FCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDFP16, CERAMIC, FP-16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DFP, FL16,.3 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 其他特性 | 3 ENABLE INPUTS |
| 系列 | FCT |
| JESD-30 代码 | R-GDFP-F16 |
| JESD-609代码 | e0 |
| 长度 | 9.6645 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER |
| 最大I（ol） | 0.032 A |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装等效代码 | FL16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 12 ns |
| 传播延迟（tpd） | 12 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B |
| 座面最大高度 | 2.032 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 6.604 mm |
| Base Number Matches | 1 |
| 54FCT138FMQB | 5962-87654012A | 5962-8765401EA | 54FCT138LMQB | 54FCT138MW8 | 5962-8765401FA | 54FCT138DMQB | 54FCT138DM | |
|---|---|---|---|---|---|---|---|---|
| 描述 | FCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDFP16, CERAMIC, FP-16 | FCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20 | FCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDIP16, CERDIP-16 | FCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20 | FCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, UUC, WAFER | FCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDFP16, CERPACK-16 | FCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDIP16, CERAMIC, DIP-16 | FCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDIP16, CERDIP-16 |
| 包装说明 | DFP, FL16,.3 | QCCN, LCC20,.35SQ | DIP, DIP16,.3 | QCCN, LCC20,.35SQ | DIE, | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | 3 ENABLE INPUTS | 3 ENABLE INPUTS | 3 ENABLE INPUTS | 3 ENABLE INPUTS | 3 ENABLE INPUTS | 3 ENABLE INPUTS | 3 ENABLE INPUTS | 3 ENABLE INPUTS |
| 系列 | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT |
| JESD-30 代码 | R-GDFP-F16 | S-CQCC-N20 | R-GDIP-T16 | S-CQCC-N20 | X-XUUC-N | R-GDFP-F16 | R-GDIP-T16 | R-GDIP-T16 |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | QCCN | DIP | QCCN | DIE | DFP | DIP | DIP |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | CHIP CARRIER | IN-LINE | CHIP CARRIER | UNCASED CHIP | FLATPACK | IN-LINE | IN-LINE |
| 传播延迟（tpd） | 12 ns | 12 ns | 12 ns | 12 ns | 12 ns | 12 ns | 12 ns | 12 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | UPPER | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | - | - | 不符合 | 不符合 |
| JESD-609代码 | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 |
| 长度 | 9.6645 mm | 8.89 mm | 19.43 mm | 8.89 mm | - | 9.6645 mm | 19.43 mm | 19.43 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | - | 50 pF | 50 pF | 50 pF |
| 最大I（ol） | 0.032 A | 0.032 A | 0.032 A | 0.032 A | - | 0.032 A | 0.032 A | 0.032 A |
| 端子数量 | 16 | 20 | 16 | 20 | - | 16 | 16 | 16 |
| 封装等效代码 | FL16,.3 | LCC20,.35SQ | DIP16,.3 | LCC20,.35SQ | - | FL16,.3 | DIP16,.3 | DIP16,.3 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 12 ns | 12 ns | 12 ns | 12 ns | - | 12 ns | 12 ns | 12 ns |
| 筛选级别 | MIL-STD-883 Class B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | MIL-STD-883 Class B | - | 38535Q/M;38534H;883B | MIL-STD-883 Class B | - |
| 座面最大高度 | 2.032 mm | 1.905 mm | 5.08 mm | 1.905 mm | - | 2.032 mm | 5.08 mm | 5.08 mm |
| 端子面层 | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) | - | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | - | 1.27 mm | 2.54 mm | 2.54 mm |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 6.604 mm | 8.89 mm | 7.62 mm | 8.89 mm | - | 6.604 mm | 7.62 mm | 7.62 mm |
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