V 2.4 V 2.4 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL
端子形式 BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
宽度 17 mm 17 mm 17 mm 17 mm
Base Number Matches 1 1 1 -

 
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