TTL/H/L SERIES, HEX 1-BIT DRIVER, TRUE OUTPUT, CDFP16, CERAMIC, FP-16
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DFP |
| 包装说明 | CERAMIC, FP-16 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 系列 | TTL/H/L |
| JESD-30 代码 | R-GDFP-F16 |
| JESD-609代码 | e0 |
| 长度 | 10.2 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 1 |
| 功能数量 | 6 |
| 端口数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 传播延迟(tpd) | 22 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class Q |
| 座面最大高度 | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 6.73 mm |
| Base Number Matches | 1 |
| 5962-9687803QFA | 5962-9687804QEA | 5962-9687803QEA | 5962-9687804QFA | |
|---|---|---|---|---|
| 描述 | TTL/H/L SERIES, HEX 1-BIT DRIVER, TRUE OUTPUT, CDFP16, CERAMIC, FP-16 | TTL/H/L SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, CDIP16, CERAMIC, DIP-16 | TTL/H/L SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16 | TTL/H/L SERIES, HEX 1-BIT DRIVER, INVERTED OUTPUT, CDFP16, CERAMIC, FP-16 |
| 零件包装代码 | DFP | DIP | DIP | DFP |
| 包装说明 | CERAMIC, FP-16 | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, |
| 针数 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknown | not_compliant | not_compliant | unknown |
| 系列 | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L |
| JESD-30 代码 | R-GDFP-F16 | R-GDIP-T16 | R-GDIP-T16 | R-GDFP-F16 |
| 长度 | 10.2 mm | 19.56 mm | 19.56 mm | 10.2 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 1 | 4 | 4 | 1 |
| 功能数量 | 6 | 2 | 2 | 6 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | INVERTED | TRUE | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | DIP | DIP | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | IN-LINE | FLATPACK |
| 传播延迟(tpd) | 22 ns | 17 ns | 22 ns | 17 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class Q | MIL-STD-883 | MIL-STD-883 | MIL-PRF-38535 Class Q |
| 座面最大高度 | 2.03 mm | 5.08 mm | 5.08 mm | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES |
| 技术 | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 6.73 mm | 7.62 mm | 7.62 mm | 6.73 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
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