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ASM2P2309NZF-16-ST

产品描述Low Skew Clock Driver, 2309 Series, 9 True Output(s), 0 Inverted Output(s), PDSO16, 0.150 INCH, ROHS COMPLIANT, SOIC-16
产品类别逻辑    逻辑   
文件大小398KB,共9页
制造商PulseCore Semiconductor Corporation
标准
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ASM2P2309NZF-16-ST概述

Low Skew Clock Driver, 2309 Series, 9 True Output(s), 0 Inverted Output(s), PDSO16, 0.150 INCH, ROHS COMPLIANT, SOIC-16

ASM2P2309NZF-16-ST规格参数

参数名称属性值
是否Rohs认证符合
包装说明0.150 INCH, ROHS COMPLIANT, SOIC-16
Reach Compliance Codeunknown
系列2309
输入调节STANDARD
JESD-30 代码R-PDSO-G16
长度9.905 mm
逻辑集成电路类型LOW SKEW CLOCK DRIVER
功能数量1
反相输出次数
端子数量16
实输出次数9
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
传播延迟(tpd)9.2 ns
认证状态Not Qualified
Same Edge Skew-Max(tskwd)0.25 ns
座面最大高度1.75 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
温度等级COMMERCIAL
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度3.9 mm
最小 fmax133.33 MHz
Base Number Matches1

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June 2005
rev 0.2
Nine Output 3.3V Buffer
Features
Functional Description
One-input to Nine-Output Buffer/Driver
Supports two DIMMs or four SO-DIMMs with one
additional output for feedback to an external or
chipset PLL
Low power consumption for mobile applications
Less than 32mA at 66.6MHz with unloaded
outputs
1nS Input-Output delay
Buffers all frequencies from DC to 133.33MHz
Output-output skew less than 250pS
Multiple V
DD
and V
SS
pins for noise and
electromagnetic interference (EMI) reduction
Space-saving 16-pin 150-mil SOIC Package
3.3V operation
Commercial and Industrial temperature parts are
available
ASM2P2309NZ
The ASM2P2309NZ is a low-cost buffer designed to
distribute high-speed clocks in mobile PC systems and
desktop PC systems with SDRAM support. The part has
nine outputs, eight of which can be used to drive two
DIMMs or four SO-DIMMs, and the remaining can be used
for external feedback to a PLL. The device operates at
3.3V and outputs can run up to 133.33MHz.
The ASM2P2309NZ is designed for low EMI and power
optimization. It has multiple V
SS
and V
DD
pins for noise
optimization and consumes less than 32mA at 66.6MHz,
making it ideal for the low-power requirements of mobile
systems. It is available in an ultra-compact 150-mil 16-pin
SOIC Package.
Block Diagram
BUF_IN
OUTPUT1
OUTPUT2
OUTPUT3
OUTPUT4
OUTPUT5
OUTPUT6
OUTPUT7
OUTPUT8
OUTPUT9
Alliance Semiconductor
2575 Augustine Drive
Santa Clara, CA
Tel: 408.855.4900
Fax: 408.855.4999
www.alsc.com
Notice: The information in this document is subject to change without notice.

 
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