REVISIONS
LTR
A
B
DESCRIPTION
Add vendor CAGE 27014 to case outline 2. Change vendor similar part
number. Editorial changes to table I. - JT
Add case outline "F" to device type 01. Add vendor CAGE 18324 to case
outlines E, F, and 2. Editorial changes throughout. Change current CAGE
code. - JEN
Update the boilerplate to the current requirements of MIL-PRF-38535. - jak
Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. -
LTG
DATE (YR-MO-DA)
87-04-01
88-12-08
APPROVED
Nelson A. Hauck
Michael A. Frye
C
D
07-10-17
13-06-21
Thomas M. Hess
Thomas M. Hess
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
Jeffery Tunstall
CHECKED BY
D. A. DiCenzo
APPROVED BY
N. A. Hauck
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DSCC FORM 2233
APR 97
DRAWING APPROVAL DATE
86-09-30
REVISION LEVEL
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
10
D
11
STANDARD
MICROCIRCUIT
DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS,
QUAD 2-INPUT MULTIPLEXER,
MONOLITHIC SILICON
SIZE
CAGE CODE
D
A
67268
SHEET
1 OF 11
5962-86823
5962-E453-13
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-86823
01
E
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
54HC158
Circuit function
Multiplexer, quad 2-input (inverted output)
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
E
F
2
Descriptive designator
GDIP1-T16 or CDIP2-T16
GDFP1-F16 or CDFP2-F16
CQCC1-N20
Terminals
16
16
20
Package style
Dual-in-line
Flat pack
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings. 1/ 2/
Supply voltage range (V
CC
) .....................................................................
DC input voltage range (V
IN
) ...................................................................
DC output voltage range (V
OUT
) ..............................................................
Clamp diode current................................................................................
DC output current (per pin) .....................................................................
DC V
CC
or GND current (per pin) ............................................................
Storage temperature range (T
STG
) ..........................................................
Maximum power dissipation (P
D
) ............................................................
Lead temperature (soldering, 10 seconds) .............................................
Thermal resistance, junction-to-case (θ
JC
) ..............................................
Junction temperature (T
J
) .......................................................................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) .....................................................................
Input voltage range (V
IN
) .........................................................................
Output voltage range (V
OUT
)....................................................................
Case operating temperature range (T
C
) ..................................................
Input rise and fall time (t
r
, t
f
):
V
CC
= 2.0 V dc ............................................................................
V
CC
= 4.5 V dc ............................................................................
V
CC
= 6.0 V dc ............................................................................
+2.0 V dc to +6.0 V dc
0.0 V to V
CC
0.0 V to V
CC
-55°C to +125°C
0 to 1000 ns
0 to 500 ns
0 to 400 ns
-0.5 V dc to +7.0 V dc
-0.5 V dc to V
CC
+ 0.5 V dc
-0.5 V dc to V
CC
+ 0.5 V dc
±20
mA
±25
mA
±50
mA
-65°C to +150°C
500 mW 3/
+260°C
See MIL-STD-1835
+175°C
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Unless otherwise specified, all voltages are referenced to ground.
3/ For T
C
= +100°C to +125°C, derate linearly at 12 mW/°C.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86823
SHEET
D
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://quicksearch.dla.mil
or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094).
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of these documents cited in the solicitation or contract.
JEDEC – SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC)
JESD7 - Standard for Description of 54/74HCXXXXX and 54/74HCTXXXXX Advanced High-Speed CMOS Devices.
(Copies of these documents are available online at
http://www.jedec.org
or from JEDEC – Solid State Technology
th
Association, 3103 North 10 Street, Suite 240-S Arlington, VA 22201-2107).
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to
MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and
qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management
(QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the
device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with
MIL-PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3.
3.2.5 Switching waveforms. The switching waveforms shall be as specified on figure 4.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86823
SHEET
D
3
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD
PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and
Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the
requirements of MIL-PRF-38535, appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that
affects this drawing.
3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritime's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86823
SHEET
D
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Test conditions
-55°C
≤
T
C
≤
+125°C
unless otherwise specified 1/
V
IN
= V
IH
or V
IL
I
OH
= -20
µA
V
CC
= 2.0 V
V
CC
= 4.5 V
V
CC
= 6.0 V
V
IN
= V
IH
or V
IL
I
OH
= -4.0 mA
V
IN
= V
IH
or V
IL
I
OH
= -5.2 mA
Low level output
voltage
V
OL
V
IN
= V
IH
or V
IL
I
OL
= +20
µA
V
CC
= 4.5 V
V
CC
= 6.0 V
V
CC
= 2.0 V
V
CC
= 4.5 V
V
CC
= 6.0 V
V
IN
= V
IH
or V
IL
I
OL
= +4.0 mA
V
IN
= V
IH
or V
IL
I
OL
= +5.2 mA
High level input
voltage
V
IH
2/
V
CC
= 4.5 V
V
CC
= 6.0 V
V
CC
= 2.0 V
V
CC
= 4.5 V
V
CC
= 6.0 V
Low level input
voltage
V
IL
2/
V
CC
= 2.0 V
V
CC
= 4.5 V
V
CC
= 6.0 V
Input capacitance
Quiescent supply
current
Input leakage
current
Functional tests
Propagation delay
time, data to
output Y
t
PHL1
,
t
PLH1
3/
C
IN
I
CC
I
IN
V
IN
= 0.0 V, T
C
= +25°C
See 4.3.1c
V
CC
= 6.0 V
V
IN
= V
CC
or GND
V
CC
= 6.0 V
V
IN
= V
CC
or GND
See 4.3.1d
T
C
= +25°C
C
L
= 50 pF
See figure 4
T
C
= -55°C and +125°C
C
L
= 50 pF
See figure 4
V
CC
= 2.0 V
V
CC
= 4.5 V
V
CC
= 6.0 V
V
CC
= 2.0 V
V
CC
= 4.5 V
V
CC
= 6.0 V
See footnotes at end of table.
10, 11
4
1, 2, 3
1, 2, 3
7, 8
9
140
28
24
210
42
36
ns
1, 2, 3
1, 2, 3
1.5
3.15
4.2
0.3
0.9
1.2
10
160
±1.0
pF
µA
µA
V
1, 2, 3
Group A
subgroups
1, 2, 3
Limits
Min
1.9
4.4
5.9
3.7
5.2
0.1
0.1
0.1
0.4
0.4
V
V
Max
V
Unit
High level output
voltage
V
OH
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86823
SHEET
D
5
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