HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | ST(意法半导体) |
零件包装代码 | SOIC |
包装说明 | SOP, SOP16,.25 |
针数 | 16 |
Reach Compliance Code | compli |
其他特性 | ONE FUNCTION WITH TWO BITS |
控制类型 | ENABLE LOW |
系列 | HCT |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e4 |
长度 | 9.9 mm |
负载电容(CL) | 150 pF |
逻辑集成电路类型 | BUS DRIVER |
最大I(ol) | 0.006 A |
位数 | 6 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | INVERTED |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP16,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
Prop。Delay @ Nom-Su | 36 ns |
传播延迟(tpd) | 45 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3.9 mm |
M74HCT368M1R | M74HCT368C1R | M74HCT368B1R | M74HCT368 | M74HCT367C1R | M54HCT368 | M54HCT368F1R | M54HCT367F1R | M54HCT367 | |
---|---|---|---|---|---|---|---|---|---|
描述 | HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING | HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING | HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING | HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING | HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING | HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING | HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING | HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING | HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING |
是否Rohs认证 | 符合 | - | 符合 | - | 符合 | - | 不符合 | 不符合 | - |
零件包装代码 | SOIC | - | DIP | - | QFN | - | DIP | DIP | - |
包装说明 | SOP, SOP16,.25 | - | DIP, DIP16,.3 | - | QCCJ, LDCC20,.4SQ | - | DIP, DIP16,.3 | DIP, DIP16,.3 | - |
针数 | 16 | - | 16 | - | 20 | - | 16 | 16 | - |
Reach Compliance Code | compli | - | compli | - | compli | - | _compli | _compli | - |
其他特性 | ONE FUNCTION WITH TWO BITS | - | ONE FUNCTION WITH TWO BITS | - | ONE FUNCTION WITH TWO BITS | - | ONE FUNCTION WITH TWO BITS | ONE FUNCTION WITH TWO BITS | - |
控制类型 | ENABLE LOW | - | ENABLE LOW | - | ENABLE LOW | - | ENABLE LOW | ENABLE LOW | - |
系列 | HCT | - | HCT | - | HCT | - | HCT | HCT | - |
JESD-30 代码 | R-PDSO-G16 | - | R-PDIP-T16 | - | S-PQCC-J20 | - | R-GDIP-T16 | R-GDIP-T16 | - |
JESD-609代码 | e4 | - | e3 | - | e3 | - | e0 | e0 | - |
负载电容(CL) | 150 pF | - | 150 pF | - | 150 pF | - | 150 pF | 150 pF | - |
逻辑集成电路类型 | BUS DRIVER | - | BUS DRIVER | - | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | - |
最大I(ol) | 0.006 A | - | 0.006 A | - | 0.006 A | - | 0.006 A | 0.006 A | - |
位数 | 6 | - | 6 | - | 6 | - | 6 | 6 | - |
功能数量 | 1 | - | 1 | - | 1 | - | 1 | 1 | - |
端口数量 | 2 | - | 2 | - | 2 | - | 2 | 2 | - |
端子数量 | 16 | - | 16 | - | 20 | - | 16 | 16 | - |
最高工作温度 | 125 °C | - | 125 °C | - | 85 °C | - | 125 °C | 125 °C | - |
最低工作温度 | -55 °C | - | -55 °C | - | -40 °C | - | -55 °C | -55 °C | - |
输出特性 | 3-STATE | - | 3-STATE | - | 3-STATE | - | 3-STATE | 3-STATE | - |
输出极性 | INVERTED | - | INVERTED | - | TRUE | - | INVERTED | TRUE | - |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - |
封装代码 | SOP | - | DIP | - | QCCJ | - | DIP | DIP | - |
封装等效代码 | SOP16,.25 | - | DIP16,.3 | - | LDCC20,.4SQ | - | DIP16,.3 | DIP16,.3 | - |
封装形状 | RECTANGULAR | - | RECTANGULAR | - | SQUARE | - | RECTANGULAR | RECTANGULAR | - |
封装形式 | SMALL OUTLINE | - | IN-LINE | - | CHIP CARRIER | - | IN-LINE | IN-LINE | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
电源 | 5 V | - | 5 V | - | 5 V | - | 5 V | 5 V | - |
Prop。Delay @ Nom-Su | 36 ns | - | 36 ns | - | 28 ns | - | 36 ns | 33 ns | - |
传播延迟(tpd) | 45 ns | - | 45 ns | - | 35 ns | - | 45 ns | 42 ns | - |
认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | - |
座面最大高度 | 1.75 mm | - | 5.1 mm | - | 4.57 mm | - | 5.08 mm | 5.08 mm | - |
最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | - | 5.5 V | - | 5.5 V | 5.5 V | - |
最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | - | 4.5 V | - | 4.5 V | 4.5 V | - |
标称供电电压 (Vsup) | 5 V | - | 5 V | - | 5 V | - | 5 V | 5 V | - |
表面贴装 | YES | - | NO | - | YES | - | NO | NO | - |
技术 | CMOS | - | CMOS | - | CMOS | - | CMOS | CMOS | - |
温度等级 | MILITARY | - | MILITARY | - | INDUSTRIAL | - | MILITARY | MILITARY | - |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Matte Tin (Sn) | - | Matte Tin (Sn) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
端子形式 | GULL WING | - | THROUGH-HOLE | - | J BEND | - | THROUGH-HOLE | THROUGH-HOLE | - |
端子节距 | 1.27 mm | - | 2.54 mm | - | 1.27 mm | - | 2.54 mm | 2.54 mm | - |
端子位置 | DUAL | - | DUAL | - | QUAD | - | DUAL | DUAL | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
宽度 | 3.9 mm | - | 7.62 mm | - | 8.9662 mm | - | 7.62 mm | 7.62 mm | - |
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