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347985-6

产品描述SOCKET, DIP50, IC SOCKET
产品类别连接器    插座   
文件大小106KB,共1页
制造商TE Connectivity(泰科)
官网地址http://www.te.com
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347985-6概述

SOCKET, DIP50, IC SOCKET

347985-6规格参数

参数名称属性值
Reach Compliance Codeunknown
ECCN代码EAR99
联系完成配合GOLD FLASH
联系完成终止TIN LEAD OVER NICKEL
设备插槽类型IC SOCKET
使用的设备类型DIP50
JESD-609代码e0
制造商序列号347985
触点数50
Base Number Matches1

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347985-6
T E I nternal N umber: 3 4 7 9 8 5 - 6
Product Highlights:
l
DIP Socket
l
Number of Positions = 50
l
Row-to-Row Spacing = 15.24 mm
l
Through Hole C ontact Termination Type
l
Mount Style = Vertical
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Product Drawings:
l
None Available
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l
None Available
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l
None Available
Application Specifications:
l
None Available
Instruction Sheets:
l
None Available
CAD Files:
l
None Available
Additional Information:
l
Product Line Information
Related Products:
l
Tooling
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
l
Product Type
= DIP Socket
l
Number of Positions
= 50
l
Profile = Standard
l
Frame Style
= Ladder
l
Leg Style
= Straight
Electrical Characteristics:
l
Insulation Resistance (M?) = 10,000
l
C ontact Resistance (m?) = 30
Termination Related Features:
l
Termination Post Length (mm [in])
= 2.84 [0.112]
l
Solder Tail C ontact Plating = Tin-Lead over Nickel
Body Related Features:
l
Row-to-Row Spacing (mm [in])
= 15.24 [0.600]
l
Mount Style
= Vertical
l
C enterline (mm [in])
= 2.54 [0.100]
Contact Related Features:
l
C ontact Termination Type
= Through Hole
l
C ontact Base Material
= Beryllium C opper
l
C ontact Mating Area Plating Material
= Gold Flash
l
C ontact Style
= Screw Machine
l
Mating C ontact Type
= Inner Spring
Configuration Related Features:
l
Height Above PC Board (mm [in])
= 2.80 [0.110]
Industry Standards:
l
RoHS/ELV C ompliance
= Not reviewed for ELV/RoHS compliance
l
Lead Free Solder Processes
= Not reviewed for lead free solder
process
Conditions for Usage:
l
Temperature Range (?C ) = 105
Packaging Related Features:
l
Packaging Method
= Tube
Other:
l
Brand = AMP
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2009 Tyco Electronics C orporation All Rights Reserved
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