1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CQCC28, CERAMIC, LCC-28
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| 最大模拟输入电压 | 2.5 V |
| 最小模拟输入电压 | -2.5 V |
| 最长转换时间 | 13 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | S-CQCC-N28 |
| JESD-609代码 | e0 |
| 长度 | 11.43 mm |
| 最大线性误差 (EL) | 0.0244% |
| 湿度敏感等级 | NOT SPECIFIED |
| 标称负供电电压 | -15 V |
| 模拟输入通道数量 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出位码 | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY |
| 输出格式 | PARALLEL, WORD |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 认证状态 | MILITARY |
| 座面最大高度 | 2.54 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 11.43 mm |
| Base Number Matches | 1 |

| 5962-87591023X | 5962-8759102LA | 5962-87591013X | 5962-8759102LX | 2180822-4 | DTS24Z25-91PA | 5962-87591053X | 5962-8759104LX | 5962-87591013A | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CQCC28, CERAMIC, LCC-28 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CDIP24, 1.280 X 0.310 INCH, CERDIP-24 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CQCC28, CERAMIC, LCC-28 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CDIP24, 1.280 X 0.310 INCH, CERDIP-24 | Board Connector | MIL Series Connector | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CQCC28, CERAMIC, LCC-28 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CDIP24, 1.280 X 0.310 INCH, CERDIP-24 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, CQCC28, CERAMIC, LCC-28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | - | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | - | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | QLCC | DIP | QLCC | DIP | - | - | QLCC | DIP | QLCC |
| 包装说明 | QCCN, | DIP, | QCCN, | DIP, | - | - | QCCN, | DIP, | QCCN, |
| 针数 | 28 | 24 | 28 | 24 | - | - | 28 | 24 | 28 |
| 最大模拟输入电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - | - | 2.5 V | 2.5 V | 2.5 V |
| 最小模拟输入电压 | -2.5 V | -2.5 V | -2.5 V | -2.5 V | - | - | -2.5 V | -2.5 V | -2.5 V |
| 最长转换时间 | 13 µs | 13 µs | 13 µs | 13 µs | - | - | 13 µs | 13 µs | 13 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | - | - | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | S-CQCC-N28 | R-GDIP-T24 | S-CQCC-N28 | R-GDIP-T24 | - | - | S-CQCC-N28 | R-GDIP-T24 | S-CQCC-N28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | - | - | e4 | e0 | e0 |
| 最大线性误差 (EL) | 0.0244% | 0.0244% | 0.0244% | 0.0244% | - | - | 0.0244% | 0.0244% | 0.0244% |
| 湿度敏感等级 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT APPLICABLE | NOT APPLICABLE | - |
| 标称负供电电压 | -15 V | -15 V | -15 V | -15 V | - | - | -15 V | -15 V | -15 V |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | - | - | 1 | 1 | 1 |
| 位数 | 12 | 12 | 12 | 12 | - | - | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 | - | - | 1 | 1 | 1 |
| 端子数量 | 28 | 24 | 28 | 24 | - | - | 28 | 24 | 28 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | - | - | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | - | - | -55 °C | -55 °C | -55 °C |
| 输出位码 | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | - | - | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | - | - | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | - | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | DIP | QCCN | DIP | - | - | QCCN | DIP | QCCN |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | - | - | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | - | - | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | 220 | NOT SPECIFIED | - | - | NOT APPLICABLE | NOT APPLICABLE | NOT SPECIFIED |
| 认证状态 | MILITARY | MILITARY | MILITARY | MILITARY | - | - | MILITARY | MILITARY | Not Qualified |
| 座面最大高度 | 2.54 mm | 5.08 mm | 2.54 mm | 5.08 mm | - | - | 2.54 mm | 5.08 mm | 2.54 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | - | - | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO | - | - | YES | NO | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | - | - | BICMOS | BICMOS | BICMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | - | - | MILITARY | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | - | - | GOLD | TIN LEAD | TIN LEAD |
| 端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | - | - | NO LEAD | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | - | - | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | - | - | QUAD | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | - | - | NOT APPLICABLE | NOT APPLICABLE | NOT SPECIFIED |
| 宽度 | 11.43 mm | 7.62 mm | 11.43 mm | 7.62 mm | - | - | 11.43 mm | 7.62 mm | 11.43 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - | 1 | 1 | 1 |
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