REVISIONS
LTR
A
DESCRIPTION
Add vendor CAGE F8859. Add device class V criteria. Add case outline X.
Add table III, delta limits. Update boilerplate. Editorial changes throughout. –
ltg
Add section 1.5, radiation features. Move V
IH
and V
IL
from table I to section
1.4. Add appendix A, microcircuit die. Update the boilerplate to
MIL-PRF-38535 requirements and to include radiation hardness assured
requirements. Editorial changes throughout. – TVN
Correct wafer thickness in appendix A. – LTG
Add new device type 02. For device type 01 add footnote 8/ in section 1.5 and
add Table IB for SEP test limits. Add paragraph 4.4.4.2 single event
phenomena for device type 01. Update boilerplate to current requirements of
MIL-PRF- 38535. MAA
Make change to footnote 6/ in section 1.3. Update boilerplate paragraphs to
the current MIL-PRF- 38535 requirements. - LTG
Add transition supply current (Icct) test for device type 02 to table IA. Update
title of this drawing. - MAA
Add new device type 03. Add new die for device type 03. - MAA
DATE (YR-MO-DA)
00-07-12
APPROVED
Raymond Monnin
B
05-02-08
Thomas M. Hess
C
07-03-07
Thomas M. Hess
D
08-12-19
Thomas M. Hess
E
F
G
12-02-22
12-09-07
13-04-16
Thomas M. Hess
Thomas M. Hess
Thomas M. Hess
CURRENT CAGE CODE 67268
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
G
15
G
16
G
17
G
18
REV
SHEET
PREPARED BY
James E. Nicklaus
CHECKED BY
D. A. DiCenzo
APPROVED BY
N. A. Hauck
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DSCC FORM 2233
APR 97
DRAWING APPROVAL DATE
87-05-15
REVISION LEVEL
G
19
G
20
G
21
G
1
G
22
G
2
G
23
G
3
G
24
G
4
G
25
G
5
G
6
G
7
G
8
G
9
G
10
G
11
G
12
G
13
G
14
STANDARD
MICROCIRCUIT
DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
MICROCIRCUIT, DIGITAL, ADVANCED CMOS,
RADIATION HARDENED,
HEX INVERTER, SCHMITT
TRIGGER, MONOLITHIC SILICON
SIZE
CAGE CODE
G
A
14933
SHEET
1 OF 25
5962-87624
5962-E329-13
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part
or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following examples.
For device classes M and Q:
5962
-
87624
01
C
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
For device class V:
5962
F
87624
01
V
X
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
Generic number
54AC14
54AC14-SP
54AC14-SP
Circuit function
Hex inverter, Schmitt trigger
Hex inverter, Schmitt-trigger
Hex inverter, Schmitt-trigger
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q
designators will not be included in the PIN and will not be marked on the device.
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
Q or V
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87624
SHEET
G
2
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
C
D
2
X
Descriptive designator
GDIP1-T14 or CDIP2-T14
GDFP1-F14 or CDFP2-F14
CQCC1-N20
CDFP3-F14
Terminals
14
14
20
14
Package style
Dual-in-line
Flat pack
Leadless chip carrier
Flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/ 2/ 3/
Supply voltage range (V
CC
) .................................................................................. -0.5 V dc to +7.0 V dc
DC input voltage range (V
IN
) ................................................................................ -0.5 V dc to V
CC
+ 0.5 V dc 6/
DC output voltage range (V
OUT
) ........................................................................... -0.5 V dc to V
CC
+ 0.5 V dc 6/
Clamp diode current (I
IK
, I
OK
) ...............................................................................
±20
mA
DC output current (I
OUT
) .......................................................................................
±50
mA
DC V
CC
or GND current (per pin) for device type 01 ............................................
±50
mA
Continuous current through V
CC
or GND for device types 02 and 03...................
±200
mA
Maximum power dissipation (P
D
) ......................................................................... 500 mW
Storage temperature range (T
STG
) ....................................................................... -65°C to +150°C
Lead temperature (soldering, 10 seconds):
Case outline X ................................................................................................. +260°C
Other case outlines (except case outline X) .................................................... +245°C
Thermal resistance, junction-to-case (θ
JC
) ........................................................... See MIL-STD-1835
Junction temperature (T
J
) .................................................................................... 175°C 4/
1.4 Recommended operating conditions. 2/ 3/ 5/ 7/
Supply voltage range (V
CC
) .................................................................................. +2.0 V dc to +6.0 V dc
Input voltage range (V
IN
) ...................................................................................... 0.0 V dc to V
CC
Output voltage range (V
OUT
)................................................................................. 0.0 V dc to V
CC
Minimum high level input voltage (V
IH
) for device types 01, 02 and 03:
at V
CC
= 3.0 V .................................................................................................... 2.1 V
at V
CC
= 4.5 V .................................................................................................... 3.15 V
at V
CC
= 5.5 V .................................................................................................... 3.85
Maximum low level input voltage (V
IL
) for device types 01, 02 and 03:
at V
CC
= 3.0 V .................................................................................................... 0.9 V
at V
CC
= 4.5 V .................................................................................................... 1.35 V
at V
CC
= 5.5 V .................................................................................................... 1.65 V
Maximum high level output current (I
OH
) for device type 01, 02 and 03:
at V
CC
= 3.0 V .................................................................................................... -12.0 mA
at V
CC
= 4.5 V .................................................................................................... -24.0 mA
at V
CC
= 5.5 V .................................................................................................... -24.0 mA
Maximum low level output current (I
OL
) for device type 01, 02 and 03:
at V
CC
= 3.0 V .................................................................................................... +12.0 mA
at V
CC
= 4.5 V .................................................................................................... +24.0 mA
at V
CC
= 5.5 V .................................................................................................... +24.0 mA
Case operating temperature range (T
C
) ............................................................... -55°C to +125°C
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87624
SHEET
G
3
1.5 Radiation features.
Device types 01 and 03:
Maximum total dose available (dose rate = 50 – 300 rads (Si)/s) .................... 300 krads (Si)
No Single Event Latch-up (SEL) occurs at effective LET (see 4.4.4.2)........... ≤ 93 MeV-cm /mg 8/
2
1/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Unless otherwise specified, all voltages are referenced to GND.
The limits for the parameters specified herein shall apply over the full specified V
CC
range and case temperature range
of -55°C to +125°C.
Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
Operation from 2.0 V dc to 3.0 V dc is provided for compatibility with data retention and battery back-up systems. Data
retention implies no input transition and no stored data loss with the following conditions: V
IH
≥
70% V
CC
, V
IL
≤
30% V
CC
,
V
OH
≥
70% V
CC
@ -20
µA
V
OL
≤
30% V
CC
@ 20
µA.
The input and output voltage ratings for device type 02 and device types 01 and 03 (for vendor CAGE F8859) may be
exceeded provided the input and output current ratings are observed.
All unused inputs of the device types 01, 02 and 03 must be held at V
CC
or GND to ensure proper device operation.
Limits are guaranteed by design or process but not production tested unless specified by the customer through the
purchase order or contract.
2/
3/
4/
5/
6/
7/
8/
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87624
SHEET
G
4
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
https://assist.dla.mil/quicksearch/
or from the Standardization Document
Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of these documents cited in the solicitation or contract.
JEDEC – SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC)
JEDEC Standard JESD20 - Standard for Description of 54/74ACXXXXX and 54/74ACTXXXXX Advanced High-Speed
CMOS Devices.
(Copies of these documents are available online at
http://www.jedec.org
or from JEDEC – Solid State Technology
th
Association, 3103 North 10 Street, Suite 240-S Arlington, VA 22201).
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87624
SHEET
G
5
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