Programmable Oscillators
4 Industry Standard Packages
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• Thru-Hole and SMD Packages
H
• CMOS/TTL Output
• Stability to ±20ppm
• Optimized Jitter
Electrical Specifications
Frequency Range
Frequency Stability
Operating Temperature Range
Storage Temperature Range
Aging (@25°C)
Supply Voltage (Vdd)
Supply Current (unloaded)
Output Voltage Logic High
Output Voltage Logic Low
Load Drive Capability (TTL)
5V
3.3V
1.000MHz to 133.000MHz
1.000MHz to 100.000MHz
±100ppm to ±20ppm
0°C - 70°C to -40°C - 85°C
-55°C - 125°C
±5ppm / year maximum
5.0Vdc ±10% or 3.3Vdc ±10%
45mA
25mA
2.4V min
Vdd - 0.4V min
0.4V max
50pF max
25pF max
50pF max
25pF max
30pF max
15pF max
45/55
40/60
4nSec max
10mSec max
50pSec max* (RMS)
30pSec max* (RMS)
50pSec max* (RMS)
40pSec max* (RMS)
5V
3.3V
TTL
CMOS
5V, 1 - 40MHz
5V, 40 - 133MHz
Load Drive Capability (CMOS)
5V, 1 - 66.6MHz
5V, 66.6 - 133MHz
3.3V, 1 - 40MHz
3.3V, 40 - 100MHz
Duty Cycle (1.4Vdc-TTL, 50% waveform-HCMOS)
1 - 66MHz
66MHz and above
Rise / Fall Time
Start Up Time
Jitter
5V, 1 - 33MHz
5V, above 33.000MHz
3.3V, 1 - 33MHz
3.3V, above 33.000MHz
*Please contact your MMD representative for up-to-date typical jitter information
www.mmdcomp.com
phone: 949-753-5888 / fax: 949-753-5889
7
Specifications subject to change without notice
Revision: 2/18/02 B
Part Numbering Guide
MP
Supply Voltage
Blank = 5 Volt
3 = 3.3 Volt
Package Style
A = Full-size (14 pin DIP)
B = Half-size (8 pin DIP)
I = 5X7 Ceramic SMD
D = Plastic J-lead SMD
Output
C = CMOS
T = TTL
Frequency Stability
100 = ±100ppm
050 = ±50ppm
025 = ±25ppm
020 = ±20ppm
Frequency
Pin 1 Connection
Blank = Tri-state*
H = Tri-state*
Operating Temperature
Blank = 0°C to 70°C
27 = -27°C to 70°C
48 = -40°C to 85°C
*Tri-state Operation
Logic 1 or NC = Oscillation
Logic 0 or GND = High Impedance
T&R
Packaging
Blank = Bulk
T&R = Tape and Reel
Value Added Options
Blank = No Added Options
G1 = Gull-Wing (Option 1)
G = Gull-Wing (Option 2)
CLXXX = Cut Leads
XXX = lead length code
Environmental / Mechanical
Value Added Options
Shock: MIL-STD-883, Method 2002, Condition B
Solderability: MIL-STD-883, Method 2003
Solvent Resistance: MIL-STD-202, Method 215
Vibration: MIL-STD-883, Method 2007, Condition A
Gross Leak Test: MIL-STD-883, Method 1014, Condition C
Fine Leak Test: MIL-STD-883, Method 1014, Condition A2
Gull-Wing (G1 option)
-
F o r s p e c i f i c a t i o n d e ta i l s r e f e r t o pa g e VA 3
Gull-Wing (G option) -
F o r s p e c i f i c a t i o n d e ta i l s r e f e r t o pa g e VA 3
Cut Leads (CLXXX option) -
F o r s p e c i f i c a t i o n d e ta i l s r e f e r t o pa g e VA 2
Mechanical Dimensions
Package Style A / Full-size (14 pin DIP)
20.8 max
.819 max
0.90 max
.035 max
.46 dia ±0.08
.018 dia ±.003
8
13.2 max
.520 max
15.24 ±0.13
.600 ±.005
14
Markings
Glass
Standoffs
(X4)
7.62 ±0.13
.300 ±.005
7
5.33 min
.210 min
1
Markings
Line 1 : MMD
Line 2 : Part Number
Line 3 : Frequency
Line 4 : Date Code
5.08 max
.200 max
Pin
Pin
Pin
Pin
Pin
Connections
1: Tri-State
7: Ground / Case
8: Output
14: Supply Voltage
www.mmdcomp.com
phone: 949-753-5888 / fax: 949-753-5889
8
Specifications subject to change without notice
Revision: 2/18/02 B
Package Style B / Half-size (8 pin DIP)
12.9 max
.508 max
0.90 max
.035 max
.46 dia ±0.08
.018 dia ±.003
5
12.9 max
.508 max
8
7.62 ±0.13
.300 ±.005
Pin Connections
Pin 1: Tri-State
Pin 4: Ground / Case
Pin 5: Output
Pin 8: Supply Voltage
Markings
Line 1 : MMD
Line 2 : Part Number
Line 3 : Frequency
Line 4 : Date Code
Markings
Glass
Standoffs
(X3)
4
5.33 min
.210 min
1
7.62 ±0.13
.300 ±.005
5.08 ±0.15
.200 ±.006
2.6 ±0.15
.102 ±.006
5.08 max
.200 max
Package Style I / 5X7 Ceramic SMD
4
5.0 ±0.2
.197 ±.008
7.0 ±0.2
.278 ±.008
3
1.7 max
.067 max
Pin Connections
Pin 1: Tri-State
Pin 2: Ground / Case
Pin 3: Output
Pin 4: Supply Voltage
Markings
Line 1 : MMD
Line 2 : Frequency
Line 3 : Date Code
1.2 ±0.2
.047 ±.008
Markings
1
2
3
2
4
1
1.4 ±0.1
.055 ±.004
3.68 ±0.15
.145 ±.006
Package Style D / Plastic J-Lead SMD
5.08
.200
0.25
.010
4
3
9.8 max
.386 max
7.62
.300
Pin Connections
Pin 1: Tri-State
Pin 2: Ground / Case
Pin 3: Output
Pin 4: Supply Voltage
Markings
Line 1 : MMD
Line 2 : Frequency
Line 3 : Date Code
1
2
0.51
.020
4.7 max
.185 max
14.0 max
.551 max
Suggested Solder Pad Layout
Package Style I / 5X7 Ceramic SMD
Solder Pad
(X4)
2.0
.079
2.88
.113
Package Style D / Plastic J-Lead SMD
3.0
.118
1.27
.050
Solder Pad
(X4)
1.81
.071
2.2
.087
5.8
.228
www.mmdcomp.com
phone: 949-753-5888 / fax: 949-753-5889
9
Specifications subject to change without notice
Revision: 2/18/02 B
3.81
.150
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