Multiplexer, F/FAST Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, TTL, CDIP16, CERAMIC, DIP-16
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Fairchild |
| 零件包装代码 | DIP |
| 包装说明 | CERAMIC, DIP-16 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 系列 | F/FAST |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.43 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER |
| 最大I（ol） | 0.02 A |
| 功能数量 | 1 |
| 输入次数 | 8 |
| 输出次数 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 最大电源电流（ICC） | 22 mA |
| Prop。Delay @ Nom-Sup | 9 ns |
| 传播延迟（tpd） | 9 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 54F251ADMQB | 54F251ALL | 54F251ALLQB | 54F251AFM | 54F251AFMQB | 54F251ADM | |
|---|---|---|---|---|---|---|
| 描述 | Multiplexer, F/FAST Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, TTL, CDIP16, CERAMIC, DIP-16 | Multiplexer, F/FAST Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, TTL, CQCC20, | Multiplexer, F/FAST Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, TTL, CQCC20, | Multiplexer, F/FAST Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, TTL, CDFP16, CERPACK-16 | Multiplexer, F/FAST Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, TTL, CDFP16, CERPACK-16 | Multiplexer, F/FAST Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, TTL, CDIP16, CERAMIC, DIP-16 |
| 包装说明 | CERAMIC, DIP-16 | QCCN, | QCCN, | DFP, | DFP, FL16,.3 | CERAMIC, DIP-16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | compliant | compliant |
| 系列 | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 代码 | R-GDIP-T16 | S-CQCC-N20 | S-CQCC-N20 | R-GDFP-F16 | R-GDFP-F16 | R-GDIP-T16 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输入次数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 输出次数 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 20 | 20 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | QCCN | QCCN | DFP | DFP | DIP |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | FLATPACK | FLATPACK | IN-LINE |
| 最大电源电流（ICC） | 22 mA | 22 mA | 22 mA | 22 mA | 22 mA | 22 mA |
| 传播延迟（tpd） | 9 ns | 9 ns | 9 ns | 9 ns | 9 ns | 9 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | YES | NO |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | NO LEAD | NO LEAD | FLAT | FLAT | THROUGH-HOLE |
| 端子位置 | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 零件包装代码 | DIP | - | - | DFP | DFP | DIP |
| 针数 | 16 | - | - | 16 | 16 | 16 |
| 长度 | 19.43 mm | - | - | 9.6645 mm | 9.6645 mm | 19.43 mm |
| 座面最大高度 | 5.08 mm | - | - | 2.032 mm | 2.032 mm | 5.08 mm |
| 端子节距 | 2.54 mm | - | - | 1.27 mm | 1.27 mm | 2.54 mm |
| 宽度 | 7.62 mm | - | - | 6.604 mm | 6.604 mm | 7.62 mm |
模拟与混合信号
FPGA/CPLD
嵌入式系统
微控制器 MCU
嵌入式系统
微控制器 MCU
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