IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | ON Semiconductor(安森美) |
包装说明 | SON, SOLCC8,.12,25 |
Reach Compliance Code | compliant |
数据保留时间-最小值 | 100 |
耐久性 | 1000000 Write/Erase Cycles |
I2C控制字节 | 1010000R |
JESD-30 代码 | R-PDSO-N8 |
内存密度 | 2048 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 8 |
端子数量 | 8 |
字数 | 256 words |
字数代码 | 256 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 256X8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SON |
封装等效代码 | SOLCC8,.12,25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | SERIAL |
电源 | 5 V |
认证状态 | Not Qualified |
串行总线类型 | I2C |
最大待机电流 | 0.00006 A |
最大压摆率 | 0.003 mA |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | NO LEAD |
端子节距 | 0.635 mm |
端子位置 | DUAL |
写保护 | SOFTWARE |
Base Number Matches | 1 |
CAT1023ZD4I-45-GT2 | CAT1023ZD4I-42-GT2 | CAT1023ZD4I-28-GT2 | CAT1021ZD4I-30-GT2 | CAT1022ZD4I-30-GT2 | CAT1022ZD4I-45-GT2 | CAT1021ZD4I-28-GT2 | CAT1022ZD4I-25-GT2 | CAT1022ZD4I-28-GT2 | |
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描述 | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
数据保留时间-最小值 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
I2C控制字节 | 1010000R | 1010000R | 1010000R | 1010000R | 1010000R | 1010000R | 1010000R | 1010000R | 1010000R |
JESD-30 代码 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 |
内存密度 | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
字数代码 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SON | SON | SON | SON | SON | SON | SON | SON | SON |
封装等效代码 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
电源 | 5 V | 5 V | 3.3 V | 3.3 V | 3.3 V | 5 V | 3.3 V | 3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
最大待机电流 | 0.00006 A | 0.00006 A | 0.00006 A | 0.00006 A | 0.00006 A | 0.00006 A | 0.00006 A | 0.00006 A | 0.00006 A |
最大压摆率 | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 3.3 V | 3.3 V | 3.3 V | 5 V | 3.3 V | 3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
写保护 | SOFTWARE | SOFTWARE | SOFTWARE | HARDWARE | SOFTWARE | SOFTWARE | HARDWARE | SOFTWARE | SOFTWARE |
包装说明 | SON, SOLCC8,.12,25 | - | SON, SOLCC8,.12,25 | SON, SOLCC8,.12,25 | SON, SOLCC8,.12,25 | - | SON, SOLCC8,.12,25 | SON, SOLCC8,.12,25 | SON, SOLCC8,.12,25 |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - | - |
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