4 Mbit 512Kb x8, Uniform Block 3V Supply Low Pin Count Flash Memory
| M50LPW040K | M50LPW040N5T | M50LPW040N | M50LPW040K1T | M50LPW040N1T | M50LPW040 | M50LPW040K5T | |
|---|---|---|---|---|---|---|---|
| 描述 | 4 Mbit 512Kb x8, Uniform Block 3V Supply Low Pin Count Flash Memory | 4 Mbit 512Kb x8, Uniform Block 3V Supply Low Pin Count Flash Memory | 4 Mbit 512Kb x8, Uniform Block 3V Supply Low Pin Count Flash Memory | 4 Mbit 512Kb x8, Uniform Block 3V Supply Low Pin Count Flash Memory | 4 Mbit 512Kb x8, Uniform Block 3V Supply Low Pin Count Flash Memory | 4 Mbit 512Kb x8, Uniform Block 3V Supply Low Pin Count Flash Memory | 4 Mbit 512Kb x8, Uniform Block 3V Supply Low Pin Count Flash Memory |
| 是否Rohs认证 | - | 不符合 | - | 符合 | 不符合 | - | 符合 |
| 零件包装代码 | - | TSOP | - | QFJ | TSOP | - | QFJ |
| 包装说明 | - | 10 X 20 MM, PLASTIC, TSOP-40 | - | PLASTIC, LCC-32 | 10 X 20 MM, PLASTIC, TSOP-40 | - | PLASTIC, LCC-32 |
| 针数 | - | 40 | - | 32 | 40 | - | 32 |
| Reach Compliance Code | - | _compli | - | compli | _compli | - | compli |
| ECCN代码 | - | EAR99 | - | EAR99 | EAR99 | - | EAR99 |
| 最长访问时间 | - | 11 ns | - | 11 ns | 11 ns | - | 11 ns |
| 命令用户界面 | - | YES | - | YES | YES | - | YES |
| 数据轮询 | - | NO | - | NO | NO | - | NO |
| JESD-30 代码 | - | R-PDSO-G40 | - | R-PQCC-J32 | R-PDSO-G40 | - | R-PQCC-J32 |
| JESD-609代码 | - | e0 | - | e3 | e0 | - | e3 |
| 长度 | - | 18.4 mm | - | 13.97 mm | 18.4 mm | - | 13.97 mm |
| 内存密度 | - | 4194304 bi | - | 4194304 bi | 4194304 bi | - | 4194304 bi |
| 内存集成电路类型 | - | FLASH | - | FLASH | FLASH | - | FLASH |
| 内存宽度 | - | 8 | - | 8 | 8 | - | 8 |
| 功能数量 | - | 1 | - | 1 | 1 | - | 1 |
| 部门数/规模 | - | 8 | - | 8 | 8 | - | 8 |
| 端子数量 | - | 40 | - | 32 | 40 | - | 32 |
| 字数 | - | 524288 words | - | 524288 words | 524288 words | - | 524288 words |
| 字数代码 | - | 512000 | - | 512000 | 512000 | - | 512000 |
| 工作模式 | - | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS |
| 最高工作温度 | - | 85 °C | - | 70 °C | 70 °C | - | 85 °C |
| 组织 | - | 512KX8 | - | 512KX8 | 512KX8 | - | 512KX8 |
| 封装主体材料 | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | - | TSSOP | - | QCCJ | TSSOP | - | QCCJ |
| 封装等效代码 | - | TSSOP40,.8,20 | - | LDCC32,.5X.6 | TSSOP40,.8,20 | - | LDCC32,.5X.6 |
| 封装形状 | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | CHIP CARRIER |
| 并行/串行 | - | PARALLEL | - | PARALLEL | PARALLEL | - | PARALLEL |
| 电源 | - | 3.3 V | - | 3.3 V | 3.3 V | - | 3.3 V |
| 编程电压 | - | 3 V | - | 3 V | 3 V | - | 3 V |
| 认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | - | 1.2 mm | - | 3.56 mm | 1.2 mm | - | 3.56 mm |
| 部门规模 | - | 64K | - | 64K | 64K | - | 64K |
| 最大待机电流 | - | 0.0001 A | - | 0.0001 A | 0.0001 A | - | 0.0001 A |
| 最大压摆率 | - | 0.06 mA | - | 0.06 mA | 0.06 mA | - | 0.06 mA |
| 最大供电电压 (Vsup) | - | 3.6 V | - | 3.6 V | 3.6 V | - | 3.6 V |
| 最小供电电压 (Vsup) | - | 3 V | - | 3 V | 3 V | - | 3 V |
| 标称供电电压 (Vsup) | - | 3.3 V | - | 3.3 V | 3.3 V | - | 3.3 V |
| 表面贴装 | - | YES | - | YES | YES | - | YES |
| 技术 | - | CMOS | - | CMOS | CMOS | - | CMOS |
| 温度等级 | - | OTHER | - | COMMERCIAL | COMMERCIAL | - | OTHER |
| 端子面层 | - | Tin/Lead (Sn/Pb) | - | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | - | Matte Tin (Sn) |
| 端子形式 | - | GULL WING | - | J BEND | GULL WING | - | J BEND |
| 端子节距 | - | 0.5 mm | - | 1.27 mm | 0.5 mm | - | 1.27 mm |
| 端子位置 | - | DUAL | - | QUAD | DUAL | - | QUAD |
| 切换位 | - | NO | - | NO | NO | - | NO |
| 类型 | - | NOR TYPE | - | NOR TYPE | NOR TYPE | - | NOR TYPE |
| 宽度 | - | 10 mm | - | 11.43 mm | 10 mm | - | 11.43 mm |
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