Bus Driver, AC Series, 2-Func, 4-Bit, True Output, CMOS, CDFP20, CERAMIC, DFP-20
| 参数名称 | 属性值 |
| 包装说明 | , |
| Reach Compliance Code | unknown |
| 系列 | AC |
| JESD-30 代码 | R-CDFP-F20 |
| JESD-609代码 | e4 |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 4 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 传播延迟(tpd) | 9 ns |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | FLAT |
| 端子位置 | DUAL |
| 总剂量 | 300k Rad(Si) V |
| Base Number Matches | 1 |
| 5962F9854101VXC | ACS244KMSR-02 | ACS244DMSR-02 | 5962F9854101VRC | ACS244K/SAMPLE-02 | ACS244D/SAMPLE-02 | ACS244HMSR-02 | |
|---|---|---|---|---|---|---|---|
| 描述 | Bus Driver, AC Series, 2-Func, 4-Bit, True Output, CMOS, CDFP20, CERAMIC, DFP-20 | Bus Driver, AC Series, 2-Func, 4-Bit, True Output, CMOS, CDFP20 | Bus Driver, AC Series, 2-Func, 4-Bit, True Output, CMOS, CDIP20 | Bus Driver, AC Series, 2-Func, 4-Bit, True Output, CMOS, CDIP20 | Bus Driver, AC Series, 2-Func, 4-Bit, True Output, CMOS, CDFP20 | Bus Driver, AC Series, 2-Func, 4-Bit, True Output, CMOS, CDIP20 | Bus Driver, AC Series, 2-Func, 4-Bit, True Output, CMOS |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| 系列 | AC | AC | AC | AC | AC | AC | AC |
| JESD-30 代码 | R-CDFP-F20 | R-CDFP-F20 | R-CDIP-T20 | R-CDIP-T20 | R-CDFP-F20 | R-CDIP-T20 | X-XUUC-N22 |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 22 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED |
| 封装形式 | FLATPACK | FLATPACK | IN-LINE | IN-LINE | FLATPACK | IN-LINE | UNCASED CHIP |
| 传播延迟(tpd) | 9 ns | 9 ns | 9 ns | 9 ns | 9 ns | 9 ns | 9 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | NO | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | UPPER |
| JESD-609代码 | e4 | e0 | e0 | e4 | - | - | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | - | - | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | - | - | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | - | - | - |
| 端子面层 | GOLD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | GOLD | - | - | - |
| 总剂量 | 300k Rad(Si) V | 300k Rad(Si) V | 300k Rad(Si) V | 300k Rad(Si) V | - | - | - |
| 厂商名称 | - | Harris | Harris | Harris | Harris | Harris | Harris |
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