Low Input Current, High Gain
Optocouplers
Technical Data
6N139
HCPL-0701
HCNW139
6N138
HCPL-0700
HCNW138
Features
• High Current Transfer Ratio
– 2000% Typical (4500%
Typical for HCNW139/138)
• Low Input Current
Requirements – 0.5 mA
• TTL Compatible Output –
0.1 V V
OL
Typical
• Performance Guaranteed
over Temperature 0
°
C
to 70
°
C
• Base Access Allows Gain
Bandwidth Adjustment
• High Output Current –
60 mA
• Safety Approval
UL Recognized – 3750 V rms
for 1 Minute and 5000 V rms*
for 1 Minute per UL 1577
CSA Approved
IEC/EN/DIN EN 60747-5-2
Approved with V
IORM
= 1414
V
peak
for HCNW139 and
HCNW138
• Available in 8-Pin DIP or
SOIC-8 Footprint or
Widebody Package
• MIL-PRF-38534 Hermetic
Version Available (HCPL-
5700/1)
Applications
• Ground Isolate Most Logic
Families – TTL/TTL, CMOS/
TTL, CMOS/CMOS, LSTTL/
TTL, CMOS/LSTTL
• Low Input Current Line
Receiver
• High Voltage Insulation
(HCNW139/138)
• EIA RS-232C Line Receiver
• Telephone Ring Detector
• 117 V ac Line Voltage Status
Indicator – Low Input Power
Dissipation
• Low Power Systems –
Ground Isolation
Description
These high gain series couplers
use a Light Emitting Diode and an
integrated high gain photodetec-
tor to provide extremely high
current transfer ratio between
input and output. Separate pins
for the photodiode and output
stage result in TTL compatible
saturation voltages and high
speed operation. Where desired
the V
CC
and V
O
terminals may be
tied together to achieve conven-
tional photodarlington operation.
A base access terminal allows a
gain bandwidth adjustment to be
made.
Functional Diagram
NC 1
ANODE 2
CATHODE 3
NC 4
8 V
CC
7 V
B
6 V
O
5 GND
TRUTH TABLE
LED
V
O
LOW
ON
HIGH
OFF
*5000 V rms/1 minute rating is for HCNW139/138 and Option 020 (6N139/138) products only.
A 0.1
µF
bypass capacitor connected between pins 8 and 5 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
2
The 6N139, HCPL-0701, and
CNW139 are for use in CMOS,
LSTTL or other low power appli-
cations. A 400% minimum current
transfer ratio is guaranteed over
0 to 70°C operating range for only
0.5 mA of LED current.
The 6N138, HCPL-0700, and
HCNW138 are designed for use
mainly in TTL applications.
Current Transfer Ratio (CTR) is
300% minimum over 0 to 70°C
for an LED current of 1.6 mA
(1 TTL Unit load ). A 300%
minimum CTR enables operation
with 1 TTL Load using a 2.2 kΩ
pull-up resistor.
Selection for lower input current
down to 250
µA
is available upon
request.
The HCPL-0701 and HCPL-0700
are surface mount devices
packaged in an industry standard
SOIC-8 footprint.
The SOIC-8 does not require
“through holes” in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
The HCNW139 and HCNW138
are packaged in a widebody
encapsulation that provides creep-
age and clearance dimensions
suitable for safety approval by
regulatory agencies worldwide.
Selection Guide
8-Pin DIP
(300 Mil)
Single
Channel
Package
6N139
6N138
HCPL-4701
[1]
Dual
Channel
Package
HCPL-
2731
[1]
2730
[1]
4731
[1]
Widebody
Package
(400 mil)
Single
Channel
Package
HCNW139
HCNW138
Minimum
Input ON
Current
(I
F
)
0.5 mA
1.6 mA
40
µA
0.5 mA
Absolute
Maxi-
mum
V
CC
18 V
7V
18 V
20 V
5701
[1]
5700
[1]
5731
[1]
5730
[1]
Hermetic
Single and
Dual
Channel
Packages
HCPL-
Small Outline SO-8
Single
Dual
Channel
Channel
Package
Package
HCPL-
HCPL-
0701
0700
070A
[1]
0731
0730
073A
[1]
Minimum
CTR
400%
300%
800%
300%
Note:
1. Technical data are on separate Agilent publications.
3
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
6N139#XXXX
020 = 5000 V rms/1 Minute UL Rating Option*
300 = Gull Wing Surface Mount Option†
500 = Tape and Reel Packaging Option
XXXE = Lead Free Option
Option data sheets available. Contact your Agilent sales representative or authorized distributor for
information.
*For 6N139 and 6N138 only.
†Gull wing surface mount option applies to through hole parts only.
Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July
2001 and lead free option will use “-”
Schematic
V
CC
8
I
CC
2
ANODE
+
V
F
CATHODE
–
3
I
O
6
V
O
I
F
5
SHIELD
GND
I
B
7
V
B
4
Package Outline Drawings
8-Pin DIP Package (6N139/6N138)**
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
5
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
OPTION CODE*
DATE CODE
A XXXXZ
YYWW RU
1
1.19 (0.047) MAX.
2
3
4
UL
RECOGNITION
1.78 (0.070) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
5° TYP.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES).
* MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
**JEDEC Registered Data.
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138)
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
1.016 (0.040)
6.350 ± 0.25
(0.250 ± 0.010)
10.9 (0.430)
1
2
3
4
1.27 (0.050)
2.0 (0.080)
1.19
(0.047)
MAX.
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
3.56 ± 0.13
(0.140 ± 0.005)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
5
Small Outline SO-8 Package (HCPL-0701/HCPL-0700)
LAND PATTERN RECOMMENDATION
8
7
6
5
3.937 ± 0.127
(0.155 ± 0.005)
XXX
YWW
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
4
7.49 (0.295)
PIN ONE
1
0.406 ± 0.076
(0.016 ± 0.003)
2
3
1.9 (0.075)
1.270 BSC
(0.050)
0.64 (0.025)
*
5.080 ± 0.127
(0.200 ± 0.005)
7°
45° X
0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
0 ~ 7°
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
0.228 ± 0.025
(0.009 ± 0.001)
*
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.305 MIN.
(0.012)
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
8-Pin Widebody DIP Package (HCNW139/HCNW138)
11.15 ± 0.15
(0.442 ± 0.006)
8
7
6
5
11.00 MAX.
(0.433)
9.00 ± 0.15
(0.354 ± 0.006)
TYPE NUMBER
DATE CODE
A
HCNWXXXX
YYWW
1
2
3
4
1.55
(0.061)
MAX.
10.16 (0.400)
TYP.
7° TYP.
+ 0.076
0.254 - 0.0051
+ 0.003)
(0.010 - 0.002)
5.10 MAX.
(0.201)
3.10 (0.122)
3.90 (0.154)
2.54 (0.100)
TYP.
1.78 ± 0.15
(0.070 ± 0.006)
0.40 (0.016)
0.56 (0.022)
0.51 (0.021) MIN.
DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
模拟电子
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
