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89HPES22H16ZABR

产品描述FCBGA-484, Tray
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小439KB,共38页
制造商IDT (Integrated Device Technology)
标准
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89HPES22H16ZABR概述

FCBGA-484, Tray

89HPES22H16ZABR规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码FCBGA
包装说明BGA, BGA484,22X22,40
针数484
制造商包装代码BR484
Reach Compliance Codenot_compliant
ECCN代码EAR99
地址总线宽度
总线兼容性PCI
最大时钟频率125 MHz
驱动器接口标准IEEE 1149.1
外部数据总线宽度
JESD-30 代码S-PBGA-B484
JESD-609代码e1
长度23 mm
湿度敏感等级4
端子数量484
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA484,22X22,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)245
电源1,3.3 V
认证状态Not Qualified
座面最大高度3.32 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度23 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

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22-Lane 16-Port
PCI Express® Switch
®
89HPES22H16
Data Sheet
Device Overview
The 89HPES22H16 is a member of the IDT PRECISE™ family of
PCI Express® switching solutions. The PES22H16 is a 22-lane, 16-port
peripheral chip that performs PCI Express packet switching with a
feature set optimized for high-performance applications such as servers,
storage, and communications/networking. It provides connectivity and
switching functions between a PCI Express upstream port and up to
fifteen downstream ports and supports switching between downstream
ports.
Features
High Performance PCI Express Switch
– Sixteen maximum switch ports
Two x4 ports
Fourteen x1 ports
– Twenty-two 2.5 Gbps embedded SerDes
Supports pre-emphasis and receive equalization on per-port
basis
– Delivers 88 Gbps (11 GBps) of aggregate switching capacity
– Low-latency cut-through switch architecture
– Support for Max Payload Size up to 2048 bytes
– Supports two virtual channels and eight traffic classes
– PCI Express Base Specification Revision 1.1 compliant
Flexible Architecture with Numerous Configuration Options
– Port arbitration schemes utilizing round robin algorithms
– Automatic per port link width negotiation from x4 to x2 or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion on all lanes
– Supports locked transactions, allowing use with legacy soft-
ware
– Ability to load device configuration from serial EEPROM
– Ability to control device via SMBus
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates twenty-two 2.5 Gbps embedded full duplex SerDes,
8B/10B encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Redundant upstream port failover capability
– Supports optional PCI Express end-to-end CRC checking
Block Diagram
x4/x2/x1
x4/x2/x1
SerDes
DL/Transaction Layer
SerDes
DL/Transaction Layer
Route Table
Port
Arbitration
16-Port Switch Core
Frame Buffer
Scheduler
DL/Transaction Layer
DL/Transaction Layer
SerDes
SerDes
. . . . . . .
DL/Transaction Layer
SerDes
x1
x1
x1
22 PCI Express Lanes
2 x4 ports and 14 x1 Ports
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 37
October 3, 2011

89HPES22H16ZABR相似产品对比

89HPES22H16ZABR 89HPES22H16ZABRI 89HPES22H16ZABLI 89HPES22H16ZABC8
描述 FCBGA-484, Tray FCBGA-484, Tray FCBGA-484, Tray CABGA-484, Reel
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 含铅 含铅 含铅 含铅
是否Rohs认证 符合 符合 不符合 不符合
零件包装代码 FCBGA FCBGA FCBGA CABGA
针数 484 484 484 484
制造商包装代码 BR484 BR484 BL484 BC484
Reach Compliance Code not_compliant not_compliant not_compliant unknown
JESD-30 代码 S-PBGA-B484 S-PBGA-B484 S-PBGA-B484 S-PBGA-B484
端子数量 484 484 484 484
最高工作温度 70 °C 70 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA
封装等效代码 BGA484,22X22,40 BGA484,22X22,40 BGA484,22X22,40 BGA484,22X22,40
封装形状 SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
电源 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES YES
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology)
包装说明 BGA, BGA484,22X22,40 BGA, BGA484,22X22,40 BGA, BGA484,22X22,40 -
ECCN代码 EAR99 EAR99 EAR99 -
总线兼容性 PCI PCI PCI -
最大时钟频率 125 MHz 125 MHz 125 MHz -
驱动器接口标准 IEEE 1149.1 IEEE 1149.1 IEEE 1149.1 -
JESD-609代码 e1 e1 e0 -
长度 23 mm 23 mm 23 mm -
湿度敏感等级 4 4 3 -
峰值回流温度(摄氏度) 245 245 225 -
座面最大高度 3.32 mm 3.32 mm 3.32 mm -
最大供电电压 1.1 V 1.1 V 1.1 V -
最小供电电压 0.9 V 0.9 V 0.9 V -
标称供电电压 1 V 1 V 1 V -
技术 CMOS CMOS CMOS -
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) -
处于峰值回流温度下的最长时间 30 30 NOT SPECIFIED -
宽度 23 mm 23 mm 23 mm -
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI -
Base Number Matches 1 1 1 -
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