Revision 5, Updated 9-01-01
7741 North Business Park Drive
Tucson, Arizona 85743
Ph: 520-744-0400 Fax: 520-744-6155
Website: www.tusonix.com E-mail: sales@tusonix.com
EMI/RFI Series 4700
π
Filters for SMT Applications
APPLICATION
TUSONIX 4700 Series
π
Filters
are used where
cost and space savings have priority and improved
insertion loss is required.
TUSONIX’ unique design makes the filter suitable
for common production soldering processes.
TUSONIX’ state-of-the-art manufacturing process
results in excellent electrical and mechanical per-
formance. The square or round body allows easy
handling, positioning and soldering onto the PCB.
This is another cost effective quality product from
TUSONIX.
EMI/RFI Filter Specifications
1.0 Scope
This specification describes the basic performance require-
ments of the TUSONIX EMI/RFI surface mount Filters.
2.0 Capacitance
2.1 Measurement Conditions: Capacitance measured at
25°±2°C, 50% max R.H. and Frequency of 1 KHz @
1±0.2VRMS.
2.2 Capacitance Tolerance: Listed capacitances are
minimum value at 25°±2°C unless otherwise specified.
3.0 Insertion Loss
3.1 Measurement Conditions: Attenuations listed are
measured in a 50Ω system at 25°C±2°C under no-load
conditions (per MIL-STD-220).
3.2 Insertion Loss Tolerance: The attenuations listed are
typical values under indicated conditions.
3.3 Listed insertion loss data is a measurement of filter
performance in a matched 50Ω system. It is highly
recommended that filter performance be verified under
actual circuit operation conditions.
4.0 Operating Conditions
Filters are designed to operate continuously at the tem-
perature, voltage and current stated for each TUSONIX
part number. Operating temperature ranges are from -55°C
to either 85°C or 125°C.
5.0 Dielectric Withstanding Voltage
Filters shall withstand three times the DC working voltage
applied between either terminal and ground electrode.
6.0 Insulation Resistance
Measured at 25°C±2°C with 100Vdc and charging current
limited to 50mA max. The IR after two minutes maximum
shall be a minimum of 10,000 Megohms.
7.0 Packaging
Tape and reeled for auto placement.
4 .0 0
± .1 0
1 .5 D IA .
2 .0 0
± .0 5
1 .7 5 ± .1 0
7 .5
± .1 0
.4 0
FEATURES
•
Excellent Performance
•
Easy Placement
•
Excellent Solderability
•
Reduces PCB Component Count
Typical Shielded
Insertion Loss vs. Frequency
80
70
8200pF
60
50
5000pF
40
30
2000pF
20
10
0
1MHz
10MHz 100MHz
FREQUENCY
INSERTION LOSS (dB)
1000pF
470pF
100pF
1GHz
10GHz
Typical Unshielded
Insertion Loss vs. Frequency
80
70
60
50
8200pF
40
5000pF
30
20
2000pF
10
0
1MHz
10MHz
INSERTION LOSS (dB)
1 6 .0 0
± 0 .3
2 .2
± .1 0
1000pF
100pF
470pF
4 .0 0 ± .1 0
D IM E N S IO N S A R E IN M E T R IC
1 .5 D IA .
H O L E
S E C T IO N
100MHz
1GHz
10GHz
N O T E S :
R E F E R E N C E IE C -2 8 6 -3 T Y P E II A N D E IA -4 8 1 -A
T A P IN G O F S U R F A C E M O U N T C O M P O N E N T S
F O R A U T O M A T IC P L A C E M E N T
FREQUENCY
Revised 9/01/01
EMI/RFI Series 4700
π
Filters for SMT Applications
" % 5 - 4 1- 5
.3 1 5 M A X .
[8 M A X .]
.2 3 0 ± .0 1 0
[5 .8 4 ± 0 .2 5 ]
.0 9 0 ± .0 0 5
[2 .2 9 ± 0 .1 2 ]
S Q U A R E
.0 8 5 ± .0 0 5
[2 .2 ± 0 .1 2 ]
Product Installation Recommendations
for Surface Mount
π
Filters
+ 14 + 7 16
.0 3 9 /.0 1
[1 / 0 .3 0
2 P L C S
.0 2 0
[0 .5 0
2 P L
2
.
]
]
M IN .
C S .
.1 2 6 /.0 9 9
[3 .2 0 / 2 .5 1 ]
.0 2 5 M A X R .
[.6 3 ]
A L L C O R N E R S
E L E C T R O D E
T E R M IN A T IO N
S O L D E R P L A T E D
.1 2 5
[3 .1 8 ]
S O L D E R
H .M .P
" % 5 - 4 1- 5
.3 9 4 M A X .
[1 0 M A X .]
.3 3 6 ± .0 1 0
[8 .5 3 ± 0 .2 5 ]
.0 9 0 ± .0 0 5
[2 .2 9 ± 0 .1 2 ]
S Q U A R E
S O L D E R
H .M .P
Soldering Notes:
Surface Mount
π
Filters may be soldered to Printed
Circuit Boards and substrates in a variety of methods:
solder wave, hot air, oven soldering, vapor phase
reflow, infrared soldering or immersion soldering.
Ceramic Components require careful soldering tech-
niques to avoid the possible effects of thermal shock.
These effects can be minimized by using a preheat
process prior to soldering. Both time and temperature
are important in the preheat cycle.
When using soldering irons, it is very important that
the solder iron tip does not touch the ceramic body.
The iron should be applied only to the termination sol-
der fillet. The temperature of the soldering tip should
be controlled to 500°F (260°C) max. Soldering should
be achievable in 2-3 seconds. Recommended solder
composition is 60% tin and 40% lead.
Failure to follow proper preheat and solder practices
can result in thermal shock to the ceramic body which
may be manifested as:
•
•
•
Micro cracks in the ceramic body
Electrical shorts
Insulation resistance degradation in
accelerated life test conditions.
.1 2 5
[3 .1 8 ]
.1 2 5
[3 .1 8 ]
.0 4 3
[1 .0 9 ]
.1 0 2
[2 .5 9 ]
.0 4 3
[1 .0 9 ]
S U G G E S T E D
M O U N T IN G P A T T E R N
.0 3 9 /.0
[1 / 0 .3
2 P L C
.0 2 0
[0 .5 0
2 P L
1 2
0 ]
S .
M IN .
]
C S .
.1 2 5
[3 .1 8 ]
.2 2 6 /.1 9 9
[5 .7 4 / 5 .0 5 ]
.0 2 5 M A X R .
[.6 3 ]
A L L C O R N E R S
E L E C T R O D E
T E R M IN A T IO N
S O L D E R P L A T E D
.1 2 5
[3 .1 8 ]
Dielectric Withstanding - 300VDC
Direct Current Rating - 10 ADC
Inductance Value - 100nH Minimum
.2 0 2
[5 .1 3 ]
.1 2 5
[3 .1 8 ]
.0 4 3
[1 .0 9 ]
.0 4 3
[1 .0 9 ]
S U G G E S T E D
M O U N T IN G P A T T E R N
SQUARE FILTER
TUSONIX
Part
Number
4700-006
4700-009
4700-005
4700-003
4700-008
4701-002
4701-001
Working
Volts DC
85°C 125°C
--
100
--
100
--
100
--
100
100
--
100
--
100
--
Cap. Capacitance
(pF)
Tolerance
100
470
1000
2000
4000
6800
8200
+80%/-20%
+80%/-20%
GMV
GMV
+80%/-20%
+80%/-20%
+80%/-20%
Typical No-Load Insertion Loss
(dB) at 25°C per MIL-Std-220
10MHz
1GHz
100MHz
16
--
3
40
1
16
65
7
40
70
10
45
70
13
52
70
16
60
70
20
65
ROUND FILTER
TUSONIX
Part
Number
4700-059
4700-058
4700-053
4700-056
Typical No-Load Insertion Loss
Working
Cap. Capacitance (dB) at 25°C per MIL-Std-220
Volts DC
Tolerance
10MHz
100MHz
1GHz
85°C 125°C (pF)
--
100
16
+80%/-20%
--
3
100
--
100 1000
65
GMV
7
40
--
100 2000
70
GMV
10
45
100
--
70
15
55
5000 +80%/-20%
All Surface Mount
π
Filters have nickel barrier, solder
plated electrodes and are ideally suited for manufac-
turers who use various soldering techniques on a
multitude of products. However, the amount of sol-
der must be controlled to allow for adequate transfer
of heat and mechanical stresses from the PCB to the
Filter.
Handling:
Extreme care should be exercised when handling ce-
ramic components. They should be treated as fragile
components. Excessive force or direct impact to the
dielectric may result in chips, cracks or breakage.
Cleaning:
Components should be cleaned immediately follow-
ing the soldering operation to optimize flux removal
conditions. Cleaning solutions should be kept clean
to avoid contaminating the components. The user
should consult the manufacturer’s Material Safety Data
Sheets for specific handling details.
Please note:
Additional
Capacitance Values and
Mounting Patterns are
available upon request.
Enlargement
Excessive temperature differences or excessive agi-
tation during cleaning may damage the filters.
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