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24LC02B-ET/SN

产品描述256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8
产品类别存储    存储   
文件大小797KB,共42页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
标准
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24LC02B-ET/SN概述

256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8

24LC02B-ET/SN规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Microchip(微芯科技)
零件包装代码SOIC
包装说明3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8
针数8
Reach Compliance Codecompliant
ECCN代码EAR99
最大时钟频率 (fCLK)0.4 MHz
JESD-30 代码R-PDSO-G8
JESD-609代码e3
长度4.9 mm
内存密度2048 bit
内存集成电路类型EEPROM
内存宽度8
湿度敏感等级1
功能数量1
端子数量8
字数256 words
字数代码256
工作模式SYNCHRONOUS
最高工作温度125 °C
最低工作温度-40 °C
组织256X8
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE
并行/串行SERIAL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.75 mm
串行总线类型I2C
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)2.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间40
宽度3.9 mm
最长写入周期时间 (tWC)5 ms
Base Number Matches1

文档预览

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24AA00/24LC00/24C00
24AA014/24LC014
24AA02/24LC02B
24AA024/24LC024
24AA04/24LC04B
24AA16/24LC16B
24AA64/24LC64/24FC64
24AA256/24LC256/24FC256
24AA01/24LC01B
24C01C/24C02C
24AA025/24LC025
24AA08/24LC08B
24AA32A/24LC32A
24AA128/24LC128/24FC128
24AA512/24LC512/24FC512
24AA1025/24LC1025/24FC1025
I
2
C
Serial EEPROM Family Data Sheet
Features:
• 128-bit through 1024 Kbit Devices
• Single Supply with Operation Down to 1.7V for
24AAXX Devices
• Low-Power CMOS Technology:
- 1 mA active current, typical
- 1
μA
standby current, typical (I-temp)
• 2-Wire Serial Interface Bus, I
2
C™ Compatible
• Schmitt Trigger Inputs for Noise Suppression
• Output Slope Control to Eliminate Ground Bounce
• 400 kHz (≥ 2.5V): 24LCXX and 24AAXX
• 1 MHz (≥ 2.5V) and 400 kHz (1.7V): 24FCXX
• Self-Timed Write Cycle (including Auto-Erase)
• Page Write Buffer
• Hardware Write-Protect Available on Most
Devices
• Factory Programming (QTP) Available
• ESD Protection >4,000V
• 1 Million Erase/Write Cycles
• Data Retention >200 years
• 8-lead PDIP, SOIC, TSSOP and MSOP Packages
• 5-lead SOT-23 Package (Most 1-16 Kbit Devices)
• 8-lead 2x3mm and 5x6mm DFN Packages
Available
• Pb-Free and RoHS Compliant
• Available for Extended Temperature Ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
Description:
The Microchip Technology Inc. 24CXX, 24LCXX,
24AAXX and 24FCXX (24XX*) devices are a family of
128-bit through 1024 Kbit Electrically Erased PROMs.
The devices are organized in blocks of x8-bit memory
with 2-wire serial interfaces. Low-voltage design
permits operation down to 1.7V (for 24AAXX devices),
with standby and active currents of only 1
μA
and 1
mA, respectively. Devices 1 Kbit and larger have page
write capability. Parts having functional address lines
allow connection of up to 8 devices on the same bus.
The 24XX family is available in the standard 8-pin
PDIP, surface mount SOIC, TSSOP and MSOP pack-
ages. Most 128-bit through 16 Kbit devices are also
available in the 5-lead SOT-23 package. DFN
packages (2x3mm or 5x6mm) are also available. All
packages are Pb-free (Matte Tin) finish.
Note:
This document is an overview. For
detailed specifications, please consult the
individual product data sheet, available at
www.microchip.com.
*24XX is used in this document as a generic part
number for 24 series devices in this data sheet.
24XX64, for example, represents all voltages of the 64
Kbit device.
Package Types
(1)
PDIP/SOIC
A0
A1
A2
V
SS
1
2
3
4
8
7
6
5
V
CC
WP
(3)
TSSOP/MSOP
(2)
A0
A1
A2
V
SS
1
2
3
4
8
7
6
5
V
CC
WP
(3)
SCL
SDA
Note 1:
SCL
V
SS
SDA
SOT-23-5
(24XX00)
1
2
3
4
NC
5
V
CC
SCL
SDA
SOT-23-5
(all except 24XX00)
SCL
V
SS
SDA
1
2
3
4
V
CC
5
WP
A0 1
A1 2
A2 3
V
SS
4
DFN
8 V
CC
7 WP
(3)
6 SCL
5 SDA
2:
3:
Pins A0, A1, A2 and WP are not used by some
devices (no internal connections). See Table 1-1,
Device Selection Table, for details.
Pins A0 and A1 are no-connects for the 24XX128
and 24XX256 MSOP devices.
Pin 7 is “not used” for 24XX00, 24XX025 and
24C01C.
©
2007 Microchip Technology Inc.
DS21930C-page 1

 
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