UV PLD, 20ns, 24-Cell, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | LCC |
| 包装说明 | WQCCN, LCC44,.65SQ |
| 针数 | 44 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 其他特性 | 24 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK |
| 最大时钟频率 | 33 MHz |
| 系统内可编程 | NO |
| JESD-30 代码 | S-CQCC-N44 |
| JESD-609代码 | e0 |
| JTAG BST | NO |
| 长度 | 16.55 mm |
| 专用输入次数 | 13 |
| I/O 线路数量 | 24 |
| 宏单元数 | 24 |
| 端子数量 | 44 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 13 DEDICATED INPUTS, 24 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | WQCCN |
| 封装等效代码 | LCC44,.65SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, WINDOW |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 5 V |
| 可编程逻辑类型 | UV PLD |
| 传播延迟 | 20 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 3.05 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 16.55 mm |
| Base Number Matches | 1 |

| 5962-9154505MXA | 5962-9154506MXA | 5962-9154506MYA | 5962-9154504MXA | 5962-9154504MYA | 5962-9154505MYA | |
|---|---|---|---|---|---|---|
| 描述 | UV PLD, 20ns, 24-Cell, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 | UV PLD, 25ns, 24-Cell, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 | UV PLD, 25ns, 24-Cell, CMOS, CQCC44, WINDOWED, CERAMIC, JLCC-44 | UV PLD, 15ns, 24-Cell, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 | UV PLD, 15ns, 24-Cell, CMOS, CQCC44, WINDOWED, CERAMIC, JLCC-44 | UV PLD, 20ns, 24-Cell, CMOS, CQCC44, WINDOWED, CERAMIC, JLCC-44 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| 零件包装代码 | LCC | LCC | LCC | LCC | LCC | LCC |
| 包装说明 | WQCCN, LCC44,.65SQ | WQCCN, LCC44,.65SQ | WQCCJ, LDCC44,.7SQ | WQCCN, LCC44,.65SQ | WQCCJ, LDCC44,.7SQ | WINDOWED, CERAMIC, JLCC-44 |
| 针数 | 44 | 44 | 44 | 44 | 44 | 44 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 其他特性 | 24 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 24 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 24 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 24 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 24 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 24 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK |
| 最大时钟频率 | 33 MHz | 27 MHz | 27 MHz | 50 MHz | 50 MHz | 33 MHz |
| 系统内可编程 | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | S-CQCC-N44 | S-CQCC-N44 | S-CQCC-J44 | S-CQCC-N44 | S-CQCC-J44 | S-CQCC-J44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| JTAG BST | NO | NO | NO | NO | NO | NO |
| 长度 | 16.55 mm | 16.55 mm | 16.65 mm | 16.55 mm | 16.65 mm | 16.65 mm |
| 专用输入次数 | 13 | 13 | 13 | 13 | 13 | 13 |
| I/O 线路数量 | 24 | 24 | 24 | 24 | 24 | 24 |
| 宏单元数 | 24 | 24 | 24 | 24 | 24 | 24 |
| 端子数量 | 44 | 44 | 44 | 44 | 44 | 44 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 13 DEDICATED INPUTS, 24 I/O | 13 DEDICATED INPUTS, 24 I/O | 13 DEDICATED INPUTS, 24 I/O | 13 DEDICATED INPUTS, 24 I/O | 13 DEDICATED INPUTS, 24 I/O | 13 DEDICATED INPUTS, 24 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | WQCCN | WQCCN | WQCCJ | WQCCN | WQCCJ | WQCCJ |
| 封装等效代码 | LCC44,.65SQ | LCC44,.65SQ | LDCC44,.7SQ | LCC44,.65SQ | LDCC44,.7SQ | LDCC44,.7SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | 225 | NOT SPECIFIED | 225 | 225 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 可编程逻辑类型 | UV PLD | UV PLD | UV PLD | UV PLD | UV PLD | UV PLD |
| 传播延迟 | 20 ns | 25 ns | 25 ns | 15 ns | 15 ns | 20 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 座面最大高度 | 3.05 mm | 3.05 mm | 4.57 mm | 3.05 mm | 4.57 mm | 4.57 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | NO LEAD | NO LEAD | J BEND | NO LEAD | J BEND | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | 30 | 30 |
| 宽度 | 16.55 mm | 16.55 mm | 16.65 mm | 16.55 mm | 16.65 mm | 16.65 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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