EEPROM
Austin Semiconductor, Inc.
128K x 32 EEPROM
EEPROM Memory Array
AVAILABLE AS MILITARY
SPECIFICATIONS
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•
•
•
•
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•
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AS8E128K32
PIN ASSIGNMENT
(Top View)
66 Lead PGA
(Pins 8, 21, 28, 39 are no connects on the PN package)
SMD 5962-94585
MIL-STD-883
Access times of 120, 125, 140, 150, 200, 250, and 300 ns
Built in decoupling caps for low noise operation
Organized as 128K x32; User configurable
as 256K x16 or 512K x8
Operation with single 5 volt supply
Low power CMOS
TTL Compatible Inputs and Outputs
Operating Temperature Ranges:
Military: -55
o
C to +125
o
C
Industrial: -40
o
C to +85
o
C
FEATURES
66 Lead PGA
(Pins 8, 21, 28, 39 are grounds on the P package)
OPTIONS
•
MARKINGS
-12
-125
-14
-15
-20
-25
-30
Q
P
PN
No. 703
No. 904
No. 904
•
Timing
120 ns (contact factory)
125 ns
140 ns
150 ns
200 ns
250 ns
300 ns
Package
Ceramic Quad Flat pack
Pin Grid Array- 8 Series
Pin Grid Array- 8 Series
68 Lead CQFP
3
4
GENERAL DESCRIPTION
The Austin Semiconductor, Inc. AS8E128K32 is a 4 Megabit
EEPROM Module organized as 128K x 32 bit. User configurable to
256K x16 or 512Kx 8. The module achieves high speed access, low
power consumption and high reliability by employing advanced CMOS
memory technology.
The military grade product is manufactured in compliance to the
SMD and MIL-STD 883, making the AS8E128K32 ideally suited for
military or space applications.
The module is offered in a 1.075 inch square ceramic pin grid
array substrate. This package design provides the optimum space
saving solution for boards that accept through hole packaging.
The module is also offered as a 68 lead 0.990 inch (lead tip to lead
tip) square ceramic quad flat pack. It has a max. height of 0.200 inch.
This package design is targeted for those applications which require
low profile SMT Packaging.
For more products and information
please visit our web site at
www.austinsemiconductor.com
AS8E128K32
Rev. 5.0 8/00
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
1
EEPROM
Austin Semiconductor, Inc.
DEVICE IDENTIFICATION
An extra 128 bytes of EEPROM memory is available on each
die for user identification. By raising A9 to 12V + 0.5V and using
address locations 1FF80H to 1FFFFH the bytes may be written to
or read from in the same manner as the regular memory array.
AS8E128K32
of the last byte written will result in the complement of the written
data to be presented on I/O7. Once the write cycle has been com-
pleted, true data is valid on all outputs, and the next write cycle may
begin. DATA Polling may begin at anytime during the write cycle.
TOGGLE BIT
DEVICE OPERATION
The 128K x 32 EEPROM memory solution is an electrically
erasable and programmable memory module that is accessed like a
Static RAM for the read or write cycle without the need for external
components. The device contains a 128-byte-page register to allow
writing of up to 128 bytes of data simultaneously. During a write
cycle, the address and 1 to 128 bytes of data are internally latched,
freeing the address and data bus for other operations. Following the
initiation of a write cycle, the device will automatically write the
latched data using an internal control timer. The end of a write cycle
can be detected by DATA polling of I/O7. Once the end of a write
cycle has been detected a new access for a read or write can begin.
In addition to DATA Polling the module provides another method
for determining the end of a write cycle. During the write operation,
successive attempts to read data from the device will result in I/O6 of
the accessed die toggling between one and zero. Once the write has
completed, I/O6 will stop toggling and valid data will be read. Reading
the toggle bit may begin at any time during the write cycle.
DATA PROTECTION
If precautions are not taken, inadvertent writes may occur during
transitions of the host power supply. The E
2
module has incorpo-
rated both hardware and software features that will protect the memory
against inadvertent writes.
READ
The memory module is accessed like a Static RAM. When CE\
and OE\ are low and WE\ is High, the data stored at the memory
location determined by the address pins is asserted on the outputs.
The module can be read as a 32 bit, 16 bit or 8 bit device. The outputs
are put in the high impedance state when either CE\ or OE\ is high.
This dual-line control gives designers flexibility in preventing bus
contention in their system.
HARDWARE PROTECTION
Hardware features protect against inadvertent writes to the mod-
ule in the following ways: (a) Vcc sense - if Vcc is below 3.8 V
(typical) the write function is inhibited; (b) Vcc power-on delay -
once Vcc has reached 3.8 V the device will automatically time out 5 ms
(typical) before allowing a write; (c) write inhibit - holding any one of
OE\ low, CE\ high or WE\ high inhibits write cycles; (d) noise filter -
pulses of less than 15 ns (typical) on the WE\ or CE\ inputs will not
initiate a write cycle.
BYTE WRITE
A low pulse on the WE\ or CE\ input with CE\ or WE\ low
(respectively) and OE\ high initiates a write cycle. The address is
latched on the falling edge of CE\ or WE\, whichever occurs last. The
data is latched by the first rising edge of CE\ or WE\. Once a BWDW
(byte, word or double word) write has been started it will automati-
cally time itself to completion.
SOFTWARE DATA PROTECTION
A software controlled data protection feature has been imple-
mented on the memory module. When enabled, the software data
protection (SDP), will prevent inadvertent writes. The SDP feature
may be enabled or disabled by the user and is shipped with SDP
disabled, SDP is enabled by the host system issuing a series of three
write commands; three specific bytes of data are written to three
specific addresses (refer to Software Data Protection Algorithm). After
writing the three byte command sequence and after t
WC
the entire
module will be protected from inadvertent write operations. It should
be noted, that once protected the host may still perform a byte of page
write to the module. This is done by preceding the data to be written
by the same three byte command sequence used to enable SDP. Once
set, SDP will remain active unless the disable command sequence is
issued. Power transitions do not disable SDP and SDP will protect
the 128K x 32 EEPROM during power-up and Power-down condi-
tions. All command sequences must conform to the page write timing
specifications. The data in the enable and disable command sequences
is not written to the device and the memory addresses used in the
sequence may be written with data in either a byte or page write
operation.
After setting SDP, any attempt to write to the device without the
three byte command sequence will start the internal write timers. No
data will be written to the device; however, for the duration of t
WC
,
read operations will effectively be polling operations.
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
PAGE WRITE
The page write operation of the 128K x 32 EEPROM allows 1 to
128 BWDWs of data to be written into the device during a single
internal programming period. Each new BWDW must be written
within 150-µ sec (t
BLC
) of the previous BWDW. If the t
BLC
limit is
exceeded the memory module will cease accepting data and commence
the internal programming operation. For each WE high to low transi-
tion during the page write operation, A7-A16 must be the same.
The A0-A6 inputs are used to specify which bytes within the
page are to be written. The bytes may be loaded in any order and may
be altered within the same load period. Only bytes which are speci-
fied for writing will be written; unnecessary cycling of other bytes
within the page does not occur.
DATA POLLING
This memory module features DATA Polling to indicate the end
of a write cycle. During a byte or page write cycle an attempted read
AS8E128K32
Rev. 5.0 8/00
2
EEPROM
Austin Semiconductor, Inc.
ABSOLUTE MAXIMUM RATINGS*
Voltage on Vcc Supply Relative to Vss
Vcc ..............................................................................-.5V to +7.0V
Storage Temperature ....................... ....................-65°C to +150°C
Short Circuit Output Current (per I/O)….............................20mA
Voltage on any Pin Relative to Vss.....................-.5V to Vcc+1 V
Max Junction Temperature**.............................................+150°C
Thermal Resistance junction to case (θ
JC
):
Package Type Q...............................................11.3° C/W
Package Type P & PN.......................................2.8° C/W
AS8E128K32
*Stresses greater than those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the
operation section of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods
may affect reliability.
**Junction temperature depends upon package type, cycle time,
loading, ambient temperature and airflow, and humidity (plas-
tics).
ELECTRICAL CHARACTERISTICS AND RECOMMENDED DC OPERATING CONDITIONS
(-55
o
C<T
A
<125
o
C or -40
o
C to +85
o
C; Vcc = 5V + 10%)
''" !
µΑ
µΑ
( )
)
(
(* * +*,-.
( )
)
/ 01#
/ 1#
0
0
0
23
PARAMETER
Power Supply Current:
Operating
CONDITIONS
CE\<V
IL
; V
CC
=MAX,
f = MAX = 1/t
RC
(MIN)
Outputs Open
CE\>V
IH
; All Other Inputs
<V
IL
or >V
IH
; V
CC
=MAX,
f =0 Hz
CE\>V
CC
-0.2V; V
CC
=MAX,
V
IL
<V
SS
+0.2V or
V
IH
>V
CC
-0.2V; f = 0 Hz
CE\=V
CC
, OE\=V
IH
;
I/O 0 through 31 = open;
Input=V
CC
=5.5Vdc.;
A0 through A16 change at 5 MHz;
CMOS levels
MAX
SYM For All Speed Options UNITS
I
cc
250
mA
I
SBT1
15
mA
Power Supply Current:
Standby
I
SBT2
1
mA
I
SBT3
5
mA
AS8E128K32
Rev. 5.0 8/00
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
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