HCPL-2400 and HCPL-2430
20 MBd High CMR Logic Gate Optocouplers
Data Sheet
Description
The HCPL-2400 and HCPL-2430 high speed opto-couplers
combine an 820 nm AlGaAs light emitting diode with a
high speed photodetector. This combination results in
very high data rate capability and low input current. The
totem pole output (HCPL-2430) or three state output
(HCPL-2400) eliminates the need for a pull up resistor and
allows for direct drive of data buses.
The detector has optical receiver input stage with built-
in Schmitt trigger to provide logic compatible wave-
forms, eliminating the need for additional waveshaping.
The hysteresis provides differential mode noise immunity
and minimizes the potential for output signal chatter.
The electrical and switching characteristics of the HCPL-
2400 and HCPL-2430 are guaranteed over the tempera-
ture range of 0°C to 70°C.
These optocouplers are compatible with TTL, STTL,
LSTTL, and HCMOS logic families. When Schottky type
TTL devices (STTL) are used, a data rate performance
of 20 MBd over temperature is guaranteed when using
the application circuit of Figure 13. Typical data rates are
40 MBd.
Features
• High speed: 40 MBd typical data rate
• High common mode rejection:
HCPL-2400: 10 kV/µs at V
CM
= 300 V (typical)
• AC performance guaranteed over temperature
• High speed AlGaAs emitter
• Compatible with TTL, STTL, LSTTL, and HCMOS logic
families
• Totem pole and tri state output (no pull up resistor
required)
• Safety approval
– UL recognized – 3750 V rms for 1 minute per
UL1577
– IEC/EN/DIN EN 60747-5-2 approved with
V
IORM
= 630 V
peak
(Option 060)
– CSA approved
• High power supply noise immunity
• MIL-PRF-38534 hermetic version available
(HCPL-5400/1 and HCPL-5430/1)
Applications
•
•
•
•
•
•
•
•
Isolation of high speed logic systems
Computer-peripheral interfaces
Switching power supplies
Isolated bus driver (networking applications)
Ground loop elimination
High speed disk drive I/O
Digital isolation for A/D, D/A conversion
Pulse transformer replacement
Functional Diagram
HCPL-2400/11
1 NC
2
3
4 NC
V
CC
8
7
6
5
ANODE 1 1
CATHODE 1 2
CATHODE 2 3
ANODE 2 4
HCPL-2430
8 V
CC
7 V
O1
6 V
O2
5 GND
GND
TRUTH TABLE
(POSITIVE LOGIC)
LED
ON
OFF
ON
OFF
ENABLE
L
L
H
H
OUTPUT
L
H
Z
Z
TRUTH TABLE
(POSITIVE LOGIC)
LED
OUTPUT
ON
L
OFF
H
A 0.1 µF bypass capacitor must be connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of
this component to prevent damage and/or degradation which may be induced by ESD.
Selection Guide
8-Pin DIP (300 Mil)
Minimum CMR
Single
Dual
Channel
Channel
dV/dt
Package
Package
(V/µs)
HCPL-2400
1000
HCPL-2430
1000
500
500
500
V
CM
(V)
300
50
50
50
50
Minimum Input
On Current
(mA)
4
4
6
6
6
Maximum
Propagation Delay
(ns)
60
60
60
60
60
Hermetic
Package
HCPL-540X*
HCPL-543X*
HCPL-643X*
*Technical data for the Hermetic HCPL-5400/01, HCPL-5430/31, and HCPL-6430/31 are on separate Avago publications.
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-2400#XXX
060 = IEC/EN/DIN EN 60747-5-2 V
IORM
= 630 V
peak
Option
300 = Gull Wing Surface Mount Option
500 = Tape and Reel Packaging Option
HCPL-2400-XXXE = Lead Free Option
Schematic
I
CC
8
1 I
F1
+
V
F1
–
2
I
O
7
V
CC
V
O1
I
CC
I
E
I
O
8
7
6
V
CC
V
E
V
O
2 I
F
ANODE
+
V
F
CATHODE
–
3
5
GND
3
–
V
F2
+
4 I
F2
SHIELD
I
O
6
5
V
O2
TRUTH TABLE
(POSITIVE LOGIC)
LED
ON
OFF
ON
OFF
ENABLE
L
L
H
H
OUTPUT
L
H
Z
Z
GND
TRUTH TABLE
(POSITIVE LOGIC)
LED
OUTPUT
ON
L
OFF
H
2
Package Outline Drawings
8-Pin DIP Package (HCPL-2400, HCPL-2430)
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
5
OPTION CODE*
DATE CODE
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
A XXXXZ
YYWW RU
1
1.19 (0.047) MAX.
2
3
4
UL
RECOGNITION
1.78 (0.070) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
5 TYP.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES).
*MARKING CODE LETTER FOR OPTION NUMBERS.
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
8-Pin DIP Package with Gull Wing Surface Mount Option 300
(HCPL-2400, HCPL-2430)
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
1.016 (0.040)
6.350 ± 0.25
(0.250 ± 0.010)
10.9 (0.430)
1
2
3
4
1.27 (0.050)
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
2.0 (0.080)
1.19
(0.047)
MAX.
3.56 ± 0.13
(0.140 ± 0.005)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.635 ± 0.25
(0.025 ± 0.010)
12 NOM.
3
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
TEMPERATURE (°C)
200
160°C
150°C
140°C
2.5°C ± 0.5°C/SEC.
30
SEC.
3°C + 1°C/–0.5°C
30
SEC.
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
0
0
50
100
TIME (SECONDS)
150
200
250
ROOM
TEMPERATURE
Recommended Pb-Free IR Profile
t
p
T
p
T
L
TEMPERATURE
T
smax
T
smin
t
s
PREHEAT
60 to 180 SEC.
25
t 25 C to PEAK
TIME
NOTES:
THE TIME FROM 25 C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200
°C,
T
smin
= 150
°C
t
L
60 to 150 SEC.
260 +0/-5
°C
217
°C
RAMP-UP
3
°C/SEC.
MAX.
150 - 200
°C
RAMP-DOWN
6
°C/SEC.
MAX.
TIME WITHIN 5
°C
of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
Regulatory Information
The HCPL-24XX has been approved by the following organizations:
VDE
Approved according to VDE 0884/06.92 (Option 060 only).
UL
Recognized under UL 1577, Component Recognition Program, File E55361.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01. (Option 060 only)
4
Insulation and Safety Related Specifications
Parameter
Minimum External
Air Gap (External
Clearance)
Minimum External
Tracking (External
Creepage)
Minimum Internal
Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
Symbol
L(101)
L(102)
Value
7.1
7.4
0.08
Units
mm
mm
mm
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Through insulation distance, conductor to
conductor, usually the direct distance between the
photoemitter and photodetector inside the
optocoupler cavity.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
CTI
200
IIIa
Volts
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics
(HCPL-2400 OPTION 060 ONLY)
Description
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage
≤300
V rms
for rated mains voltage
≤450
V rms
Climatic Classification
Pollution Degree (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b*
V
IORM
x 1.875 = V
PR
, 100% Production Test with t
m
= 1 sec,
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
V
IORM
x 1.5 = V
PR
, Type and sample test,
t
m
= 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, t
ini
= 10 sec)
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 12, Thermal Derating curve.)
Case Temperature
Input Current
Output Power
Insulation Resistance at T
S
, V
IO
= 500 V
Symbol
Characteristic
I-IV
I-III
55/85/21
2
630
1181
Units
V
IORM
V
PR
V
PR
V
IOTM
V
peak
V
peak
V
peak
V
peak
945
6000
I
S,INPUT
P
S,OUTPUT
R
S
T
S
175
230
600
≥10
9
°C
mA
mW
Ω
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section IEC/EN/DIN EN 60747-5-2 for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must ben ensured by protective circuits in applica-
tion.
5
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
