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5962-9169702MXX

产品描述Microcontroller, 8-Bit, OTPROM, 16MHz, CMOS, CDIP40, CERAMIC, DIP-40
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小536KB,共15页
制造商Intel(英特尔)
官网地址http://www.intel.com/
下载文档 详细参数 选型对比 全文预览

5962-9169702MXX概述

Microcontroller, 8-Bit, OTPROM, 16MHz, CMOS, CDIP40, CERAMIC, DIP-40

5962-9169702MXX规格参数

参数名称属性值
零件包装代码DIP
包装说明DIP,
针数40
Reach Compliance Codeunknown
ECCN代码3A001.A.2.C
具有ADCNO
地址总线宽度16
位大小8
最大时钟频率16 MHz
DAC 通道NO
DMA 通道NO
外部数据总线宽度8
JESD-30 代码R-CDIP-T40
I/O 线路数量32
端子数量40
最高工作温度125 °C
最低工作温度-55 °C
PWM 通道NO
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DIP
封装形状RECTANGULAR
封装形式IN-LINE
认证状态Not Qualified
ROM可编程性OTPROM
筛选级别MIL-STD-883
速度16 MHz
最大供电电压6 V
最小供电电压4 V
标称供电电压5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子形式THROUGH-HOLE
端子位置DUAL
uPs/uCs/外围集成电路类型MICROCONTROLLER
Base Number Matches1

5962-9169702MXX相似产品对比

5962-9169702MXX 5962-9169702MUA 5962-9169701MUX 5962-9169701MXX 5962-9169701MXA 5962-9169701MUA 5962-9169702MXA 5962-9169702MUX RCWP1206208KDNED1C MR87C51FC-16
描述 Microcontroller, 8-Bit, OTPROM, 16MHz, CMOS, CDIP40, CERAMIC, DIP-40 Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, CQCC44, CERAMIC, LCC-44 Microcontroller, 8-Bit, UVPROM, CMOS, CERAMIC, LCC-44 Microcontroller, 8-Bit, UVPROM, 16MHz, CMOS, CDIP40, CERDIP-40 Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CDIP40, CERDIP-40 Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CQCC44, CERAMIC, LCC-44 Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, CDIP40, CERDIP-40 Microcontroller, 8-Bit, UVPROM, CMOS, CERAMIC, LCC-44 Fixed Resistor, Thick Film, 0.25W, 208000ohm, 100V, 0.5% +/-Tol, -200,200ppm/Cel, Surface Mount, 1206, CHIP Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, CQCC44, CERAMIC, LCC-44
包装说明 DIP, WQCCN, LCC44,.65SQ WQCCN, WDIP, WDIP, DIP40,.6 WQCCN, LCC44,.65SQ WDIP, DIP40,.6 WQCCN, CHIP WQCCN, LCC44,.65SQ
Reach Compliance Code unknown unknown unknow unknown unknown unknown compliant unknown unknown unknown
ECCN代码 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C EAR99 3A001.A.2.C
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 155 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -65 °C -55 °C
封装形式 IN-LINE CHIP CARRIER, WINDOW CHIP CARRIER, WINDOW IN-LINE, WINDOW IN-LINE, WINDOW CHIP CARRIER, WINDOW IN-LINE, WINDOW CHIP CARRIER, WINDOW SMT CHIP CARRIER, WINDOW
表面贴装 NO YES YES NO NO YES NO YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS THICK FILM CMOS
零件包装代码 DIP LCC LCC DIP DIP LCC DIP LCC - LCC
针数 40 44 44 40 40 44 40 44 - 44
具有ADC NO NO NO NO NO NO NO NO - NO
地址总线宽度 16 16 16 16 16 16 16 16 - 16
位大小 8 8 8 8 8 8 8 8 - 8
最大时钟频率 16 MHz 16 MHz 12 MHz 12 MHz 12 MHz 12 MHz 16 MHz 16 MHz - 16 MHz
DAC 通道 NO NO NO NO NO NO NO NO - NO
DMA 通道 NO NO NO NO NO NO NO NO - NO
外部数据总线宽度 8 8 8 8 8 8 8 8 - 8
JESD-30 代码 R-CDIP-T40 S-CQCC-N44 - R-GDIP-T40 R-GDIP-T40 S-CQCC-N44 R-GDIP-T40 - - S-CQCC-N44
I/O 线路数量 32 32 32 32 32 32 32 32 - 32
端子数量 40 44 - 40 40 44 40 - 2 44
PWM 通道 NO YES YES YES YES YES YES YES - YES
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED - CERAMIC, METAL-SEALED COFIRED
封装代码 DIP WQCCN WQCCN WDIP WDIP WQCCN WDIP WQCCN - WQCCN
封装形状 RECTANGULAR SQUARE - RECTANGULAR RECTANGULAR SQUARE RECTANGULAR - - SQUARE
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified
ROM可编程性 OTPROM UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM - UVPROM
筛选级别 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 - 38535Q/M;38534H;883B
速度 16 MHz 16 MHz - 16 MHz 12 MHz 12 MHz 16 MHz - - 16 MHz
最大供电电压 6 V 6 V 6 V 6 V 6 V 6 V 6 V 6 V - 6 V
最小供电电压 4 V 4 V 4 V 4 V 4 V 4 V 4 V 4 V - 4 V
标称供电电压 5 V 5 V - 5 V 5 V 5 V 5 V - - 5 V
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY - MILITARY
端子形式 THROUGH-HOLE NO LEAD NO LEAD THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD - NO LEAD
端子位置 DUAL QUAD QUAD DUAL DUAL QUAD DUAL QUAD - QUAD
uPs/uCs/外围集成电路类型 MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER - MICROCONTROLLER
Base Number Matches 1 1 1 1 1 1 1 1 - 1
是否Rohs认证 - 不符合 - - 不符合 不符合 不符合 - 符合 不符合
JESD-609代码 - e0 e0 e0 e0 e0 e0 e0 - e0
长度 - 16.535 mm 16.535 mm 52.325 mm 52.325 mm 16.535 mm 52.325 mm 16.535 mm - 16.535 mm
座面最大高度 - 3.63 mm 3.63 mm 5.72 mm 5.72 mm 3.63 mm 5.72 mm 3.63 mm - 3.63 mm
端子面层 - Tin/Lead (Sn/Pb) - hot dipped TIN LEAD TIN LEAD Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped TIN LEAD MATTE TIN OVER NICKEL Tin/Lead (Sn/Pb)
端子节距 - 1.27 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm - 1.27 mm
宽度 - 16.535 mm 16.535 mm 15.24 mm 15.24 mm 16.535 mm 15.24 mm 16.535 mm - 16.535 mm

 
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