H
Hermetically Sealed, High Speed,
High CMR, Logic Gate
Optocouplers
Technical Data
6N134*
81028
HCPL-563X
HCPL-663X
HCPL-665X
5962-90855
HCPL-560X
*See matrix for available extensions.
Features
• Dual Marked with Device
Part Number and DESC
Drawing Number
• Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
• QML-38534, Class H and K
• Five Hermetically Sealed
Package Configurations
• Performance Guaranteed
over -55
°
C to +125
°
C
• High Speed: 10 M Bit/s
• CMR: > 10,000 V/
µ
s Typical
• 1500 Vdc Withstand Test
Voltage
• High Radiation Immunity
• 6N137, HCPL-2601, HCPL-
2630/-31 Function
Compatibility
• Reliability Data
• TTL Circuit Compatibility
•
•
•
•
Isolated Input Line Receiver
Isolated Output Line Driver
Logic Ground Isolation
Harsh Industrial
Environments
• Isolation for Computer,
Communication, and Test
Equipment Systems
Truth Table
(Positive Logic)
Multichannel Devices
Input
On (H)
Off (L)
Output
L
H
Single Channel DIP
Description
These units are single, dual and
quad channel, hermetically sealed
optocouplers. The products are
capable of operation and storage
over the full military temperature
range and can be purchased as
either standard product or with
full MIL-PRF-38534 Class Level H
or K testing or from the appropri-
ate DESC Drawing. All devices are
manufactured and tested on a
MIL-PRF-38534 certified line and
are included in the DESC Quali-
fied Manufacturers List QML-
38534 for Hybrid Microcircuits.
Quad channel devices are
available by special order in the
16 pin DIP through hole
packages.
Input
On (H)
Off (L)
On (H)
Off (L)
Enable
H
H
L
L
Output
L
H
H
H
Functional Diagram
Multiple Channel Devices
Available
V
CC
V
E
V
OUT
Applications
• Military and Space
• High Reliability Systems
• Transportation, Medical, and
Life Critical Systems
• Line Receiver
• Voltage Level Shifting
GND
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
1-536
5965-3003E
Each channel contains a GaAsP
light emitting diode which is
optically coupled to an integrated
high speed photon detector. The
output of the detector is an open
collector Schottky clamped
transistor. Internal shields
provide a guaranteed common
mode transient immunity
specification of 1000 V/µs.
Selection for higher levels of
CMR values are available by
special request. Package styles
for these parts are 8 and 16 pin
DIP through hole (case outlines P
and E respectively), 16 pin DIP
flat pack (case outline F), and
leadless ceramic chip carrier
(case outline 2). Devices may be
purchased with a variety of lead
bend and plating options. See
Selection Guide Table for details.
Standard Military Drawing (SMD)
parts are available for each
package and lead style.
Because the same electrical die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are identical for all parts.
Occasional exceptions exist due
to package variations and
limitations, and are as noted.
Additionally, the same package
assembly processes and materials
are used in all devices. These
similarities give justification for
the use of data obtained from one
part to represent other parts’
performance for die related
reliability and certain limited
radiation test results.
Selection Guide–Package Styles and Lead Configuration Options
Package
16 Pin DIP
Lead Style
Through Hole
Channels
2
Common Channel
V
CC
, GND
Wiring
HP Part # & Options
Commercial
6N134*
MIL-PRF-38534, Class H 6N134/883B
MIL-PRF-38534, Class K HCPL-268K
Standard Lead Finish
Gold Plate
Solder Dipped
Option #200
Butt Cut/Gold Plate
Option #100
Gull Wing/Soldered
Option #300
SMD Part #
Prescript for all below
None
Either Gold or Solder
8102801EX
Gold Plate
8102801EC
Solder Dipped
8102801EA
Butt Cut/Gold Plate
8102801UC
Butt Cut/Soldered
8102801UA
Gull Wing/Soldered
8102801TA
*JEDEC registered part.
8 Pin DIP
Through Hole
1
None
8 Pin DIP
Through Hole
2
V
CC
, GND
16 Pin Flat Pack
Unformed Leads
4
V
CC
, GND
20 Pad LCCC
Surface Mount
2
None
HCPL-5600
HCPL-5601
HCPL-560K
Gold Plate
Option #200
Option #100
Option #300
5962-
9085501HPX
9085501HPC
9085501HPA
9085501HYC
9085501HYA
9085501HXA
HCPL-5630
HCPL-5631
HCPL-563K
Gold Plate
Option #200
Option #100
Option #300
None
8102802PX
8102802PC
8102802PA
8102802YC
8102802YA
8102802ZA
HCPL-6650
HCPL-6651
HCPL-665K
Gold Plate
HCPL-6630
HCPL-6631
HCPL-663K
Solder Pads
None
8102804FX
8102804FC
None
81028032X
81028032A
1-537
HERMETIC/HI-REL
OPTOCOUPLERS
Functional Diagrams
16 Pin DIP
Through Hole
2 Channels
1
2
3
4
5
6
7
8
GND
VO2
VCC
VO1
16
15
14
13
12
11
10
9
3
4
1
2
V
CC
V
E
V
OUT
6
5
8
7
1
V
CC
V
O1
V
O2
8
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
16 Pin Flat Pack
Unformed Leads
4 Channels
1
2
3
4
6
20 Pad LCCC
Surface Mount
2 Channels
15
V
CC2
19
20
V
O2
GND
2
V
O1
GND
1
7
8
V
CC1
13
12
16
VCC
VO1
VO2
VO3
VO4
GND
15
14
13
12
11
10
9
2
3
2
3
4
7
5
GND
5
10
6
7
8
GND
Note:
All DIP and flat pack devices have common V
CC
and ground. Single channel DIP has an enable pin 7. LCCC (leadless ceramic
chip carrier) package has isolated channels with separate V
CC
and ground connections.
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
20.06 (0.790)
20.83 (0.820)
0.89 (0.035)
1.65 (0.065)
4.45 (0.175)
MAX.
8.13 (0.320)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Leaded Device Marking
HP LOGO
HP P/N
DESC SMD*
DESC SMD*
PIN ONE/
ESD IDENT
HP QYYWWZ
XXXXXX
XXXXXXX
XXX USA
* 50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
HP FSCN*
Leadless Device Marking
HP LOGO
HP P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
HP QYYWWZ
XXXXXX
* XXXX
XXXXXX
USA 50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DESC SMD*
DESC SMD*
HP FSCN*
* QUALIFIED PARTS ONLY
* QUALIFIED PARTS ONLY
1-538
Outline Drawings (continued)
16 Pin Flat Pack, 4 Channels
7.24 (0.285)
6.99 (0.275)
2.29 (0.090)
MAX.
1.27 (0.050)
REF.
11.13 (0.438)
10.72 (0.422)
0.46 (0.018)
0.36 (0.014)
8.13 (0.320)
MAX.
2.85 (0.112)
MAX.
0.88 (0.0345)
MIN.
0.89 (0.035)
0.69 (0.027)
5.23
(0.206)
MAX.
9.02 (0.355)
8.76 (0.345)
0.31 (0.012)
0.23 (0.009)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
20 Terminal LCCC Surface Mount,
2 Channels
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
8 Pin DIP Through Hole, 1 and 2 Channel
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
8.13 (0.320)
8.13 (0.320)
MAX.
MAX.
7.16 (0.282)
7.16 (0.282)
7.57 (0.298)
7.57 (0.298)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALLIZED
CASTILLATIONS (20 PLCS)
0.64
(0.025)
(20 PLCS)
0.51 (0.020)
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.20 (0.008)
0.33 (0.013)
0.33 (0.013)
1.78 (0.070)
2.03 (0.080)
1.52 (0.060)
2.03 (0.080)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
7.36 (0.290)
7.36 (0.290)
7.87 (0.310)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
1-539
HERMETIC/HI-REL
OPTOCOUPLERS
Hermetic Optocoupler Options
Option
100
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This
option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below
for details).
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
200
300
Lead finish is solder dipped rather than gold plated. This option is available on commercial
and hi-rel product in 8 and 16 pin DIP. DESC Drawing part numbers contain provisions for
lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a
standard feature.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This
option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below
for details). This option has solder dipped leads.
5.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
5.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
5.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
5° MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1-540
PCB设计
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