REVISIONS
LTR
A
B
C
D
E
F
DESCRIPTION
Add radiation hardened and class V requirements. - ro
Make change to A
VO
radiation hardened test limit as specified under
table I. - ro
Add case outline D. Make changes to 1.2.4, 3.2.3, figure 1, and table IIA.
Delete figure 2. - ro
Drawing updated to reflect current requirements. - rrp
Make changes to 4.4.4 and add 4.4.4.1. - ro
Update drawing to current MIL-PRF-38535 requirements. –rrp
DATE (YR-MO-DA)
00-04-13
00-10-05
03-03-21
05-11-09
06-12-21
13-01-09
APPROVED
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
C. SAFFLE
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
F
1
F
2
F
3
F
4
F
5
F
6
F
7
F
8
F
9
F
10
F
11
PREPARED BY
CHARLES E. BESORE
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
WILLIAM J. JOHNSON
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
APPROVED BY
MICHAEL A. FRYE
DRAWING APPROVAL DATE
88-10-17
MICROCIRCUIT, LINEAR, DUAL, LOW NOISE,
OPERATIONAL AMPLIFIERS, MONOLITHIC
SILICON
AMSC N/A
REVISION LEVEL
F
SIZE
A
SHEET
CAGE CODE
67268
1 OF
11
5962-88721
DSCC FORM 2233
APR 97
5962-E147-13
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the
PIN.
1.2 PIN. The PIN is as shown in the following examples.
For device classes M and Q:
5962
-
88721
01
P
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
For device class V:
5962
-
88721
01
V
P
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
Generic number
OP-270A
OP-271A
Circuit function
Dual, low-noise, precision, operational amplifier
Dual, low-noise, high speed, operational amplifier
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q
designators will not be included in the PIN and will not be marked on the device.
Device class
M
Q or V
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88721
SHEET
F
2
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
D
P
2
Descriptive designator
GDFP1-F14
GDIP1-T8 or CDIP2-T8
CQCC1-N20
Terminals
14
8
20
Package style
Flat pack
Dual-in-line
Square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
Supply voltage (V
S
) .....................................................................................
Differential input voltage 2/ ........................................................................
Differential input current 2/ .........................................................................
Input voltage (V
IN
) ......................................................................................
Output short-circuit ......................................................................................
Storage temperature range ..........................................................................
Lead temperature (soldering, 60 seconds) .................................................
Junction temperature (T
J
) ...........................................................................
±18
V
±1
V
±25
mA
Supply voltage
Continuous
-65°C to +150°C
+300°C
+150°C
Thermal resistance, junction-to-case (θ
JC
) ................................................. See MIL-STD-1835
Thermal resistance, junction-to-ambient (θ
JA
):
Case D .................................................................................................... 150°C/W
Case P ..................................................................................................... 45°C/W
Case 2 ..................................................................................................... 35°C/W
1.4 Recommended operating conditions.
Supply voltage (V
S
) .....................................................................................
±15
V
Source resistance (R
S
) ............................................................................... 50
Ω
Ambient operating temperature range (T
A
) ................................................. -55°C to +125°C
1.5 Radiation features.
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) ................ 100 Krads(Si) 3/
______
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ The inputs are protected by back-to-back diodes. Current limiting resistors are not used in order to achieve low noise
performance. If the differential input voltage exceeds
±1.0
V, the input current should be limited to
±25
mA.
3/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,
method 1019, condition A.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88721
SHEET
F
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in
the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
https://assist.dla.mil/quicksearch/
or from the Standardization Document
Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
A
REVISION LEVEL
5962-88721
SHEET
F
4
TABLE I. Electrical performance characteristics.
Conditions 1/ 2/ 3/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
1
2,3
Device
type
Min
01
Limits
Max
75
175
Unit
Input offset voltage
V
IO
µV
M,D,P,L,R
1
1
2,3
01
02
200
200
400
Input offset current
I
IO
V
CM
= 0 V
1
2,3
M,D,P,L,R
1
1
2,3
M,D,P,L,R
1
7
All
10
30
nA
01
All
100
20
60
nA
Input bias current
I
B
V
CM
= 0 V
01
01
1000
80
nV
RMS
nV /
Hz
Input noise voltage 4/
E
nt
f
O
= 1 Hz to 100 Hz,
T
A
= +25°C
Input noise voltage 4/ 5/
density
Large signal voltage
gain
e
n
f
O
= 1 kHz, T
A
= 25°C
V
O
=
±10
V, R
L
= 10 kΩ
7
02
11
A
VO
4
5,6
01
1500
750
100
750
400
V/mV
M,D,P,L,R
V
O
=
±10
V, R
L
= 2 kΩ
4
4
5,6
V
O
=
±10
V, R
L
= 10 kΩ
4
5,6
02
400
300
300
200
V
O
=
±10
V, R
L
= 2 kΩ
4
5,6
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88721
SHEET
F
5
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