电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MGSG520-673GG

产品描述IC Socket, BGA520, 520 Contact(s),
产品类别连接器    插座   
文件大小128KB,共1页
制造商Advanced Interconnections Corp
下载文档 详细参数 全文预览

MGSG520-673GG概述

IC Socket, BGA520, 520 Contact(s),

MGSG520-673GG规格参数

参数名称属性值
厂商名称Advanced Interconnections Corp
Reach Compliance Codecompliant
ECCN代码EAR99
其他特性STANDARD: UL 94V-0
联系完成终止GOLD OVER NICKEL
设备插槽类型IC SOCKET
使用的设备类型BGA520
外壳材料POLYETHYLENE
JESD-609代码e4
触点数520
Base Number Matches1

文档预览

下载PDF文档
Ball Grid Array
(BGA) Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
BGA Sockets
Standard Socket (S):
• Mates with Standard Adapter (A)
• Socket size same size as BGA device body
• Use with SMT Adapter for LGA and reworked
BGA device socketing
Extraction Socket (SB):
• Mates with Extraction Slot Adapter (AX)
• Socket size equals BGA body + .079/(2.0)
• Protects valuable PCB during device/adapter
extraction - tool never touches PCB
• Available in 1.0, 1.27 and 1.5mm pitch only
Features:
• Advanced
®
exclusive eutectic solder ball
terminals offer superior SMT processing.
• Uses same footprint as BGA device.
• Proven long-term performance in vigorous
temperature cycling applications - solder
ball terminal absorbs TCE mismatch.
• Closed bottom socket terminal for 100%
anti-wicking of solder.
• Gold contacts allow gold/gold
interconnections to male Adapter pins.
• Low insertion force socket with multi-
fingered high reliability Beryllium Copper
contacts.
• Coplanarity consistently under .006 inch
industry standard.
• In-house Tape and Reel packaging
available.
• See page 4 for How It Works.
Guide Post Socket (SG):
• Integral molded corners allow accurate positioning of
device/adapter assembly in blind-mating applications.
• Mates with Extraction Slot Adapter (AX)
• Socket size equals BGA body + .276/(7.00)
• Available in 1.27 and 1.5mm pitch only
Terminals:
1.27 & 1.5mm Pitch Terminals
Type -636
Type -673
Solder Ball
STANDARD
.117
(2.97)
1.0mm Pitch Terminals
Type -716
Type -717
Solder Ball
.105
(2.67)
.090
(2.29)
Thru-Hole
.090
(2.29)
.125
(3.18)
.024/(0.61) Dia.
PATENTED
.015 Dia.
(0.38)
Thru-Hole
.117
(2.97)
.095
(2.41)
.030 Dia.
(0.76)
.128
(3.25)
.018 Dia.
(0.46)
.105
(2.67)
PATENTED
Terminals and Contacts:
Terminals: Brass - Copper Alloy (C36000)
ASTM-B-16
Contacts: Beryllium Copper - Copper
Alloy (C17200), ASTM-B-194
0.80mm Pitch Terminals
Type -731
Type -702
Solder Ball
Thru-Hole
0.75mm Pitch Terminals
Type -758
Solder Ball
.125
(3.18)
.125
(3.18)
.080
(2.03)
.011 Dia.
(0.28)
.125
(3.18)
.020/(0.51) Dia.
.018/(0.46) Dia.
PATENTED
Plating:
G - Gold over Nickel
PATENTED
Body Material:
M - Molded High Temp. Glass Filled
Thermoplastic (P.P.S.), U.L. Rated 94V-O,
-60˚C to 260˚C (-76˚F to 500˚F)
F - FR-4 Glass Epoxy, U.L. Rated 94V-O
1
Footprint Dash#
If Applicable
How To Order
M
G
S
XXX -636
G
G
Contact Plating
G - Gold
Terminal Plating
G - Gold
Terminal Type
Number of Positions
See BGA Footprint section or web site
Model Type
S
= Standard Socket
SB
= Extraction Slot (1.5, 1.27 and 1.0mm pitch only)
SG
= Guide Post Socket (1.5 and 1.27mm pitch only)
Solder:
63Sn/37Pb, Eutectic, 183˚C (361.4˚F)
Body Type
M - Molded PPS (1.27 & 1.5mm pitch)
F - FR-4 (0.75, 0.80 & 1.0mm pitch)
Pitch
B = .059/(1.5mm)
G = .050/(1.27mm)
H = .039/(1.0mm)
J = .0315/(0.80mm)
K = .0295/(0.75mm)
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
Page 5
初学者之---uClinux和Linux的异同分析
标准Linux是针对有MMU的处理器设计的。在这种处理器上,虚拟地址被送到MMU,把虚拟地址映射为物理地址。通过赋予每个任务不同的虚拟-物理地址转换映射,支持不同任务之间的保护。uClinux是针对 ......
kandy2059 单片机
Quartus 9.0 破解后依然出现以下问题 已经弄了一周了,急需解决!
这是用SOPC builder 生成 cpu过程的 信息提示 我试过很多license了 但仍然是这个问题 正常生成的话 Encrypted license 貌似是不用found 问题出在哪儿呢?请各位大侠看看啊!谢谢啦!!! # ......
sunshineJ313 FPGA/CPLD
51单片机波形发生器
最近在做单片机课设,要求用纯汇编语言,路过的大神点拨一下啊! 要求波形发生器。三种信号:正弦波、方波、三角波。利用DA转换器设计一波形发生器,要求波形的峰峰值(0-5v)、频率可调。(通 ......
qixing232325 51单片机
Blinky
流水灯测试代码...
jxb01033016 嵌入式系统
关于段码屏暗影明暗划
关于段码屏暗影明暗划 比如只想闪烁一部分内容,其他的内容不想显示出来 1但是不需要的也跟着显示出来,隐隐约约不是很明显。 大家是如何处理的?硬件就是COM口和SEG口控制!软件上是不是可以处 ......
QWE4562009 分立器件
开关电源变压器设计+破解过程
4896048961489624896348964...
czf0408 电源技术

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2654  1107  2569  707  1492  3  22  48  32  33 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved